DENNIS M. CAÑARES

M*-** Block *, Spanish villa condominium

Jalan Bunga Raya 19, Taman Tasik Jaya,

***** ********, ****** ********, ********

HP #: +60-014******* (Malaysia)

+63-927******* (ROAMING-PHIL.)

Email ID: adyzh2@r.postjobfree.com

CAREER PROFILE:

• Detail-Oriented individual with 10 years solid experience in semiconductor assembly.

• A highly organize, self-starter and with excellent oral and written communication skills.

• Works well in a challenging, fast-paced, high-stress and deadline-oriented environments individually or as part of a team. Knowledgeable in creating detailed technical and engineering reports.

• I am equally comfortable and qualified for engineering works. As a result of my developed analytical problem-solving skills and ability to learn new tasks and concept abstractions quickly, I am also more than willing to accept a position in an exciting new field that I have not yet had the opportunity to work in.

OBJECTIVE:

To be able to utilize my skills and abilities that a have acquired in my education and considerable work experiences in engineering field which will permit me to continue practicing and expanding my skill set and knowledge base.

QUALIFICATION:

• Expert on wire bond process and knowledgeable on wire bond machines.

- KNS, ASM, & Shinkawa ACB3000 / UTC5100 series bonder.

• Proficient and Flexible knowledge in terms of wire bond technology such as:

- Gold wire (Au) bonding, 0.7 to 2.0 mils

- Copper wire (Cu) bonding, 0.7 to 2.0 mils.

• Expert on Measuring Equipment such as:

- DAGE 4000 Ball Shear Test & Wire Pull Test

- HISOMET/DPC Auto Focus (hisomet)

• In-depth knowledge in Statistical tools such as SAS JMP.

• Utilize JMP, PFMEA, DOE, 8D and FA tools in problem solving and process improvement

• Computer literate, proficient in Microsoft Office (Excel, Word, and PowerPoint). WORK EXPERIENCES:

ON Semiconductor (SBN) Malaysia Sdn. Bhd.

Senawang Industrial State, Seremban Negeri Sembilan Malaysia. May 2019 – Present

Staff Project Engineer Copper wire Project Team

Responsible for the Copper wire cost saving Project program execution and implementation.

Provide Copper wire program execution plan and strategy.

Communicate by presentation to the Business Unit (BU) managers to get project approval with the cost savings opportunity on Copper wire program.

Develop, formulate, evaluate and execute Copper wire bond parameter characterization, optimization and process definition.

Perform Copper wire Qualification Plan with Comprehensive Reliability Qual Plan.

Support Engineering Build Request for customers and ramp up.

Support on QFN and SOSM Line issue to provide Root cause analysis, improvement plan and Corrective actions. ACCOMPLISHMENT:

• Successfully implemented NTLJSD14D MosFET device with 2.0mil PCC wire in PQFN package under In-source project from ONsemi CEBU to ONsemi Malaysia, with annualize savings of USD400k.

• Successfully implemented in PCC wire of UDFN ESD devices series in QFN package under copper wire migration project with annualize savings of USD 244k.

• Successfully implemented in PCC wire of SOT223 SoftSolder NVF2099 device series (Automotive) in SOSM package under copper wire migration project with annualize savings of USD 560k.

• Successfully implemented in Copper wire of TSOP6 ZLM device series in SOSM package under copper wire migration project with annualize savings of USD 110k. STARS MICROELECTRONICS

Bang Pa-in Ayutthaya Thailand

October 2017 – March 2019 (2 years)

Wire Bond Process Development Engineer (Sect.Manager)

Develop, formulate, evaluate and execute to resolve systemic issue and enhance process capability to improve yield, quality, productivity and cost.

Process Development Engineer with significant role to increase productivity, quality, and safety through keen data analysis and process design.

Lead Focal Engineer for Wire bond Characterization to support New Product Introduction (NPI) and product qualification.

Interface with Customer (ON SEMI, MICROCHIP, IMPINJ) regarding root cause analysis (RCA), Process improvement plan and Action item discussion to close any issues.

Responsible and accountable for ensuring Inspection Station maverick lots are investigated and provide corrective actions towards yield performance and ensure proper disposition is given by engineers and shift engineers.

Ensure product transfers from Qualification meet required HVM performance (yield, proper process CZ, and correct equipment selection is done before the transfer).

Support engineering build requests, rump ups and platform extensions.

