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Embedded Software Engineer, Firmware Engineer.

Location:
San Francisco, CA, 94102
Salary:
>$120,000
Posted:
October 08, 2023

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Resume:

ZEJUN LING

Green Card Holder 510-***-**** adz8rs@r.postjobfree.com Sunnyvale, CA

INTERESTS: Embedded Software Engineer, Firmware Engineer. SUMMARY OF QUALIFICATION

** ***** ** ********** ** a Firmware Engineer, Embedded Software Engineer, Senior Software Engineer, or Software Manager in Microcontroller/Industrial PC/Mobile/AR/VR/ PDA/IoT development. Launched over 10 embedded products. 6 years of experience with Data structures/Algorithms, Control Theory/Algorithms, and testing/launching software products on embedded devices.

1.5 years of Hardware experience as EE to Design/Solder/Debug Microcontroller Intel 8051/ Industrial PC Intel 8086 System. Self-motivated, result-oriented, team working, adept at problem solving, meeting tight deadlines, and producing quality work. TECHNICAL SKILLS

Programming Languages (11 years): C (6 years), C++ (1 year), Python (1.5 years), Pascal (1 year), Assembly in Intel 8051/8086/ARM/Motorola M68K (1.5 years), and HTML. Be familiar with the CMM3 software development process and lifecycle. Microcontroller/Microprocessor: Intel 8051/ 8086/ ARM7/ARM9/Strong ARM/ ARM Cortex-M (STM32/nRF) /Motorola M68K Developing Experience: UART/Touch panel/Flash/LCD/RTC Drivers, Bootloader, Power Management in Hopen OS, SPI/UART/I2C, Hopen OS / Linux OS kernel porting, Touchscreen driver. GPIO, LED, PWM, ADC/DAC, Interrupt, Temperature Sensors processing development. Board HW/FW/SW brings up, ASIC verification. PDA/Mobile total software solution development leadership. Operating Systems: Hopen OS (Embedded OS), Windows, Linux, DOS, and Mac OS. Software Version Control: Microsoft VSS/CVS/SVN/Perforce IDE/Debug Tools: MS Visual C++/ VS Code / Dev C++ /Cygwin/JetBrains PyCharm/ GDB/SDS/VS Code/ADB/USB/UART. EE Lab Equipment: DMM, Oscilloscope, Introspect SV4E/SV3C. Bug Management: Test monitor/ Bugzilla/ CR Tracking /Task Tracking Mobile/AR/VR/MCU/IPC/PDA Develop/Debug: Requirement Analysis /Architecture Design/Code/Unit Test/Integration/ Test/FTA Test/ Field test, Power Measurement, VF test, and Open/ Short test. EE circuit soldering and rework. Data Analysis and Reporting: Google Sheets/Docs/Slides, MS Office, JavaScript, Python scripts, shell scripts. Web Technologies: RESTful Web Service.

Technology Research: NFV (ETSI), Mobile, Wi-Fi( IEEE802.11G/AC ), 2G CDMA 1x (3GPP2)/ 3G EVDO (3GPP2)/ 4G LTE (3GPP) wireless communication, IoT (Internet of Things), and TCP/IP. PROFESSIONAL EXPERIENCE

Meta Platforms Inc. (parent company of Facebook) Sunnyvale, CA Embedded Software Engineer 8/2022 – 8/2023

Worked on multiple projects including VR/AR Projector.

Was responsible for Customized ASIC FW development/Validation, Board HW/FW/SW brings up, Projector Validation, Power Measurement, VF test, Open/Short test, and FA of VR/AR projects. We will launch a VR product at the end of 2023.

Technologies: C, Python, ARM Cortex-M STM32/nRF, I2C, SPI, bash scripts, PWM, GPIO, Android ADB, Perforce, VS Code, G- drive, DMM, Oscilloscope, Schematics, PCB, Cadence, rework, soldering, MIPI, Camera, Introspect SV4E/SV3C. China Telecom Research Institute Beijing, China

Senior Software Engineer/Senior Engineer/Project Manager 10/2009 – 07/2022

Developed TeleNos2.0 (NFVO) system, deployed in Jiangsu Telecom in 2017, managed vBRAS, and tested with ZTE and H3C.

Focused on software development using Python, including Network Functions Virtualization (NFV).

Technologies: Python, Linux CentOS, Field Test, NFV, REST-ful, CDMA 1x/ EVDO / 4G LTE, Wi-Fi, Mobile Technology Research. Beijing Pollex Software Technology Beijing, China

Software Manager/Project Director 1/2005 – 10/2006

According to SEI CMM3 process, led a team of 50+ employees; was responsible for total software solution development, testing, and project management; shipped 6+ products of Smart Phone including HAIER N90, and European Benefon, etc.

