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Assembler III

Location:
Phoenix, AZ
Salary:
$30 hourly
Posted:
June 13, 2023

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Resume:

Peter Gonzalez

**** *. ***** ******* ***

Phoenix, AZ 85041

Email: adxo13@r.postjobfree.com

Cell phone 602-***-****

OBJECTIVE: Seeking a challenging position utilizing workmanship experience, skills to contribute to the success, progress, and growth in all fields of electronic manufacturing and aero-space flight. PROFESSIONAL PROFILE:

NORTHROP GRUMMAN

May 2013 to Current

Conformal coat: Reading of schematics/drawings for correct masking criteria. Leading daily production meetings, breaking down issues, improvement of processes, daily output and safety issues.

Knowledge of materials and procedures,

meeting with customers and military officials for walk throughs showing/explaining the various processes.

Staking of various circuit board components using different adhesives. Using MES system for data entry of serial numbers, board numbers, dates, time of day, room/oven temperatures, equipment bar codes, lot numbers, expiration dates, cure times. Physically lifting and measuring of chemicals to their correct ratio using scale in gram measurements. Potting of cables connectors,

air brush spraying of conformal coat on required areas of boards using nitrogen air. Magnified black light inspection and touch up of all boards, keeping inventory of all chemicals and discarding expired.Daily 5S procedures and tool log. HONEYWELL

October 2011 to January 2013

Material Handler/Coordinator: Expediting APU parts to their correct engine cart, locating engines, verifying serial numbers, engine numbers, costumer and special requirements. Visual inspection of parts and required 8130 FAA documentation on select parts, tracing and installing of parts into Honeywell's SAP system. Taking inventory of all engines in gate II area, filling engine line holes and entering cart information into engine log data sheet. Taking down fully traced engines to their correct line for mechanical assembly. knowledgeable in 5s, PPE, Recycle/Sort, Dot wimp and OSHA. GENERAL DYNAMICS

July 2009 to February 2011

Assembler III: Winding different size cores using single, bifilar and quadfiler methods with various wire gauges. Wiring cores counter/clockwise continuously or bank windings, stripping and tinning leads with SN10, SN63 solder pots. Serializing parts and tagging leads with Brady LS2000 to specific costumer required information, measuring leads prepping wire lay out and routing to assembly instructions. Insulating cores using various taping methods and measuring dimensions for required height and width. HAMILTON SUNDSTRAND

February 2008 to February 2009

Production Associate III: Overhaul and repair of electronic control systems utilized for power flight distribution corporate and military. Inspection of various units for damage, scratches, paint, missing or lose hardware and proper labeling. Building to print units for final inspection, making labels, data entry, oven logs, mixing of required paints, adhesives and inks. Prepping/Cleaning units and connectors with alcohol/Acetone and pressurized air. Use of torque wrenches, power tools and sum hand tools.

WHITE MICRO ELECTRONIC DESIGNS

August 2006 to February 2008

Wire Bonder 2/Package Clean Operator: Wiring various BGA substrate and Ceramic packages on ESEC 3018 automated bonding machines. Responsible for the setup of machine, wire changes, cap changes, loading recipes. Qualification of various machines to ensure production of parts exceeds company specs, non-destruct/destruct wire pulls and 100% visual inspection on LEICA microscope and 180 degree bakes. Measuring package loop heights on Vision Gauge, Data entry of results into SQC/SPC computer and logbooks. Plasma cleaning BGA packages with argon gas, Cobehn cleaning BGA/Ceramic packages with pressurized alcohol and ionized Nitrogen.

HONEYWELL APC

April 2005 to April 2006

Assembler 2: Building and wiring to blueprint upper and lower head assemblies. Using power tools, air hose tools, handheld tools, crimpers, soldering iron, wire strippers, straight edge, use of various adhesives and chemicals. Building upper and lower heated air wipes to print, install of quarts plates and light pipes into heads. Assembling outer covers to print, testing wire harnesses and grounds. Measuring and cutting air hoses to length, stock flowing parts trough Oracle system and MS 2006 professional series knowledgeable.

MOTOROLA COMPUTER GROUP

April 2004 to September 2004

Modification-Hi/low power microscope inspection, wire wraps, wire routing, glue dots, through hole/surface mount soldering, J-standard, jumper wires, rework, clean flux, Loctite, and wire stripping. ATE (Automated test equipment) Hp 3070 test machines-- testing various computer boards and changing fixtures to run boards. Computer-FMS (Factory Management systems) scanning in board serial numbers, Precision Machinist, Assembly Mechanic, and Hand Finisher. IDEAL AEROSMITH

June 2003 to November 2003

Duties include building wire harnesses for aviation test equipment, also include data entry, inspection, rework, wire crimping, wire stripping, soldering, buss bars, material measuring, building to print and quailing required tooling for cable compliance.

HONEYWELL

January 2002 to June 2003

Clean line operator-Tasks include cleaning various aircraft engine parts in chromic acid, etch, oakite rust stripper, hot soap water and alodine tanks. Responsible for running ovens loading the carts, data entry and staging.

FLIP CHIP TECHNOLOGY

February 2000 to December 2002

Final visual inspector-Served as a inspector for defects in workmanship on 4, 5, 6 and 8 inch wafers on August tooling and manual scope. Data logging and expediting wafers throughout production cycle. Certification as follows clean room, wafer handling and transferring. Lotus notes and Microsoft widows 98 knowledgeable.

WHITE MICRO ELECTRONICS

June 1996 to November 1999

Wire Bonder 1/Test Operator-Wiring of various electronic chip packages for government and vendor customers, Blueprint reading, wiring and visual inspection on turbo machine and manual scopes. Testing chips in extreme hot and cold conditions, 300 degree bakes, data logging, cleaning parts, rework and wire pull testing.

EDUCATION:

Graduated from Central High School class of 1996.

Attended Metro-Tech vocational school for Fire Science



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