Summary:

A licensed Electronics and Communications Engineer with broad knowledge and experience in electronics and semiconductor industry. Through the years, have worked as a process, new product development, quality and manufacturing engineers delivering results with significant impact to company’s goals and growth. An Engineering and Operations Manager of a multi-national firm managing its subcontractor inclusive of assembly and test operations, raw materials and finished good warehouse management and shipments, An NPI Manager of automotive QFN/MEMS products, and functioned as Program Manager and Technical Program Manager of Power Modules. Have handled various projects, packages positions, and people; worked with suppliers, customers, and people from within Operations and Support groups and chaired various teams to ensure a smooth and error-free delivery of projects as per schedule. Technical Program Manager February 2020 to April 2022 Integrated Microelectronics, Inc. Laguna Technopark, Binan, Laguna

• Leads a team from various departments in driving projects from conception to mass production; drives it to completion via APQP with emphasis in addressing the technical intricacies and issues that can potentially delay project timeline.

• Chairs in defining, evaluating, and recommending various materials, equipment, processes and other factors for product and process solutions.

• Handshakes the product to Operations ensuring that all project deliverables are done, goals and landing zones achieved as per project timeline.

Program Manager April 2019 to January 2020

Integrated Microelectronics, Inc. Laguna Technopark, Binan, Laguna

• Chairs a team of engineers in Program Management handling automotive and industrial grade power module packages inclusive of feasibility study/assessing products worthy of RFQs; dealing with the customers for product acceptance/contract signing, presents to Management the pros and cons of various projects and how to go about it.

• Discusses and offers to Top Management alternative solutions on critical items that may affect business projections and as appropriate and communicates such to the customer.

• Ensures that all projects are within the projected maturity timeline and taps all departments to execute deliverables for any potential delays.

NPI Manager October 2016 to April 2019

ST Microelectronics, Inc. LISP 2, Calamba, Laguna

• Develops and qualifies new component packages (QFNs, MEMs) and process bricks following the ST SOP269 package development framework in supporting various business requirements.

• Understands gaps of new package through Technical Gap Analysis (TGA), feasibility studies and risk assessments, Design and Process bricks mitigation.

• Package Development and Review; follows the APQP Package Development Maturities; establishes workability and characterization before rolling out of the 1st prototype and engineering samples; freezes the process and start change management; plans, organizes and executes project milestones and deliverables.

Senior Process Development Engineer April 2015 to October 2016 Microsemi Semiconductor Philippines, Inc. LISP 1, Cabuyao, Laguna

• Chairs in developing, qualifying and transferring various ICs and discrete packages – both commercial and military grades - new assembly flows, materials, equipment; prepares and endorses them to production for high volume manufacturing set-up.

• Drives efficiency and productivity through process improvement and effective maintenance of equipment; sustains production line, drives and implements improvement programs for process health to meet/exceed indices which include assembly/test yield, quality, volume and cost.

• Works with various business units and other functional teams to address pressing issues in the line; provides recommendations to Management to permanently address recurring issues. Manager – Sample Build September 2014 to March 2015 Nidec Precision Phils. Corp. Laguna Technopark, Binan, Laguna

• Leads a department composed of Engineering, Production and Planning that develops new products, provide samples to the customer, enhance and improve them and putting them into mass production mode.

• Provides direction, sets targets and creates system to continuously improve the current functions and activities that will lead to the team’s development and effective contribution to the company.

• Proposes alternative solutions to the Management owing to process flows, materials, equipment to be used, etc.; negotiates and justifies prices of products to the customers. Engineering and Operations Manager November 2000 to July 2013 Altera Corporation Laguna Technopark, Binan, Laguna

• Chairs in qualifying new packages, materials and technology; collaborates with sub-contractor’s engineering in ensuring successful qualification like Cu wirebonding, FlipChip/BGA packages. FCIR, green/low-alpha mold compounds, etc.

• Ensures all operations and its indices meet or surpass target goals. These include assembly and test yield, cycle time, open-shorts, consigned equipment utilization, consigned direct/indirect materials inventory, Die Bank inventory, Finished Goods Store and month/quarter/year-end shipments.

• Meets with subcontractor’s top management to discuss Altera’s goals and expectations; drives and demands for improvement plans, monitors implementation, validates results and checks that they meet Altera’s standards.

Senior Package Development Engineer June 1999 to October 2000 PSI Technologies, Inc. FTI Complex, Taguig City

• Supervises a team of engineers qualifying power discrete packages, new products, processes, direct and indirect materials both in assembly and test.

• Defines critical assembly and test processes following APQP concept, establishes systems and controls, documents them, trains production personnel, endorses the new products for mass production; monitors indices and ensures it meets the goal before fully endorsing them to sustaining engineering.

• Updates management the progress of new projects for production rollout; provides inputs and recommendations owing to process simplification and/or integration, materials, equipment, tooling, vendor selection and the like.

Process/Technical Development Engineer August 1995 to May 1999 Amkor Technology Philippines, Inc. NSC Compound, Muntinlupa City

• Develops new packages that include Vision Pak, CABGA, EPBGA, SAW Filters and various hermetically sealed ceramic packages both commercial and military grades.