Analyze data using stat analysis tools, understand and interpret the data, and using the data to drive for proposal and solution.

Improve equipment efficiency through equipment control process optimization, flexibility of package conversion, equipment reliability and performance to original level. ACCOMPLISHMENTS:

• Successfully introduce the correct etching chemical for copper wire devices to identify intermetallic compound

(IMC). Provide Training and methodology for chemical etching and measurement.

• Provide and introduce reliable software for IMC % measurement.

• Successfully implemented WB –CZ, Capillary selection, DOE methodology, Process optimization.

• Successfully Qualified 0.8mil CuPdAu wire for US8, MicroPak, MSOP, packages (ON Semi).

• Successfully Qualified KNS (ConnX plus) machine for IMPINJ product – to improve productivity and machine flexibility.

• Successfully execute in defining the loop profile and controls for IMPINJ product to improve TEST Yield (OS low yield) due to broken wire.

• Successfully executing in defining / optimizing 2nd bond parameter for SOIC packages of MICROCHIP product to reduce Non-stick on lead (NSOL) for Yield improvement.

• Successfully implemented process robustness and optimization for ON SEMI product as part of yield improvement.

ASE Electronics Malaysia

Pulau Penang, Malaysia

June 2014 – October 2017 (3 years)

STAFF. ENGINEER WB NPI/PDE (Process Development Engineering)

Process Development Engineer with significant role to increase productivity, quality, and safety through keen data analysis and process design; significantly improve new product introduction and development operations, and provide efficient resolution of production issues.

Utilize JMP, PFMEA, DOE, 8D and FA tools in problem solving and process improvement.

Interface with Design team at early phase to understand the detailed product specification, design and development and testing methodology

Responsible in Qualifying New Product and package for Production.

Conduct wire selection, bond parameter characterization, optimization and process definition, controls and specification for both Au/Cu wire technology.

Support and implement the transition of product & manufacturing processes from prototype to full production and through the entire life cycle of the product.

Perform failure analysis until root cause finding issues.

Plan and execute projects to improve yield, quality, cost and productivity of product portfolios.

Perform qualification of product changes and support in resolving customer application issues and implementation.

Driving Root Cause Analysis (RCA) and Escape Defect Analysis (EDA) for preventive and corrective actions.

Focal Engineer in CuClip Wire Bond area. Qualify and Transfer new products for production.

Responsible in evaluating and recommends design or modification of parts, materials, tools, fixtures and equipment for new product.

ACCOMPLISHMENTS:

• Successfully implemented the Standardization of Looping profile by using PSA loop (Power Series Advanced) on Altera Zipple back LBGA package.

• Successfully executing in defining 1st and 2nd Bond parameter for 0.7 CuPd wire with 2.88um aluminum thickness on fine pitch pad.

• Successfully qualified all devices from IR for CuCLip Start up and Ramp up.

• Successfully Qualified MACOm multiple and staggered die on Wirebond.

• Completed MACOM SIP Packages qualification and Engg Build.

• Successfully executing in defining and qualifying 1st bond and 2nd bond parameter on 2.0 mil CuPd wire for MOSFet devices.

• Successfully Qualified SEMETECH multiple RF Quad dies on Wirebond.

• Successfully completed Wirebond Qualification on Altera MAX10 ZB LQFP 144L Package and smoothly transfer for production build.

STATSCHIPPAC MALAYSIA

Kuala Lumpur, Malaysia

August 2010 – June 2014 (4 years)

PROCESS ENGINEER / WB RMT (Wirebond Recipe Management)

• Creating and qualifying WB recipe (wire bonding program) for New Device/Customer.

• Implementing necessary communication strategy for Quality issues resolution across QFN department.

• Performing DOE (Design of Experiment) for new devices & for enhancement of current recipe.

• Conducting resolution on yield improvement and maintaining machine A1 condition.

• Conducting failure analysis and minor/major troubleshooting on wire bond machine.

• Performing root cause analysis (RCA) in engineering approach and investigation.

• Establishing Engineering report in any malfunction and abnormality occurrences.

• Responsible in providing continuous improvement plan for gold and copper bonding.

• Responsible in attaining station’s optimum yield, product quality and reliability by providing permanent actions.

• Responsible in interfacing Production, Maintenance and QRE group in resolving line issues having wirebond related problems and to prevent recurrence.

