Andy Khuu
*** ** ***** ***** *.E Phone: 206-***-****
Renton, WA. 98059 Email: adyyt2@r.postjobfree.com
OBJECTIVE: Looking to obtain a job as an experienced IC Circuit of Electrical Engineer position to modify existing layouts and utilize my knowledge in the IC design by performing layout cells in analog, digital, mix signal and top level layout.
SKILLS PROFILE
Over seven years of experience in working with Cadence layout toolset
Familiar in working with Unix, Cadence Virtuoso XL, Diva (DRC/LVS/ERC), (DRC/LVS) and Hercules Avant (DRC/LVS/ERC/ANT), and Assura verification tools
Know how to modify existing layouts, DRC, LVS, and arrange layout cells
Experience with design digital standard cells, analog layout, guard ring and full chip
EMPLOYMENT HISTORY
Aviation Maintenance Technician, Allflight Corporation, Kent, WA 07/05/2022-current
Assist lead technicians with cleaning, prepping, inspecting, testing and repairing aircraft windows, components and equipment.
Production Assembler, Hy Security, Kent, WA 02/28/2022-06/21/2022
Assemble electric box, panels of gate security system with batteries, transformer, chassis, wire harness routing.
Test Technician, Sanmina, Bothell, WA 03/15/2021-11/04/2021
Perform defect finding on circuit boards, repair and replace electro-mechanical components
Read schematics, diagrams from eMatrix. Measure resistors, capacitors, impedance. Check for voltage short and open components on circuit boards.
Perform functional imaging testing of a finished medical ultrasound device.
Perform resilient self-test, calibration for channel board and transducer select board on space station.
Record each component replaced in Elog for company and Rep Track for customers.
Mechanical Assembler, Fluke, Everett, WA 09/28/2020-02/17/2021
Visual inspect, assemble face masks
Measure, cut pipes and boards; assemble shelves under worktables.
Assemble magnetic sliding tool kits and chain with keys for alignment sensors, solder batteries wires to PCB boards for rotalign sensor and solder batteries wires through holes for optalign sensor. Wrap electrical wires under batteries with insulation tapes around batteries.
· Assemble some packages for laser light: rotalign and optalign.
· Labels and packages for Thermometers, Digital Multimeters and Clamp Meters
Test RH percentage of Relative Humidity and Temperature Meters at 75 percent RH with salt and distilled water. Report pass/fail data.
Mechanical Assembler, Aim Aerospace, Auburn, Washington 11/20/2017-07/02/2020
Install sleeve and insulation for aircraft ducting
Prepare panels, cleaning with alcohol, read documents
Prepare bonding mixture
Perform etching process for panels with bonding mixture
Inspect panels and fix minor etching details
Mechanical Assembler, BTG, Bothell, Washington 11/21/2012-8/13/2015
Work in clean room
Solder elements to core wires under microscope
Assemble core wires with elements that can go into blood veins
IC Layout Engineer, TriQuint, High Point, North Carolina 5/2012-5/2012
Worked with layout of 3 metal layers of VLSI RF layouts for updated diode, clamp, and esd pads in IBM_PDK Runset
Modified existing layout and debug problem in the LVS data report for substrate floating
Layout tools: Cadence Virtourso and IBM_PDK with DRC and LVS
Mechanical Assembler, Eldec,Corporation, Lynwood, Washington 11/2011-03/2012
Calibrate test machine
Assemble inductors coils
Tint wires
Solder wires between inductor coils under microscope
Calibrate inductors within specified frequency range
Tint conductors
Wrap inductor wires to conductor wires
Touch up solder.
Analog Layout/Mask Engineer, Impinj, Seattle, Washington 11/2010-12/2010
Modified existing layouts of a VLSI RFIC memory in 45nm techngoloy.
Design layouts for controlling circuit section that in charge of memory tags: aeon_bias and aeon_bias vittoz.
Worked with layout tools: Cadence Virtourso/Virtourso XL and DRC/LVS/ANT/ERC Assura verification
Analog Layout/Mask Engineer, Zarlink, San Diego, California 07/2009-10/2009
Worked with floor planning and VLSI layouts of a hearing aid in 18nm tsmc RF technology
Design layouts of 4 esd-pads and 1M-ohm resistor
Design layouts for an oscillator and charge pump in CM018MMRF technology
Design connection of m3 between the hybrid layout and decoder’s layout
Design layouts for switches and caps for a decimator
Worked with layout tools: Cadence Virtourso/Virtourso XL and DRC/LVS/ANT/ERC Assura verification
Mechanical Assembler, Carlye Inc, Tukwilla, Washington 01/2006-07/2007
Work in a team
Strip wires
Crimp pins
Heat shrink
Assemble cables
Analog Layout/Mask Engineer, Semtech, Mira Mesa, California 10/2005-10/2005
Worked with floor planning of a VLSI array
Modified existing layouts and fixed DRC errors from a gds file: dac16 layout in Bipolar and 35nm polar technology
Modified existing layout for schematics with bipolar transistors and analog devices, pcomp and pcomp0
Modified existing layouts for three stages of a comparator: plogic, plogicd and plogico
Modified existing layout for a schematic, imirror9 with npn and pnp
Work with layout tools: Cadence Virtourso/Virtourso XL and DRC/LVS/ANT/ERC verification with Hercules Avant!