• Supports Hermetic assembly line building package like PGA, CDIP, LCC, including Die Sales products focusing in FOL stations from Pre-Assembly, Wafer Mount to Wirebond.

• Leads a team of engineers in developing and qualifying next generation of materials, equipment; trains new engineers, technicians and operators.

Quality Assurance Engineer June 1994 to July 1995

Amkor Technology Philippines, Inc. NSC Compound, Muntinlupa City

• Leads a team of QA engineers, QC supervisors/inspectors in handling audits on specs deviations, customer concerns, documentations, etc., tracks the closure of committed actions and audits implementation in the line.

• Implements statistical tools in the line (Six Sigma, Control Charts, FMEA etc. and requires continuous improvement programs from Operations on critical stations.

• Responsible for tracking and ensuring quality through systems improvement owing to quality indices such as IVI, FOI, LAR, CAR; initiates quality programs and drives for its implementation. Process/Product Engineer October 1990 to May 1994

Electronic Assemblies, Inc. Severina Compound, Paranaque City

• Develops and puts in mass production various PCB and FPC Surface Mount Technology products which include mother boards, TV tuners, isolation amplifiers, voltage-controlled oscillators, hybrid packages, bobbin transformers, etc.

• Qualifies direct /indirect materials that will be used in these products either as a new one or a replacement of the current material. These include solder pastes/wires, fluxes, cleaning agents, PCBs, trays, tubes, etc.

• Sustains Front-Of-line and End-Of-Line stations as team leader of PCB/FPC SMT lines; monitors assembly yield, test yield, cycle time, lot rejection rate and provides analysis and corrective actions for continuous improvement.

Notable Projects and Accomplishments:

Power Packages (Acepack1&2/SMITPack/WolfPack1-3/Valeo) DBC Modules in IMI Lacewing PCB Medical product for COVID and other pathogens testing kit in IMI Package/Product qualification automotive QFNs (STOD39/UR5E/UR6F/STUSB/Chorus/Delphi) in STM Procurement and Qualification of KnS8060 Ultrasonic Auto Wire bonder in Microsemi Qualification of various metal can military grade packages in Microsemi SBGA Wirebonding for Fine Pitch and Staggered Bonding using KnS Iconn/ASM Eagle 60 in Altera Process migration from Ink to Laser Marking on various plastic and BGA packages in Altera Green and Low Alpha Mold compound qualification for various plastic packages in Altera Wafer Saw process enhancement to address corrupt imprint issues at Test in Altera Development and Qualification of MQFP208 MIR (Stacked Die) Package in Altera Inkless Wafer Map Process using OCR/Non-contact Wafer Mounting in Altera Development and Qualification of MQFP100 Back-to-Back Package in Altera Wafer Backgrind Capability of 12in wafers to 7mils final thickness in Altera Cu Wirebond Technology implementation on plastic packages in Altera LASER Sawing Process Development and Qualification in Altera Flip Chip BGA Product Development and Qualification in Altera Full qualification of soft-solder discrete power packages (TO264/TO220/DDPak) in PSI Full Qualification of TO220 Full Pack with retractable pin mold tool design in PSI Development and Qualification of VisionPAK (camera/optics packaging) in Amkor. Epoxy Die Attach paste writing capability and qualification for Alphasem Swissline 9000 in Amkor Migration of Solder Sealed Packages from QMI2419 Ag-glass to JMI700 Cyanate Ester in Amkor Dispensing Process (Dam/Fill) of ePBGA using Cam/Alot 7000 volumetric dispenser in Amkor Design/qualification of two-layered stencil for enhanced solder paste printing in EAI Qualification of Flexible Printed Circuit SMT Line for full auto set-up in EAI Special Skills:

Program/Project Management

Subcontractor Management

Package/Product Development and Roll-out

New Product Introduction

Technology Transfer and Fan-Out

Business Quotes, Design, Manufacturing Analysis

Materials and Equipment Qualification

Total Quality Management

Supplier Qualification

Cost Reduction Programs

Suppliers, Process and Systems Audit

Technical Papers:

Filletless Die Attach Using JMI7000 Cyanate Ester Paste Published in ASEMEP

Elimination Of Glass Delamination On Vision Pak

Published in Joint Engineering Council for Excellence (JECE) in ATP Education:

Mapua Institute of Technology

Manila, Philippines

Bachelor of Science in Electronics and Communications Engineering (BSECE); Passed BSECE Board Exam with License No. 0005628

San Andres Vocational School

San Andres, Catanduanes, Philippines

High School; Graduated Salutatorian

San Andres Central Elementary School

San Andres, Catanduanes, Philippines

Elementary

De La Salle University

Taft Avenue, Manila, Philippines; 1995

MBA Units earned: 20

Reference:

Ms. Jean Ramos

Head of Packaging Platform

Infineon Technologies

+65-90120014

Mr. Sean Toledo

Manager – PMG

ST Microelectronics

+63-995*******

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