• Support on activities to improve the UPH, achieve cost savings and develop new systems for better process. MAJOR ACCOMPLISHMENTS:

• Passed qualification of Scan Disk 14Nano 0.9 mil Copper Wire.

- First pass qualification with an initial production volume of 200K/week.

• Improve ISL copper lifted ball by optimizing of looping in using of CSP loop in 1.2mil Cu wire.

• Successfully implemented advance looping parameter by using BGA, PSA, KL-loop, to eliminate wire sagging and wire to die edge shorting.

• Overall champion of WPS (Wire Per Second) Improvement Team. Improved the following UPH by optimization of wire bond speed and bond parameters:

- ADI SSM3302: WPS improvement from 2.3 to 4.6 wire/sec

- ST Micro 45968CVW: WPS improvement from 3.2 to 5.7 wire/sec

- Broadcom 14Nano: WPS improvement from 3.5 to 6.2 wire/sec

• Eliminate wrong wire lay out/wrong bond occurrence thru Wire bond Recipe OLP Implementation.

• BCM looping optimization ( wire shorting), 1st bond DOE (due to ball shorting)

• AMS copper, Lifted metal issue – 1st bond enhancement

• ISL BOAC device 1st Bond optimization due to - NSOP/Irregular Ball Issue

• ST micro 1st bond and 2nd bond optimization due to broken wire through full blown DOE AMKOR TECHNOLOGY PHILIPPINES

P1 / P2 Muntinlupa City

April 2004 – August 2010 (6 years)

EQUIPMENT ENGINEERING (WB FOL)

• Sustaining Wirebond machine by performing conversion / set-up, minor/major repair and A1 conditioning of machines.

• Conducting equipment preventive maintenance activities (PM)

• Modification & upgrading equipment in order to enhance machine productivity and make necessary recommendation to immediate superior.

• Supporting company cost reduction program by generating projects in QIT/TPM programs.

• Act as OIC support on my team at Area 1 TSSOP Dept. TRAINING and CERTIFICATION:

PFMEA AIAG & VDA 1st Edition 2019 (Certificate of completion) : 2022 FMEA (Certificate of completion) : 2020

REBUILD EQUIPMENT TRAINING (BASE LINING) : 2010

P1/P2 PROCESS TRAINING (ANALOG AUTOMOTIVE) : 2007

TPM STEP 5 : 2007

PROJECT MANAGEMENT : 2007

LEAN MANUFACTURING : 2007

KNS LEVEL 2 TRAINING : 2007

BASIC SPC : 2006

BOSCH ORIENTATION : 2006

CODE OF ETHICS : 2006

P1/P2 PROCESS CERTIFICATION WIREBOND (MAXIM) : 2006 P1/P2 PROCESS CERTIFICATION WIREBOND (ANALOG) : 2006 SENSOR TECHNOLOGY : 2006

TPM STEP 3 : 2005

CART AWARENESS PROGRAM : 2004

EQUIPMENT- KNS SET UP AMKOR TECH KOREA (ATK) METHODOLOGY : 2004 KNS MACHINE BASIC TRAINING : 2004

EDUCATIONAL BACKGROUND:

TERTIARY: MANUEL S. ENVERGA UNIVERSITY FOUNDATION

Lucena City, Quezon Philippines

Degree: BACHELOR OF SCIENCE IN MECHANICAL ENGINEERING Batch 2013

TECHNOLOGICAL UNIVERSITY OF THE PHILIPPINES

Ermita Manila, Metro Manila

Diploma: ELECTRONICS AND COMMUNICATION ENGINEERING TECHNOLOGY Batch 2004

SECONDARY: PASAY CITY WEST HIGH SCHOOL

Pasadena St. Pasay City

Batch 2001

PRIMARY: PADRE BURGOS ELEMENTARY SCHOOL

P. Burgos St. Pasay City

Batch 1997

PERSONAL DATA:

Nick Name : Deng

Age : 39

Birth Date : December 31, 1983

Birth Place : Hospital ng Manila

Civil Status : Married

Spouse Name : Analyn Cortiguerra Cañares

Age : 42

Child Name : Jan Andrei C. Cañares

Age : 15

Father’s Name : Danilo Cañares

Mother’s Name : Cristina Cañares

Height : 5’6”

Weight : 85 kg

Blood Type : A

CHARACTER REFERENCES:

Available Upon Request.

I hereby affirmed that the above information is true and correct to the best of my knowledge and ability. DENNIS M. CAÑARES

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