Physical Design Engineer, Intel, Hillsboro, Oregon 11/2003-12/2003
Design VLSI layouts of logic control in 80 nanometer CMOS technology
Work with digital layout block. Design layouts for nvstctl_jtagtop with padin and padout. Draw layouts for nvstctl_jtagselaccess5, nvstctl_jtagmux4, jtagselaccess5, nvstctl_jtagtrxmux, nvstctl_jtagdomux, txrmux, tdmux, nvstctl_jtagtdomux, nvstctl_seldecoder, decap, pad in/pad out, buffers and nvst_ctl_jtagtop control block
Modified exixting high-speed layouts of phase locked loop, logic divider, flip-flop and charge pumps for a high-speed and low power addressable
Work with layout tools: Cadence Virtourso/Virtourso XL and DRC/LVS/ANT/ERC verification with Hercules Avant!
Physical Design Engineer, Intel, Hillsboro, Oregon 10/2002-1/2003
Design layouts for VLSI p861 chipset project
Work with pipeline architectures, rows and columns for a chipset. Design data path in patterns that feed data from right to left and from top to bottom for multiple rows/column
Design I/O connections in different layout structures
Modified existing high-speed layouts for dataspinebufblk, basebufblk, globalbufblk, compfiller, leftspinebufblk, leftsplinevss and clkgen
Fixed shorts and overlaps in layouts with power template. Fix lvs errors in layouts of front-side buses
Design decaps for VDD pad and VSS pad to reduce power noise
Design layout for high voltage decaps layout with VCCDDR and VSS
Troubleshoot LVS errors
Align metals, m6, m4, m5 and m3 to reduce inductances in layout of top_comp.
Worked in ddr_anaprdrvr layout to connect between multiple power rails and pad
Connected vcca to vcc, vssa to vss, vccddr to vccddr, and esd to pad in a top level layout
Fix text labels in top-level layout and input pads
Perform all verification flows
Work with layout tools: Cadence Virtourso/Virtourso XL and DRC/LVS/ANT/ERC verification with Hercules Avant!
Analog Layout Engineer, CMOS Micro Device, Campbell, California 3/2002-3/2002
Design layouts for memory chip project
Worked with layouts of phase locked loop (PLL), logic divider, Op-amps, flip-flop with bi-directional transistors, and charge pumps in 18nm TSMC technology
Work with layout tools: Cadence Virtuorso/Virtourso XL, DRC/ERC with Diva, and LVS with Dracula
Analog Layout Engineer, NSC, Santa Clara, California 10/2001-2/2002
Worked with floor planning of existing VLSI layouts for audio chips
Modified existing layouts of op-amps, resistor chains, volume controller, selectors for lm4841 chip project
Design layouts for capacitors with common centroid among them
Work with floor planning and single/double guard rings in cs65sg high voltage technology
Fixed LVS errors for lm4842chip
Modified existing layouts for lm4901 chip in cs7_5v technology
Modified layouts for lm4890 project
Design pad ring to cover substrate area for lm4894 layout chip
Work with layout tools: Virtuoso-XL with P-cells and DRC and LVS with Diva for small audio chips
Analog Layout Engineer, IC Media, Mesa, Arizona 1/2001-7/2001
Design layouts for project 108t
Worked with pad rings for VLSI project 532 layout and I/O connections for 105_V2
Fixed layout errors of an ESD layout pad with a tri-state buffer
Tested a DRC deck in 0.25micron UMC technology.
Worked with data paths and arrays for project 108t CMOS Imager PC Camera
Worked with layouts of ramp generator, ADC, voltage generators and PLL8001
Design layouts for row decoder, column decoder, clock control logic, comparator
Worked with floor planning of a 1290x1034 CMOS imager
Design data paths of 1290x1034 CMOS pixels imager with 4.5um pitch with 45nm UMC technologies
Assigned pin locations in layout for analog/digital, and provided a double power source for the imager
Work with layout tool Cadence Virtuoso; DRC/LVS/ERC/ANT with Diva and Hercules
Analog Layout Engineer, Global Span, Princeton, New Jersey 7/2000-7/2000
Worked with inputs of interconnection of transistors in array
Applied matching technique for transistor
Work with layout tools: Cadence Virtuoso
Compiler/Verification Engineer, Virrage Logic, Bellevue, Washington 1/2000-2/2000
Draw VLSI layouts for I/O of dual CMOS RAM memory
Verified the dual CMOS RAM architecture and documents
Work with layout tools: Cadence Virtuoso
Technical Co-Op student, JPL, Pasadena, California 3/1998-10/1999
Design rule check and fix width and length of layout transistors.
Design rule check and work with spacing between metals and poly layers
Verify layouts of a twelve bits Sigma-Delta ADC of a video camera.
Design schematics for a 12 bit adder and Op-Amp at high gain
Modified existing ADC layout from MOSIS technology to Lockheed Martin technology
Record test chips
Work with layout tools like L-Edit and Cadence
Technical Co-Op student, JPL, Pasadena, California 6/1997-12/1997
Draw I/O connection for data path between four special purpose chips
Build test boards on breadboard
Work with Labview to assist an engineer in a moving robot.
Assisted other technical staff in circuit simulation
Design layout of a VLSI 4:1 split array transistors
Recorded data of some simple test chips from oscilloscope
Work with software tools: OrCAD and MicroSim
EDUCATION
Bachelor of Science in Electrical Engineering 1998
University of Washington, Seattle, WA