RODOLFO PAEZ
**** ********** *** *******, **. ***36
C: 1-408-***-**** adwshs@r.postjobfree.com
PROFESSIONAL SUMMARY
Field Service Engineer for more than 20 years who made tremendous contributions to semiconductor industry for being flexible and efficient by keeping high level of customer satisfactions in a large semiconductor electrical failure analysis group.
SKILLS
Electro-Mechanical
Microsoft office software
Customer Service
Scanning Electron Microscope & FIB
Photon & thermal emission detection cameras
Management and process improvement.
System Integration
Laser scanning microscopy
Nano Probing
IC Failure Analysis & Semiconductors
WORK HISTORY
JAN. 2019 – PRESENT
FIELD SERVICE ENGINEER, CARL ZEISS
oPerforming Site survey, installation and maintenance of Crossbeam, SEM/FIB products.
oProviding daily support to customer assistance via phone or onsite service and application support.
oMaking sure all spare parts are returned for repair and unused parts are kept on inventory.
oWorked closely with technical support for critical issues and escalated problems.
oPerformed all software, PC and other upgrades at the customer site.
oPrepare all necessary parts list for ordering for yearly preventive maintenance.
JAN. 2008 – DEC. 2018
SENIOR FIELD SERVICE ENGINEER THERMO FISHER SCIENTIFIC/FEI
oManaging all on site, Installation, standard acceptance testing, user training, preventive maintenance, repairs, software installation, hardware and software upgrades and system calibrations.
oCoordinate facility requirements and performed site survey.
oProviding phone support or site visit to analyze and clarifies queries by research and troubleshooting.
oGenerated customer service report for all related departmental and field activities that have been carried out.
oConduct a postmortem analysis for complex technical issues and participate in various projects to ensure all departmental goals have achieved.
oDiagnosing technical problems or errors and determining proper solution.
oParticipates in the meeting and make recommendations to improved better satisfaction to the clients.
oOrdering parts and keeping the parts inventory on track.
oProficient on Scanning Electron Microscope (Zeiss SEM Supra 55), Small Dual Beams (FEI Products), water chillers, nano prober, piezo motors for X, Y and Z stage and controllers, plasma cleaner, current and voltage instrument (IV Curve tracer), signal generator, high bandwidth oscilloscope, spectrum analyzer, jack rabbit controller, mode lock laser, CW lasers, LVi/LVp and other CW IR lasers applications.
JAN 2003 – JAN 2008
STAFF CUSTOMER SUPPORT ENGINEER DCG SYSTEMS INC.
oSystem integration, installation, maintenance, HW/SW upgrades, and repairs.
oWorked on Laser Scanning Microscope (LSM) and its applications SLS/DLS. OBIRCH, laser voltage probing (LVP) for timing measurement. Laser voltage imaging (LVi) for frequency mapping.
oWorked on laser optics alignment and fiber coupling for 1064nm, 1320nm 785nm laser, laser noise tuning, laser power transmission characterization and calibrations.
oWorked on 2.9NA, HBF Solid Immersion Lens with and without water spray device cooling and heating.
oWorked on IC photon emission detection using InGaAs Camera cooled with LN2 or TEC.
oWorked on Thermal Mapping Camera (ELITE) for Integrated Circuit devices in package or sample prepped devices.
oWorked on water spray cooling for Integrated Circuit devices with PLC controlled system and Julabo heat exchanger.
oWorked on live image LSM to IC layout database alignment for probe navigation.
oWorked on Maridian IV, V, LVp/LVi (Laser Voltage Probing/Laser voltage Imaging), InGaAs Camera, MerCad, Hyperion, Elite (Thermal Mapping, Lock-in), nProber.
oNano probing system for IC transistor I/V analysis, oscilloscope, and signal generator.
oElectrical fault isolation using LVp, LVi, SLS, DLS, IR, CCD, and InGaAs Cameras.
JAN 1998 – JAN 2003
CUSTOMER SUPPORT ENGINEER CREDENCE/SCHLUMBERGER
oResponsible for answering customer technical queries by phone or on site.
oSystem installation, acceptance testing, maintenance, and repairs.
oGenerate report for all related service activities for system under service contract, time and material customer support.
oWorked on semiconductor automated test equipment and diagnostic equipment.
JAN. 1996 – JAN 1998
IC MASK DESIGN ENGINEER ROHM LSI PHILIPPINES
oDesign equivalent polygon of integrated circuit with the aid of CAD.
oCheck layout versus schematic by LVS tool. We used LEDIT for CAD and used LVS tool to check the interconnections of each element (transistor, resistor, capacitor, inductors)
oWorked in one block from the entire integrated circuit.
oDesigned resistor, capacitor elements and fit in the defined area.
JAN. 1995 – JAN 1998
ELECTRONICS DESIGN ENGINEER TELEFUNKEN PHILIPPINES
oSupported manufacturing by designing electronics controls (PLC) for injection molding equipment and automation. Utilized Siemens Micro Controller programable using ANSI C.
oDesign Electronics circuit using ORCad and build all necessary electronics circuits to control pneumatic valves. Including power supply, pneumatic valve drivers, oscillators, amplifiers, multiplexers etc.
oDesigned PCB layout and etched using ultraviolet light then build the PCB board.
oTest the finished project and rolled into production.
EDUCATION
APRIL 1994
BACHELOR’S DEGREE OF SCIENCE IN ELECTRONICS AND COMMUNICATIONS ENGINEERING
UNIVERSITY OF THE EAST (MANILA PHILIPPINES)