Technologies: C/C++, Linux/ Cygwin/GDB/CVS, ARM9/Strong ARM, SEI CMM3, Board HW/FW/SW brings up, Windows NT/2000, MS VSS/ Visual C++, Bugzilla, drivers, AT-Command, mobile software development, and management. Cass Hopen Software Engineering Technology Beijing, China Embedded Software Engineer/ Senior Embedded Software Engineer/Project Manager/Software Manager 4/1999 – 12/2004 ZEJUN LING

Green Card Holder 510-***-**** adz8rs@r.postjobfree.com Sunnyvale, CA

Engaged in software development and management, software architecture, and system design. As a core member completed the development and product launch of China's first domestically embedded operating system in 2000.

Focus on the bootloader, power management, drivers, Hopen, and Linux OS porting, Board HW/FW/SW brings up, using C and Assembly in ARM7/ARM9/Motorola M68K/ NEC V853.

According to SEI CMM3 process; Led a team of 14 employees; Responsible for software development, testing, and project management; shipped 4 products of PDA and phones including Lenovo PDA, Samsung Linux Smart Phone Solution, etc.

Technologies: C/C++, Linux/Cygwin/GDB/CVS, Assembly in ARM7/ARM9/Motorola M68K, drivers, bootloader, SPI/UART, power management, OS porting, software development/management, SEI CMM3, Windows NT/2000, MS VSS/Visual C++. Northern Jiaotong University Beijing, China

Embedded Software Engineer / Electrical Engineer 7/1997 – 12/1998

Developed two industrial microprocessor control systems, Board HW/FW/SW brings up, used Assembly in Intel8051 for software and Altium Protel to design/debug/soldering hardware circuits.

Technologies: Assembly in Intel 8051, sensor, EPROM, I2C, UART, Modem, DOS, Windows 95/98, Altium Protel. Chengdu Locomotive & Vehicle Factory Chengdu, China Embedded Software Engineer / Electrical Engineer 7/1994 - 9/1996

Led the software architecture and system design, developed an industrial PC (STD Bus) system for auto-detect & fuzzy controlling the temperature of industrial electrically heated boilers with high power by using Pascal and Assembly for 8086.

Joined the production of high-power DC motor (204 KW/ 410 KW) used in Locomotive.

Technologies: Borland Pascal, STD BUS IPC, Sensor, Control System, Assembly in Intel 8086, Altium Protel, DOS, Win 3.1/95. Motorola China Technology Beijing, China

Software Program Manager 10/2006 – 2/2009

Was responsible for project management of MAGX 6.1 and 7.4, including Calling, WLAN, and Field tools etc.

Shipped four phone products including MOTO Z6 (4/2007), ROKR V8 (7/2007), VE66 (11/2008), and ROKR EM35 (12/2008).

Technologies: program management, Software full lifecycle Tracking, smartphone, Windows NT/2000, HTML, MS Office. EDUCATION

Northern Jiaotong University, Beijing, China, Masters of Science in Electrical Engineering Northern Jiaotong University, Beijing, China, Bachelor of Science in Electrical Engineering AWARDS

The praise of China Telecom for its contribution to expanding the scale of the LTE test, China Telecom (300,000+ employees), Beijing, China, 2014.

The Second-class Award of Beijing Science and Technology for Hopen Smart Phone Application Developing Platform, Software Engineering Center, China Academy of Sciences, Beijing, China, 2005.

Excellent Employee, Cass Hopen Software Engineering Technology Co., Ltd. (100+ employees), Beijing, China, 2000.

Excellent Employee, Chengdu Locomotive & Vehicle Factory. (10,000+ employees), Chengdu, China, 1995. PUBLICATIONS

Published 1 book, 9 papers, 5 patents, and 4 software copyrights.

Paper: Zejun Ling, “Design and application of new insulation resistance measurement methods”, Technology Newsletter, Jan 1996.

Paper: Zejun Ling, et al., “Anti-interference Design of Computer Measurement and Control System”, Application Research of Computers, Dec 1999.

Paper: Zejun Ling, et al., “Mobile phone design research of Internet of Things”, Mobile Communication. Jun 2012.

Paper: Zejun Ling, et al., “Practice and Development Trend of the Green Mobile Network”, Telecommunications Technology, Dec 2013.

Patent: Zhirong Zhang, Zejun Ling, "Communication systems, gateways, and ZigBee Internet of Things mobile terminals." submitted in 2011, authorized in 2014, open number: CN102548030A, Beijing, China.

Patent: Zejun Ling, et al., "dual baseband chip mobile terminal card reader method." submitted in 2010, authorized in 2015, open number: CN102957788A, Beijing, China.

Software copyright: Zejun Ling, TNOS2.0 Telecom Network Orchestration System, No.2018SR844268, Beijing, China.



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