Noel Solimen

Process Engineer

Livermore, CA ****0

adzp2k@r.postjobfree.com

+1-951-***-****

• A self-driven and team oriented professional with more than 13 years of process and equipment engineering experience in a semiconductor manufacturing environment.

• Continuously improving production equipment and processes by utilizing Lean Six Sigma principles and key statistical tools and engineering discipline, i.e. Root cause analysis, PFMEA, Why ~ why, DMAIC, CAPA.DOE/JMP, SPC, 8D.

• An active team player with a proven track record of achieving and exceeding challenging goals. Authorized to work in the US for any employer

Work Experience

Process Engineer

FormFactor, Inc - Livermore, CA

June 2019 to Present

• Provide on-time production support, disposition for any process and tool related issues for Speedwell and Forevers Probe card Assembly and Testing.

• Troubleshoot any production issue, root cause analysis, perform failure analysis, propose and implement resolutions.

• Initiates and drive the continuous improvement projects to improve process Cycle time and First Pass Yield (FPY).

• Develop and implement process procedures and protocols, and train production operations.

• Equipments optimization PB65 Testing machines, Nexiv/Nikon inspection, Cameo auto sander machine. Process Engineer

ON Semiconductor - Tarlac City

August 2013 to February 2019

• Implement continuous improvements actions at Front of Line assembly processes using Lean Six Sigma principles.

• Die attach Epoxy, Solder and DAF processes owner with contribution and supported Dicing process, Wire bond operation for Front of line.

• Problem solving, root cause and failure analysis using tools such as root cause analysis, Why~ why, PFMEA, 8D, CAPA and provide corrective actions, preventive actions on Die attach process.

• Document and train production and engineering personnel on process work instructions and safety policies.

• Continuous improvement projects to improve process Cycle time and First Pass Yield (FPY) for Front of Line specially Die attach process.

Senior Associate Engineer

UTAC - United Test and Assembly Center Ltd - Dongguan January 2012 to May 2012

• Supervised and provided training to technicians, machine operators and newly hired personnel for die bonding process and wire bonding manufacturing line.

• Performed troubleshooting and repair of Be stem Die bonder machines.

• Performed preventive maintenance, machines and process flow improvements to ensure that machine MTBA/MTBF are met, and production operations are stabilized and sustained. Field Service Engineer

ITOCHU Corporation - Manila, AR

July 2006 to December 2011

• Conduct equipment support, qualification and services to Texas Instruments Philippines Inc. Semiconductor, Baguio City and Clark Pampanga, Philippines

• Install, set-up and do test-run of the following new Bestem D02/ Die Bonder machines; Minami Screen Printer, Shibuya Ball Mounter machines.

• Operate and performed troubleshooting, repair and preventive maintenance.

• Coordinate with the customers, provided technical advice and participated in the Client Yield

• Improvement, Cost Reduction and Uptime Improvement Projects. Equipment Engineering Apprenticeship

Texas Instruments - Baguio

August 2005 to January 2006

• Operate and performed troubleshooting, repair and preventive maintenance on Ball Attach machines such as Misuzu, Athlete machines, Heller Reflow Oven machines and Sharp Fluxwash Cleaner machines.

• Provided relevant data and information for machines and process flow improvements. Education

Bachelor of Science in Mechanical Engineering

Saint Louis University

Skills

• Lean Six Sigma

• Process Improvement

• Root Cause Analysis

• Process Engineering

• Lean Manufacturing

• 5S

• Lean

• Manufacturing

Certifications and Licenses

Six Sigma Certification

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