Francis W. Reid

*** ******* **** *** *, Arlington TX – Tel: 817-***-**** Cell 682-***-**** – email: adxifw@r.postjobfree.com

Seeking a responsible position with growth potential in Sales/Engineering Management

SUMMARY OF MAJOR PRODUCT/PROJECT ACCOMPLISHMENTS:

Deliver to Manufacturing, HW/SW Tool to Probe wafer for impurity concentration of the Silicon

Breakdown Voltage tester to Determine frequency and voltage where break-down occurs in CMOS capacitors.

6 Sigma Route cause Fault Analysis on component failures including field failures.

Prepare and deliver A “GO TO MARKET” Plan to Launch a Micro BGA package for Memory Applications.

Designed a Video Surveillance System Using Line of Site and Mesh Technology Viewable from anywhere.

IEEE Recognition for Production Application Support on Motherboard Evaluation.

Host Customer Meetings to discuss future product road maps that include specifications and performance.

Major Design wins in Chip Scale Packaging, Pentium Chipsets, Wireless / Wireless Mesh, and Telecom.

Successful Business Consulting - Relationship Management for continuous Product Improvements.

Successfully Developed Residential, Commercial, and PPA Solar Accounts.

PROFESSIONAL EXPERIENCE:

PMR - Products, Components, Logistics (Owner of Startup) Dallas, Georgia (Closed down) 12/2015 – 06/2022

General Manager:

Representing various manufacturers in a wide variety of electronic components and Products

Territory/ Account Development, support distribution to increase sales, resolve customer issues, pricing issues market research to

Understand Technology and industry trends.

Inscape Data (802.11 a/b/g/n) MIMO (contract) managed 4 people San Jose, CA 03/ 2010 – 11/ 2015

Turnkey Solutions for Outdoor Poe Wired/Wireless and IP Video Appliances & management software

National Sales Engineer/Project Manager; Responsible for daily Sales Operation activities that include Customer Services, Shipping Channel Development, and Management in Various Markets; Prepare RFQs for Wi-Fi, Video Surveillance Systems Design Markets sold into are the following: Hospitality, Education Government, Industrial, Enterprise, Healthcare and security Surveillance over wireless.

Pre-sales (interpreting customer requirements and recommending appropriate solutions – design applications as appropriate)

Recommend Radios and Antennas for specified applications.

Provide Customer Design and installation assistance as needed.

Projects design and management throughout the deployment

Provide RFQ/RFI for specific projects per customer request.

Supply chain management and analysis

Mesh Dynamics Inc. (Wireless Mesh for the outdoor Enterprise) Santa Clara CA 2/2008 – 2/2010

Lead Generation/Inside Sales Manager (contract) managed 2 people.

Developed relationships at Verint that lead to lucrative contracts and partnerships.

Compiled potential wireless mesh opportunities in various applications (mobility, surveillance, mining, Military, Perimeter)

Cold call “C” level management to introduce wireless mesh products, and secure lucrative contracts.

Project design and management throughout Mesh Wi-Fi deployment, Antennas recommended and sold was Omni Directional

Sector, Up, and Downlink spread.

Page 1 of 3

Francis W. Reid

Silicon Microstructures a Pressure Sensor (MEMS) Company Milpitas CA 4/2003 – 11/2007

Supply Chain Management

Cost reduction

Vendor Materials support and management

Regional Sale Engineer /Project Manager / Technical Support Engineer (Package and Die Sensors)

Responsible for Sales Reps, in Canada, West and Midwest US (Provide training and product update) - $1M revenue goal

Work with planning, engineering, shipping/receiving, and manufacturing to ensure on-time product delivery.

Provide weekly reports to upper management, and quarterly forecasts which include sales channel roll-up,

Negotiate contracts for sales representatives, global account responsibilities, and pricing negotiation.

Tessera Inc.,(an IP Company Chip Scale Packaging) San Jose, CA. 3/2000 – 3/2003

Sr. Technical Marketing Engineer / Liaison (SDRAM, DRAM, FLASH)

Responsible for collateral material, data sheets for micro-BGA Product Packages, Test Vehicles, and Lead- free programs

Project management; design through development, fabrication, and reliability testing.

Wrote application notes for Eutectic and lead-free micro-BGA packages.

Launch (micro-BGA) Products in the USA and Asia

Demo Software to several companies in Hsinchu Park and Kaohsiung Taiwan, Pin through Hole Vs Micro BGA packaging

Developed data sheets for micro-BGA packages and Test Vehicles for customer availability.

Drove chip scale standards to assure JEDEC compliance.

Technical Liaison

Developed and maintained business relationships with current and future Tessera licensees in Asia and the U.S.

Collaborated joint ventures of mutual interest to become future licensees.

Initiate NDAs to negotiate NRE (none recurring expense) for project development and sample delivery

Sager Electronics, Component Distribution San Jose, CA 2/1998 -2/2000

Western Region Field Applications Engineer

Provided application support to the Sager sales team, and strategic and target accounts. Focus lines-Telecom, Networking, mix-signals, DSL- ICs, Power Supplies (ac-dc, dc-dc, converters -custom designs), provided pre & post-sales engineering support to customers through pre-production, provided quarterly training on Level1 Communications Products, Telecom (short /long haul transceivers) HDSL, HDSL2, chipsets, T1/E1, Ethernet, and SONET/SDH Knowledge of MPLS, ATM WDM and DW, Design components into customer projects.

