Post Job Free

Resume

Sign in

High Speed Hardware Engineer

Location:
Fremont, CA
Posted:
September 08, 2023

Contact this candidate

Resume:

Fremont, CA ***** phone: 510-***-****

IQBAL HAIDER

Summary:

More than 8 years of experience in Electronics industry has provided knowledge and expertise in Board

design and Test.

Experience includes:

Hands on experience in product design,bring-up and debugging, functional and electrical

verification.

Hardware design, debug and transfer to manufacturing of very High Speed products, FPGA Boards with

high speed interfaces, Server Motherboards, Switches, Embedded Processors x86 and Arm based

Systems and Network Appliances Giga Bit, 3.125G,5Gig, 10 Gig and 400Gig Products. PCI-e

Gen1,Gen 2, SAS/SATA PCI-e Gen2, DDR2,DDR3 memory and Nand and NOR flash

Product Specifications, Component selection Architecture Designs, Schematic design, Stackup, Board

layout guidelines, Constraints, EMI, crosstalk, signal integrity and transmission line guidelines. DFM

and DFT, Board Fab, assembly and DVT PLANS and validation. Timing diagrams, Timing Margins.

Orcad,Cadence concept,Altium tools

Skill Set:

Hardware Platforms CPU: .Quad Core Sun and Cavium processors.TI embedded processors. Intel

Sandybridge processors,intel Pentium x86,atom processor

Development Tools Orcad, Concept, Altium Schematic design Tools

Protocols pci-ex

Interfaces Pci-ex, usb, i2c, ddr2,3 memory,nand flash, sata,nor flash, Ethernet 1

gig,3.125 gig, 100 mhz

Simulation, Design Hyperlynx, orcad, allegro, concept,oscilloscope,dmm,exorcisor,analyzer

& Debug Tools in-circuit emulator,current probe, heat sensing camera,regulator stability

measurement instrument,logic analyzer etc

Operating Systems Windows,unix,windows nt

Experience Details

1. Hastest Solutions :San Jose, Ca 2014- 2015

Contribution Design and development of intel atom processor based server

motherboard, SATA interface,DDR3 momory interface, USB

interface, Flash, stackthrough pc/104 plus interface.I2C, temp

sensing, pci-ex,Gigabit ethernet

Platforms Windows os.

Development Tools Orcad,allegro,hastest high /low temperature ovens,boot

software,oscilloscope, pc and application specific software

2. Cisco Corporation :San Jose, Ca 2012-2013

Contribution ● Design,debug of Agni service module that uses 4 Intel

Sandybridge processors, DDR3 memory, LSI Tarari T2500,

lanai and camphor daughter cards, Asics and FPGA’s

● 40 Gig interface to Backplane and line cards. Four intel

sandybridges controlling 40 Gig traffic.

● Root cause Analysis of DDR memory failures at low

temperature

Development Tools PC, Orcad, Allegro, Oscilloscope, applications software, 4 corner

testing oven.

1. Microsoft Corporation MountainView,Ca May 2012-Oct 2012

Contribution ● Design of MTB Daisy Chain Board to test fractures on

solder Joints of TI video encoder chip used in xbox

● Design of Thermal test board using thermal die’s to test

failures during vibration for ridgeway xbox

● Validation and Testing PCI-EX gen2, Power Supply

regulator circuitry. Sending traffic from end point to root

complex and vice versa and analyzing the send and receive

packets.

● Fixed the video encoder design schematics containing

fpga,hdmi ddr3,flash,usb etc

Platforms Microsoft windows

Development Tools Cadence Concept

2. Display Module Board- KARLSTORZ IMAGING March 2011-sept 2011

Used in medical Equipment to see insides of human body stomach in surgery

Contribution ● Board design using Altera Stratix IV FPGA,DUAL

HDMI RECEIVERS and Transmitters,165mhz

video,3Gig SDI driving 75 ohm cables,4USB ports,

MMC/SD mobile memory card interface,DDR3

SDRAarchM, Genlock clock circuitry, Nand and NOR

Flash, Video still compression engine, TMS 8168

Davinci processor interface, serial ports, SCB

interface, Gigabit Ethernet, TMDS Mux

Platform TMS8168, Stratix IV FPGA

Development Tools Hyperlynx pre-layout simulator, cadence altium, oscilloscope

3. RED DigitalCinema, Hollywood 2010

Contribution ● Low level Design,debug and preproduction test

verification of digital Camera boards

● Dual Xilinx FPGAs with XAUI,PCIE,HDMI Video

Display Interface, I2C,SPI,Power Supplies,Lens Driver

Board, OMAP processor Board,DDR2/3 memory,

SAS/SATA, PCI-Ex gen2 and 3Gig Ethernet boards. Board

integration into the Camera’s

Platform Xilinx FPGA,High definition video camera for making movies

Development Tools Orcad,allegro,pc test software, oscilloscope, digital

meter,multiboard interface software etc

4. Whizz Systems. San Jose,Ca jan 2009-dec 2009

Contribution ● Design and development of Vertex-5 FPGA card,4

FPGA’s,Very High Speed interfaces XAUI,PCIEx,DDR2

memory interface, Flash and Compact Flash interfaces,

High Speed Analog A/D and D/A circuits, serial ports and

power supplies

5. Whizz Systems. San Jose,Ca 2006/2007

Contribution Senior Hardware Engineer

● Design of ARM processor based stand-alone power over

Ethernet injector.802.3af, 10/100/1Gig ports, 4 RS232

ports, 48V inputs power supplies. Power management.

Design and development of 24 gig Demo card using SPI

and XAUI interfaces using Marvel chips.

Platform

Development Tools

6. Sun Microsystems inc : Mt.View Ca March 2004 to July 2006

Contribution Senior Hardware Engineer

● Design of Dual Processor based Server Motherboard,

DDR2 Memory interface, embedded network interface,

SAS/SATA and Six PCIe Gen 1 slots and Service

Processor interface. Power Supplies, and Clock Circuitry

● Design of Analog Fan Control board to control 12 fans.

● Design of Motherboard and daughter cards for 10 gig

signal model extraction

tools Oscilloscope, DVM,PC,boot software etc

Education : BS EE

Oklahoma State University

Honors List



Contact this candidate