Daniel Lee Tyler

*** ****** **. *****: 503-***-****

Crowley, TX 76036 adxxnq@r.postjobfree.com

PROFILE

Failure Analysis/process analysis engineer with over 5 years of experience in determining root-cause of device failures in semiconductor logic, flash memory and field-emission devices.

Over 23 years experience working with SEM and TEM microscope systems.

RELEVANT SKILLS AND EQUIPMENT EXPERIENCE

· Scanning Electron Microscopy · Energy Dispersive Spectroscopy

· Transmission Electron Microscopy · Electron Microscope Maintenance

· Liquid Crystal Analysis · Near-IR Emission Microscope

· Auger Microprobe · Dual-Beam FIB Mill

· Probe Test Stations · Micro-cleaving Apparatus (SELA)

· Wet Chemistry · Test Bench Electronics

· Wet Lapping/Polishing Machines · Electrical Probe Test Data Analysis

ACCOMPLISHMENTS

· Set-up and managed complete semiconductor failure analysis and reliability lab, including writing SOPs, work request submission forms and databasing of jobs to effectively feedback device performance and failure test data to product management

· Developed method for real-time analysis of driven triode electron cathode in SEM

· Created novel method of In-Situ vacuum stress analysis of driven field-emission cathode

devices with near-IR emission (Hg-Cd-Te) microscope

· Developed electrolytic etching/staining technique used in conjunction with low accelerating voltage in SEM to delineate semiconductor dopant implant well profiles

· Trained a total of 31 engineers and technicians in the use and care of SEM, TEM and EDS instruments, sample preparation and deprocessing techniques

PROFESSIONAL EXPERIENCE

Independent Consultant Ft. Worth, TX 6/14 – Present

Interact with semiconductor companies, Zeiss and GenTec regarding electron microscope

calibration and repair of scanning electron and transmission electron microscope systems.

FEI Company Hillsboro, OR 1/03 – 5/14

Senior TEM Service Engineer

Install, service and maintain a variety of TEM instruments including: 120 kV Tungsten & LaB6

source, 200-300 kV field-emission and LaB6 TEMs with an emphasis on Gatan (GIF) cameras,

HR-STEM and HAADF detectors.

Perform initial site surveys for system installations.

Setup and calibrate EDS systems for X-ray mapping in STEM.

Update software and train customer for electron tomography, +/- 73 range, 1.0 Å resolution.

Install software updates and routine service contract system routines.

Daniel Tyler 503-***-**** Pg. 2

EXTREME DEVICES Austin, TX 3/01 – 10/02

Failure Analysis Engineer/Reliability Lab Manager

Characterized root-cause failure modes and mechanisms, performed process characterization and

defect reviews and characterized Fowler-Nordheim tunneling parameters in the production of cold-

field emission, CVD grown diamond cathodes. Experience using electrical test data to map

circuit fails and using electron microscopes, EDS, emission microscopes, liquid crystal analysis,

destructive analysis, probe test stations, FIB circuit editing, test bench electronics and depackaging

and deprocessing techniques for fault isolation and characterization of failure mechanisms

Used ICP/MS, JEOL SEM, EDS, dual beam FEI FIB mill and liquid crystal analysis for circuit failure analysis and packaging failures. Performed routine lab tests and certificates of analysis.

Prepared and analyzed cross-sectioned samples for construction analysis. Used FIB mill and Knights navigation software for blue-wire circuit edits. Prepared engineering FA reports and presentations for process engineers, product managers, executives and board members.

ADVANCED MICRO DEVICES, INC. Austin, TX 9/97 - 3/01

Associate Engineer; Analytical Production and Stress Lab

Carried out semiconductor production support, process analysis, fab tool qualifications and

defect reviews with Hitachi, FEI and Jeol SEMs, Philips TEM and FEI FIB instruments, as

well as physical failure analysis of microelectronic devices. Hands-on experience with

SEM and TEM sample preparation using multiple deprocessing techniques, ion-mill

thinning and dual-beam FIB milling for process analysis. Also general semiconductor

production metrics such as fab tool qualifications, cross section construction analysis, metal step

coverage and bump metallurgy of flip-chip packages.

SULZER ORTHOPEDICS, INC. Austin, TX 3/93 – 9/97

Senior Research Technician

Carried out failure analysis, fatigue fracture analysis and materials characterization of medical grade titanium and cobalt alloys with porous titanium coatings for orthopedics implants using metallurgical sample preparation and supervised Jeol 1200 SEM/Analytical lab.

Managed and carried out research project to determine subsurface oxygen content in polyethylene with FTIR spectroscopy. Developed four-point load fatigue test and galvanic corrosion testing of biocompatible cobalt-molybdenum alloys. Wrote various laboratory procedures in preparation for ISO-9001 audit. Prepared engineering reports and presentations for product line managers.

GENERAL DYNAMICS Corp. Fort Worth, TX 7/89 – 5/91

Materials Test Technician

Processed aluminum and composite sample materials for F-16 and A-12 aircraft to analyze

test sample metallography and composite microstructures.

Evaluated test materials and photographed samples on metallurgical microscope and photographic table. Prepared samples of composite test materials with metallographic preparation and imaged through optical microscope.

Performed hardness testing with both micro-hardness and Rockwell hardness testers.

Performed heat treatment of SS, Aluminum alloys and 4340 fatigue test fixtures with oil and water quenching.

Carried out fatigue and fracture analysis with Leco optical metallograph, Jeol JXA 733-SEM and Jeol JEM-1200 EX TEM.

Daniel Tyler 503-***-**** Pg. 3

EDUCATION

B.A., Engineering Technology (minor in Chemistry), St. Edward’s University, Austin, Texas

A.A.S., Nondestructive Inspection and Materials Science, Tarrant County College

PROFESSIONAL DEVELOPMENT

Quantitative X-ray Microanalysis of Bulk Specimens and Particles, Lehigh University

Microcharacterization of Semiconductor Materials, FAMS Conference

Corrosion Cell Testing and Electrochemistry, EG&G vendor training

AFFILIATIONS

Member, Electronic Device Failure Analysis Society (EDFAS)

Member, Microscopy Society of America

REFERENCES

Dr. Jeff Farrer, BYU, 801-***-****

Dr. Dave Belnap, University of Utah, 801-***-****

Joel Paul, 281-***-****

Contact this candidate