Specific tasks – while working with Sager Electronics as FAE, I was assigned to travel with sales to resolve any obstacle that occurred during the sales process (HDSL. HDSL2, DSLAM, ADSL) SONET/SDH Hierarchy, Power conversion including APC and Digital Power

Work directly with customer engineers on several projects (simulation, design, performance)

Critique customer designs (look at common mistakes that could compromise performance)

Modify as necessary to meet all design criteria and readiness for manufacturing.

Work with customer engineers and assist through a pilot run to determine production readiness.

Signoff design readiness and performance for full manufacturing production

Strong networking knowledge (TCP/IP, Routers, Switches, VPNs, etc.)

Computer /Data Security Systems

ACC Microelectronics Corp., Computer Peripherals Channel (went out of business) 5/1995 – 1/1998

Regional Sales Manager - (went out of business) managed up to 6 people in each location.

Responsible for Central and Eastern US Sales with a revenue goal of $5M selling Desktop, Notebook, Embedded Computer Core Logic’s & I/O, drove $2M in sales at Texas Instruments annually, drove organizations and personally developed key strategic accounts in Central and Eastern USA, Provided competitive analysis, sales forecast, pricing, planning, and projections.

Direct all regional channel sales activity, and gain mindshare from reps.

Other responsibilities included account development and management in Government, Gaming, Hospitality, consumer, and Education.

Page 2 of 3

Francis W. Reid

(IBM) International Business Machines Austin, Texas / East Fishkill New York: 1/1980 – 4/1995

Sr. Product / Application Engineering Manager: Pentium and 486 Mother Boards, managed application lab, address board issues worldwide, set up application laboratory to simulate problems reported in the field, managed call center accommodation.

Signal Integrity Engineer: simulate drivers and receivers interconnect with transmission lines at 200-300 Mhz.

Assess various terminations (source, far end) including process variations; and developed guard-band.

Design Engineer: Developed power/data sequencer to prevent latch-up in TFT flat panels if they were powered.

Separately, integrate TFT flat panel with PC, demonstrated at Las Vegas, NY, and TX

Peripheral Service Partners Part Time Austin Texas 1990 - 1994

Technical Support Engineer (PT) 386,486 Pentium Base Hardware Platforms, Commercial Peripherals products including.

CD ROMS, Modems, various multimedia games software, Printers running under Windows and DOS

6 Sigma Quality Engineer; Responsible for all system components, developed a failure analysis process to Determine.

Root cause failure analysis, implement processes to prevent future failures in IC’s (MBNQA) Malcolm Baldrige award)

Process Engineer (Semiconductor FAB) Responsible for C4 bumping, (Cr, Cu, Au) chrome, copper, and gold evaporation, ashore proper thermal cycle, C4 bump meets process criteria, inspect exposed land patterns on photoresist that they

Are fully developed, inspect all layers of photo deposition from layers a-g for proper photoresist deposition towards the edges of wafers which could cause low yield – performed continuous manufacturing processes improvement to increase yield.

Responsible for manufacturing systems design /delivery maintenance, maintainability Training (ROI / P/L), Manufacturing process tool automation

C4 Interconnection Development Engineer; substrate rework and development (TCM, MCM, and SCM) evaluate 90mm.

Responsible for developing manufacturing process tools to probe silicon and determine impurity concentration of the EPT-Layer

Test & Measurement Engineer; Responsible for the simulation and evaluation of all chip designs for IBM 3090 and test methodology application; Methodologies were applied across competing technologies (CMOS, Bi-CMOS, and Bi-polar) Process defects fault finding through simulation, add redundancy to reduce the probability of faults occurring

ASTAP defect simulation analysis and evaluation of logic circuitry for testability

Varian Instruments Division Sunnyvale CA covering the Northeast 1976 - 1980

Sr. Field Service Engineer: Analytical Instruments, Electro/Mechanical Research Instrumentation (UV-VIS, atomic absorption spectrophotometer) Covered the Northeast – Installation, Training, Preventative maintenance, and performance verification.

Computer Skills

Programming languages; C. Assembler, Basic, PL1, REXX, PLAS, and JCL.

Word Processors; Microsoft Office MS365, Excel, PowerPoint, Word 2010, ASTAP (Advance Statistical Analysis Program)

Operating Systems; Aix, OS/2, Windows 95, 98, 2000, Windows NT, Windows XP, Vista, Windows 10, ACT, MAS90, Access,

Office 365

CRM Based Tools: Sales Net, Sales-Force, Sugar, Zoho, WebEx, and Go to Meeting

Workshops: Exhibitor workshop training Comdex, PC Expo, etc.

Writing / Editing Tools; Adobe Photoshop, PhotoBase3, Adobe Acrobat, Acrobat Distiller, Page Maker, Express

Additional Skills; Team Building, Time Management, Value Selling (Miller Heiman) Self Starter, Reliable.

Education: B.S Electrical / Computer Engineering Empire State College State University of New York

A.S Electronic Circuits and Systems Technical Career Institutes New York, NY

Diploma Air-conditioning/Refrigeration Brooklyn YMCA Technical School, Bklyn, NY

Page 3of 3

Contact this candidate