Jerry Antolik

(C) 510-***-**** adysk1@r.postjobfree.com

Summary: Innovative Engineer with a diverse background in Additive Manufacturing; HVM Digital Transformation; Mechanical; Electrical; Laser/Optical; Hi-Vacuum Systems and Tracked Vehicles. Proven track record of quick, elegant designs meeting aggressive schedules, cost targets and optimizing High Volume Manufacturing processes. Patent-winning Tool-less Fixture Designs. Key Accomplishments:

• Integrated AM Fixture Designs into Global HVM Factory Lean Lines reducing takt times by >50%

• Design and fabrication of real-time, HVM Fixture parts using in-house 3D AM printers. This allowed our HVM factory to stay open during 2021/2022 COVID shut down despite supplier lockdowns. RF Safety LOTO’s

• Conceptualized and designed the Mobile Universal Service Fixture (USF) for the Sensei Platform. The USF replaced traditional PM-specific Top Plate Lift with cost savings of ~$8oK per System. Multiple L10 systems share the USF providing additional cost savings for Customers and valuable clean room space.

• Invented the C&F High-Heat Capacity Liquid Cold Plate to extend the thermal range of the TCP Window in Conductor Etch Products. This epoxy-bonded TCP Window integrated a patented, Dual-Zone Bifilar Cooling Channel within the TCP Window cavity. Designed an AM Ultem version for testing,

• Designed HVM Fast-Switching Aegis BTBAS Vapor Delivery System for Kiyo GX winning critical etch business. Designed a Field-upgradable Kit within the existing system footprint. Novel key-hole design allowed installation of HVM Module onto chamber in less than 5 minutes.

• Lead System Designer for Lam’s 450mm Alpha System for Albany Nanotech Complex @ NY University, Albany. NY. Shipped Lam’s 1st 450mm Etch System in Lam’s history.

• Lead Designer of Lam’s liaison with Veeco’s Ion Beam Etcher (IBE or Kyber). Fixture Design of 460 Source Door swap completed in <4 hours.

• System Designer for Lam’s “Integrated” System (DE, CE, DEP, IBE PM’s, Spin Clean, & Microwave Strip). Prepared 50+ executive-level Customer presentations and facility specifications and NX layout.

• Designed the Barium Fluoride Crystal Optical Fixtures in 1 week for the Large Calorimeter Detector for the Superconducting Super Collider (SSC) in Texas.

• 11 Patents Disclosed, 7 Patents issued, 4 filed or provisional. Professional Skills:

Program Management: Directed projects from concept phase to production release by managing Detail Product Design Reviews, technical cost issues, scheduling and manpower needs. Liaison with System Director, CFT Members, Pilot Manufacturing, SBM’s and Suppliers to clearly define ERS and Project Scope requirements and provide repeatable cost-effective solutions and ideas. Personnel Management: Effectively communicates and motivates all levels and disciplines of personnel to accomplish tasks with aggressive schedules. Trained and mentored Lam College Interns. Reliable “Go-To” key idea contributor in CFT’s and Mentor for many NCG’s and Junior Engineers at Lam. Mechanical Hardware Engineering & Innovation -: System and Detailed Design of Semiconductor Process Equipment including Plasma. and Ion Beam Etch, Strip and Deposition Process Modules; Precision Laser/Optical hardware and HVM Tooling Fixtures; Power Transmission components; structural weldments. Broad experience using ferrous/non-ferrous metals, plastics, composites, ceramics, and elastomers. Continuous innovation through multiple Additive Manufacturing IP filings. Electro-Mechanical: Commercial and military packaging of RF Electronics; Amplifiers, Generators and Match Networks; EMI/RFI enclosures; Rack and Chassis; CE-marked Cabling and Harnesses Laser/Optical: Design of Laser Amplifiers; Polarizers; Spatial Filters; Calorimeters. Interferometers; Pulsed-Dye Laser Control Systems; Beam-path steering components such as Mirror-mounts, Beam-splitters, Water-cooled shutters; Seismically isolated Optical Table Breadboards with kinematic positioning system. Vacuum: Stir-welded/Machined Hi-Flow Vacuum Chambers; Turbo pumps; Custom Ultra-Pure Gas Box and Valve design; motion/electrical feed through; welded and formed bellows Experience

Lam Research May 1993 – May 2023

R&D Mechanical Hardware Engineer of Next-Generation Products Manufacturing Engineer of HVM Global Products

System Hardware Design Engineer Sensei L6 & L10 Etch Platform. 2300 E4,E5 & E6 Legacy Products Designed Upper Frame Assembly supporting RF Generators, FIB & Gas Box Delivery Systems over 10Klbs. Designed Field Install/Removal Concept for Gas Box Track and Dolly System. Designed Dual-Precursor BTBAS Aegis Vapor Delivery System for 2300 and Sensei Products. Lead System Designer for Lam 450mm Alpha System Consortium, University of New York, Albany Lead System Designer for Integrated Tool (Etch, Deposition, Clean, IBE, Strip) Lead Designer for Ion Beam Etch collaboration with Veeco Inc., Long Island, NY (Pre-Kyber) Lawrence Livermore National Laboratory – ICF Kaiser Engineering 1989-1993 Responsible for Design of Dye-Wall Laser Chain Chamber Vacuum System for Uranium Atomic Laser Isotope Separator (U-AVLIS).

Lead Designer of Module Optics Package. Designed Beamlet Test Prototype (Pre-National Ignition Facility- NIF) and GEO-STAR (Geostationary Artificial Star Project) Patents/Disclosures

1. US Patent # 10,665,435 “Chamber with Vertical Support for Symmetric Conductance & RF Delivery” 2. US Patent # 8,895,452 “In Situ Adjustable Gap and Planarization Etch Process Module Chamber.” 3. US Patent #8,083,855 B2 “Temperature Control Module using Gas Pressure to Control Thermal Conductance between Liquid Coolant and Component.” 4. US Patent #8,043,430 B2 “Methods and Apparatuses for Controlling Gas Flow Conductance in a Capacitive- Coupled Plasma Processing Chamber.”

5. US Patent #7,211,170 B2 “Twist-N-Lock Wafer Area Pressure Ring and Assembly” 6. US Patent # US 2003/0196755 A1 “Confinement Ring Support Assembly” 7. US Patent #10-2432209 “Integrated Tool Lift” (Universal Service Fixture for Sensei - USF) 8. IDF-10197 - Provisional - “Additive Mfg. of Thermal & RF Elements within Cavity of Process Hardware” 9. IDF-09422 – Provisional - “Cluster Tool Lift Design” 10. IDF-09319 – Filed – “Left, Right, Center Split Chamber Concept.” 11. IDF-10760 - Filed – “High Heat Capacity Liquid Cold Plate Invention for Cooling of TCP Window” Education/Software

• AS Degree- Mechanical Engineering, Laney College, Oakland Ca.

• LEAP Additive Manufacturing Certification

• Principles of Plasma Discharges and Materials Processing Certificate

• DFMEA, PFMEA and SFMEA LEAP Certification

• Statistics for Engineers

• RF Theory of Operation

• TeamCenter – NX – SAP – iPLM - CellFusion – SolidWorks - Creo – Windchill- Velocity EHS

• Advanced GD&T Certification

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