Data Entry Quality Control

BELMA SAJOR

**** ********* **.

San Jose Ca. ****3

Tel# 669-***-****

Email: **********@*****.***

Summary: Extensive knowledge in Inspection, Assembly, Wire bonding, Die Attach, Flip

attach, Soldering SMD components (0201, 0402) under microscope.

WORK HISTORY:

TTM May 2022- Present

. Final Inspection (PCB)

. Check all the defects like, peeled mask, voids, escape plating, legend on pads, non

Plating on holes, no copper expose, nodule, scratches etc.

. Used microscope and magnifying light to rework all the defects to be fixed.

COBHAM

May 2019 – May 2022

·Thin film inspection (substrate)

·Assemble the housing and housing plate (module)

·Check the serial no. before assemble and attach the label

·Apply epoxy and sub-attach

·Read the drawing (BOM)

SKYWORKS ASSEMBLY SPECIALIST/ MEDICAL DEVICES

April 2005 –May 2019

·Perform visual inspect before and after the assembly process

·Dispense clear gel on the substrate with detector and led, then apply white gel

On top of white gel, apply black epoxy and some products need black gel.

·Make a sample test before to start the whole lot

·Complete lot travelers to make sure the process is documented properly

·Work under microscope

·Do X-RAY the finished products

·Used hand tools such as calipers, tweezer, micrometers, screwdrivers, cutters, strippers, crimpers, blades, etc.

ISOLINK QC-QA

· Inspect the finished product (octo coupler) for cracks, chips, delamina-

tion and orientation under microscope.

· Double check the labeling and numbering according to the drawing with

the latest revision.

·Login the incoming products.

·Do packaging and shipping the finished products.

INTEL CORP. ASSEMBLER

Nov. 2003 – Nov. 2004

· Rework transceivers (solder 0402 resistors, capacitors)

· Solder Tosa and Rosa with flex cables

· Solder Mtx and Mrx (butterfly can)

· Used WIP tracking tool

· Manual wire bond

·Die attach

SDL INC.

Oct. 2000- Jul. 2001

· HI REL/ASSEMBLY (laser diode)

· Wire bond (manual/semi auto) in K&s machine

· Die attach

· Soldering surface mount components (0805,0603,0402) resistors, capacitors etc.

ENDWAVE TECHNOLOGIES INC.

Jul. 2000 – Oct. 2000

· Assembly (module/substrate)

·Die attach/flip attach

·Plasma clean

HEADWAY TECHNOLOGIES INC.

Feb. 1999 –Jul. 2000

· HGA/ASSEMBLY (sliders head)

· Die attach/ head load

· Slider bond,flex bond, wire bond,ABS clean gram load, static roll adjustment, X and Y

measurement, control chart

READ RITE CORP.

Jul. 1991 –Sept. 1998

SLIDER FAB:

· Hi and Lo power microscope (inspect ABS cracks, delamination, contamination)

· Operates graphics tablet and row bonding

ASSEMBLY:

· Routing and final stake (crimping wire)

· Certified in HI and LO power inspection

· Fly height test /magnetic test Guzik, wire bonding, conformal coat, static roll adjustment, and aqueous clean

EDUCATION:

1975-1979 Cabugao Institute (high school) Cabugao Ilocos Sur, Phils,

1980-1981 University of Northern Philippines Vigan Ilocos Sur, Phils. Secretarial Science

1981-1985 Divine Word College of Laoag Laoag City, Phils. B. S. in Banking and Finance

SKILLS:

Basic computer, Data entry, Typing, filing, operates various machines, quality control and

Inventory control.

INTERPERSONAL SKILLS:

· Well organized

· Strong desire to succeed

· Fast learner and adopts easily

· Able to coordinate activities simultaneously

· Effectively worked with large number of employees

· Able to work independently without supervision, self-motivated

· Multi-tasking

REFERENCES:

·Billye Mitchell Supervisor 408-***-****

·Maritess Rivera Assembly Technician 408-***-****

·Martha Sabug Assembly Lead 408-***-****

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