BOOPATHI.S

**/** *** *****

Soolai,Veerappan Chatram(po)

Erode 638004, Tamilnadu.

Telephone +918*********

adzwp5@r.postjobfree.com

CAREER OBJECTIVE:

PCB DESIGN ENGINEER

Objective To apply my knowledge and 3 years’ experience in PCB designing and to develop efficient and effective systems using my skills in Altium, Cadence Allegro V16.2, and Allegro V17.4 in meeting company's needs.

WORK EXPERIENCE:

• SENIOR PCB DESIGN ENGINEER

GALAXI ENGINEERING TECHNOLOGY SERVICES PVT LTD DOJ-SEP/2022 IT service-based PCB DESIGN SERVICE Company

Mysore, Karnataka.

• PCB DESIGN ENGINEER

DATASHRUBS SOLUTION PVT LTD

IT service-based PCB DESIGN SERVICE

Company

Bengaluru, Karnataka.

DOJ-Jan/2021

DOR-SEP/202

1 year 9 months

• QA ENGINEER

REAL TECH SYSTEMS

Electronics Assembly And Manufacturing.

Erode, Tamilnadu.

DOJ - July 2019

DOR -Dec 2020

1 Year 6 month

• ASSEMBLY AND TESTING

REAL TECH SYSTEMS

Electronics Assembly and Manufacturing.

Erode, Tamilnadu.

DOJ - July 2017

DOR -June 2019

2 Year’s

FAMILIAR TOOLS:

• ALTIUM • CAM350

• CADENCE 16.6

• CADENCE 17.4

MAJOR PROJECT

• GIMBAL CONTROLLER- CADENCE 17.4

DESCRIPTION:10 layers,600+ component,1065 connection Design being High speed interface with Major High- speed interfaces interacts with external devices like ETHERNET, USB2.0, eMMC-NAND FLASH,SRAM. ACTIVITY: Schematic capture, Footprint creation, Placement, routing, Length matching, Gerber and CAM Check.

• LOW END ACB- CADENCE 16.6

DESCRIPTION:6 layers.450+ Component,1084 connection Design interface with external devices like ETHERNET, USB2.0. ACTIVITY: Schematic capture, Footprint creation, Placement, routing, Length matching, Gerber and CAM Check.

• SMART WATER BOTTLE- ALTIUM 19.1.0

DESCRIPTION: 4 layers Design being with Bluetooth module, RF section and Flash memory. ACTIVITY: Schematic capture, Footprint creation, Placement, routing, Length matching, Gerber and CAM Check.

• GRID INVERTER POWER BOARD 10KW-CADENCE 17.4

DESCRIPTION: 6 layers Design being High Power Mosfet with DC and AC power Guidelines. ACTIVITY: Schematic capture, Footprint creation, Placement, routing, Length matching, Gerber and CAM Check.

• IPVG- CADENCE 16.6.

DESCRIPTION: 8 layers,700+ Component,1764 Connection Design being High speed interface with ETHERNET, eMMC- NAND FLASH,SRAM.

ACTIVITY: Schematic capture, Footprint creation, Placement, routing, Length matching, Gerber and CAM Check.

• IITB- CADENCE 16.6

DESCRIPTION: 8 layers Design.600+ Component,1560 Connection being High speed interface with Four DDR3-Memory, Major High- speed interfaces interacts with external devices like ETHERNET, USB2.0, eMMC-NAND FLASH,SRAM. ACTIVITY: Schematic capture, Footprint creation, Placement, routing, Length matching, Gerber and CAM Check.

• KU BAND- CADENCE 17.4

DESCRIPTION:10 layers,400+ component,1000 connection Design being with Major High- speed interfaces interacts with external devices like ETHERNET, USB2.0, eMMC-NAND FLASH,SRAM. ACTIVITY: Schematic capture, Footprint creation, Placement, routing, Length matching, Gerber and CAM Check.

• 5G POWER BOARD- CADENCE 16.6

DESCRIPTION: 4 layers Design being with high power Mosfet and High voltage Component. ACTIVITY: Schematic capture, Footprint creation, Placement, routing, Length matching, Gerber and CAM Check.

• CHARLES POWER BOARD- CADENCE 17.4

DESCRIPTION: 8 layers Design being with high power Mosfet and High voltage Component. ACTIVITY: Schematic capture, Footprint creation, Placement, routing, Gerber and CAM Check.

• DIANA HIGH SPEED BOARD- ALTIUM

DESCRIPTION: 10 layers Design being with high Speed interface like Hyper Ram and Hyper Flash, Can and USB. ACTIVITY: Schematic capture, Footprint creation, Placement, routing, Length matching, Gerber and CAM Check.

• 60KW PROJECT PCB FOR EV- ALTIUM

DESCRIPTION: POWER BOARD-4 layers Design being with high power interface Infineon-MOSFET. DRIVER BOARD-6 Layer Design being with isolation circuit. CONTROLLER BOARD-6 Layer Design being with CAN, USB, CONTROLLER UNIT. Its MULTIBOARD Assembly Project.

ACTIVITY: Schematic capture, Footprint creation, Placement, routing, Length matching, Gerber and CAM Check.

• 5KW PROJECT PCB FOR EV-CADENCE 17.4

DESCRIPTION: POWER BOARD-4 layers Design being with high power interface Infineon-MOSFET. DRIVER BOARD-6 Layer Design being with isolation circuit. CONTROLLER BOARD-8 Layer Design being with CAN, USB, CONTROLLER UNIT. Its MULTIBOARD Assembly Project.

ACTIVITY: Schematic capture, Footprint creation, Placement, routing, Length matching, Gerber and CAM Check. ROLES & RESPONSIBILITIES:

• Developed component records that included schematic symbols.

• Prepared schematics and layout for multi-layer high speed PCB techniques.

• Designed layout and ensured that it met IPC and manufacturing requirements.

• Provided technical support to environmental management systems and ensured that policies and procedures were followed.

• Documented entire PCB layout and fabrication on the system.

• Provided technical support to environmental management systems and ensured that policies and procedures were followed.

• Aware of HighSpeed Signals Routing & Length Matching with peak tolerance like DDR2, DDR3, DDR4, PCIe, SD CARD, eMMC, HDMI, USB and ETHERNET interfaces.

• Interaction with Fabrication and Assembly houses for prototype fabrication.

• Resolving technical queries from component vendor.

• Expertise in Gerber verification.

• Team handling and customer handling.

EDUCATIONAL QUALIFICATION:

Qualification Institutions Year Percentage/CGPA

B.E (Electronics and

Communication

Engineering)

Excel College Of Engineering

And Technology.

2017

7.2%

Diploma Sri Ragavendra Polytechnic

College, Komarapalayam.

2014 93.39% - I class

SSLC Government Boys Higher

Secondary School, erode.

2011 54%

STRENGTHS:

• Eager to learn and improve constantly.

• Self-learner.

• Decision Making.

• Strong Customer Service Skills.

• Punctuality

PERSONAL INFORMATION:

Father’s name : Senthilkumar.C

Mother’s name : Annakkodi.S

Date of birth : 17-12-1995

Address : 49/20 MGR nagar, Soolai, Veerappan chatram (Po), Erode-638 004 Languages known : Tamil, Kannada, English

Hobbies : Playing Cricket, Cooking, playing logical games. DECLARATION:

I hereby declare that all the above said facts are true to my knowledge. Date: Yours faithfully,

(BOOPATHI.S)

Place:

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