Mark Mobley 951-***-**** cell • **********@**********.*** • LinkedIn Profile
Component Engineer
A highly multifaceted and progressive career marked by technical innovation and leadership across diverse industries, with a deep focus on component and quality engineering, detail-oriented analyses, and proactive problem-solving.
Skills and Core Competencies
Component Engineering: Extensive experience in Semiconductor, FPGAs, Etc., and Passive, and Connector parts management. Includes: verification, parts selection/application, Test, Qualification, HALT, PCBA/SMT/FAI processing support, Semiconductor Product Engineer, and DPA.
Quality Assurance, Lead Assessor: Have audited semiconductor/part companies: Analog Devices, Samsung, Texas Instruments, Micron, Molex, Kemet, Rosenberger, Amphenol, etc.
Project Management: Ability to work conjointly with Design, Procurement, Reliability, Quality, and Manufacturing, etc.
Technical Innovation: Recipient of a Technical Innovation Award, for innovation and technology. Example - Copy Right to new Quality Tool currently not used in industry. Set up and ran a Failure Analysis lab at one company, SEM, EDS, etc.
Six Sigma Black Belt/DMAIC: Lean Six Sigma Black Belt with expertise in DMAIC methodology for process improvement.
Have experience with GIDEPs (many) and NASA Space Advisory.
Professional Career
Hamilton Sundstrand Space Systems at Collins Aerospace Houston, Tx.
Principle Component Engineer 9/2023 – 6/2024
Supporting MIL/Space Part requirements, Sourcing, etc. for ISS and Xemu
Search for needed parts to meet DEV requirements.
Participate in part/system level reviews.
Participated in part drawing reviews, needed to ensure part requirements are met.
They closed out the Xemu project, another project was shut down due to budget, etc.
Lockheed Martin, Huntsville, Al. 2019 - 2023
Component Engineer, Staff - EEE Engineer PMP, HCSW/THADD Programs (2018 – 2023)
•Garnered Technical Innovation Award in 2022, presented by the Executive VP of Lockheed Martin Space.
•Effectively reviewed and endorsed Parts, Materials, Processes (PMP), and technical drawings, bolstering their utilization and presentation to client engineering teams.
•Assiduously ensured all contractors and suppliers strictly adhered to PMP application standards.
•Collaborated adeptly with procurement to secure necessary parts lists and Bill of Materials (BOMs) from each contractor and supplier for a thorough review and definitive approval.
•Successfully integrated approved parts, materials, and process requests into the Lockheed Martin PMP database, ensuring comprehensive record-keeping.
•Diligently reviewed part Qualification Results to verify compliance with stringent MIL level standards.
•Leveraged extensive FA Lab experience to pinpoint and address electrical/mechanical failures, specializing in Semiconductor FA, passive part FA, and Materials Analysis.
•Secret Clearance
Lockheed Martin, Grand Prairie, Tx. 2018 - 2019
Component Engineer Contract
•Collaborated effectively with suppliers to support Lockheed Martin's part needs for PAC3, including the comprehensive review and assessment of parts, specifications, and plating requirements.
•Rigorously examined part supplier Source Control Drawings (SCD), verified supplier identities and acceptability (SID), and confirmed parts against potential application areas, ensuring Geometric Dimensioning & Tolerance (GD&T) criteria were satisfied for sourcing and application requirements.
•Engaged proactively with suppliers to obtain vital part materials and plating information, assuring their alignment with stringent Military, SAE, ASM/EDFAS, IPC, PMPCP standards and PMP requirements.
•Utilized manufacturer resources over outside contractors where possible, dramatically reducing costs and receipt times and thus streamlining the supply chain.
Nokia 2014 – 2017
Lead Technical Component Engineer R&D 4 – CONNECTORS/CABLES
•As a Corporate Lead Engineer – RF/Digital Connectors, providing comprehensive support to global Component Engineers, R&D/RF/Elect./Mechanical Design, Product Engineering, Manufacturing Groups, Suppliers, and Buyers in Nokia's Connector Components sector.
•Executed corporate-wide approvals for New Part Selection/Part Replacement/New Technology FO/EO and New Materials, achieving significant cost savings of over 750K Euro from January through June 2017 without compromising application reliability. Notable examples include Connector 4.3-10 and its variants.
•Collaborated with EE Part Engineering sectors to resolve intricate part issues, such as EOS and ESD challenges, optimizing part performance and reliability.
•Engaged actively with European and Asian suppliers, including key partners like Rosenberger of Fridolfing, Germany, to meet business needs.
•Provided hands-on support during site visits to Nokia Engineering facilities in the USA, Finland, Germany, China, and other locations as required.
•Played a pivotal role in assessing potential suppliers in Europe and Asia, ensuring high-quality part sourcing.
•Diligently supported environmental compliance with ROHS/WEEE regulations, demonstrating a commitment to sustainable business practices.
GE Hitachi Nuclear Energy – I&C Engineering Group 2012 – 2013
System, Component IC Engineer (contract)
•Provided critical R&D support for the Lungman (Dragon Gate) Program, a high-profile Taiwan Project, demonstrating adaptability in various technological environments.
•Enhanced technical expertise by undergoing intensive training in Nuclear Engineering Procedures & NRC 10 CFR 21, amplifying competency in nuclear technology.
•Issued Engineering Change Orders (ECOs) and identified essential electronic components for utilization in complex reactor control instrumentation.
•Acquired specialized training in nuclear reactor systems, further broadening nuclear technology proficiency.
•Adapted to project termination due to Taiwan's cancellation, showcasing resilience and readiness for future opportunities.
Areas of Expertise
Component/Parts/Management – Semiconductor Product Engineer, Set up and ran FA Lab, trained FA Techs - Failure Analysis; PWAs & Components - Scanning Electron Microscopy/Energy Dispersive X-ray Spectroscopy & Fourier Transform Infrared Spectroscopy - Designed Test Hardware - Electronic Bench Test - Oscilloscope/Signal Generator, LCR, Curve Tracer - Part/Process Characterization - Statistical Process Control - Data Analysis - Electrical and Electronic Equipment-Used HALT for the identification of best parts – PCBA/SMT/FAI Manufacturing Support Component Obsolescence – DPA - Component Test Verification - Part Selection/Application - Schematic Capture/Review – Bench or Automated Test Equipment - Digital/Analog Design - Alternate Sourcing - Provide Technical Support - Design reviews/Development - Military Standard-883, Military Standard-750 Qualification - Component Specifications - Define, Measure, Analyze, Improve and Control - Electrical/Mechanical Drawing Review Q-Star/Silicon Expert - Yield Analysis/Improvement - Manufacturing Support - ISO 9000, AS 9100 - Engineering Change Notice, Bill of Materials Support - Microsoft Word/Excel/SAP/Agile - Electrical/Mechanical Failure Analysis - 21 Code of Federal Regulations-820/ISO 13485 - Verify Platings/Porosity - Supplier Development - Qualification/Part Database Management - Gauge/Dimensions, Can come up on Python and LabView. HALT – for best part selection
Education
Brigham Young University, Provo, UT Bachelor of Science in Electronics Engineering Technology with a major in RF Electronics
Lean Six Sigma Black Belt Class Certificate, DMAIC – Villanova University., Web Class
Certifications
ISTQB Certification, Software Testing, CTFL – 12-CTFL-00214- Anaheim, CA., USA
Lead Assessor of Quality Systems Course, Certification, Governing Board of National Registration Scheme for Assessors of Quality Systems, Course No. A4252