Michael Hansen
*** ****** ***** *******, ** ***25
Cell: 815-***-****
*****************@*****.***
Summary
After more than two decades in semiconductor applications engineering and later, sales management at companies like AMD, IBM, Samsung, PMC, Altera and Vitesse, in 2006 I returned to my first loves – electronic design and field applications engineering. I am listed as inventor or co-inventor on more than 25 patents. The products for which I have architected, designed and shepherded through agency approvals showcase my considerable technical skills that include embedded processors, analog circuits design, power conversion and motor drives, battery packs,battery management systems and AC operated battery chargers are currently being sold through outlets like Home Depot, Lowes, Grainger, Johnstone and Apple just to name a few.
Skills
Expert knowledge of embedded microprocessors including ARM Cortex, ST, NEC, Microchip/Atmel AVR and SAM4.
Proficient in C programming from application down to "bare metal".
Experience in wireless connectivity with multiple ISM and Bluetooth designs.
Expert in analog design for sensor processing, data conversion and power management.
Proficient in AC Induction, AC Synchronous, PM and BLDC motors and drives at power levels less than 2KW.
Expert in battery technology including secondary Lithium-Ion, NMH and Lead Acid variants (AGM, SLA).
Comprehensive knowledge of networking interfaces and interoperability at OSI layer 2 and below.
Solid technical presentation skills.
Excellent technical writing and communication skills.
Considerable experience in solid state (LED) lighting design and drivers.
Extensive experience in the design of switch mode power supplies.
Work Experience
Signode October 2022 to present.
Project Engineer (contractor)
Roselle and Glenview, IL
Signode again recruited me to return as a contract Project Engineer to update the GripPack industrial power tool product line I had designed several years earlier (2009-2017). Of special interest was increasing battery life and safety by employing a custom designed battery management module to be used all six product types. I designed and coded an advanced Lithium Ion Battery protection module into the legacy Grippack product line along with updating the firmware to take advantage of these new safety features. Furthermore I design and maintain purpose-built production test equipment for producing the GripPack line of industrial power tools as well as driving UL and CE agency approvals.
Rockwell Automation April 2022 to November 2022
Senior Controls Engineer (contractor)
Mequon, Wi
Hired as a contract Senior Controls Engineer to research and recommend alternate electronic components for use in manufacturing Rockwell Automation’s line of industrial control AC motor drives. The global supply chain crisis has caused line-down situations for Rockwell whereby critical parts were either obsolete or experiencing unacceptably long lead-times. I analyzed, compared and test alternated components in Rockwell products to facilitate building our product offerings. This position closed upon successful replacement of critical parts used in Rockwell’s Low Voltage Drive products combined with suppliers offering much better delivery performance than experienced during the global supply crisis.
TWS November 2017 to November 2018
Lakewood, Il
Senior FAE designing Li-Ion battery packs, BMS (Battery Management Systems) and AC operated chargers for numerous portable data terminals/handheld computers including the Zebra MC3300, the Honeywell CK65 and others. Imposition of tariffs on certain Chinese-sourced high technology products in Q1 2018 caused a significant drop in US revenue which decreased TWS market penetration in the US. At TWS I garnered considerable experience employing BMS semiconductors solutions from TI, LTC and others.
Cita Technologies March 2006 to October 2017
Senior Design and Applications Engineer
Buffalo Grove, IL
Working as a contract design and applications engineer I prospected, developed, architected and did electronic/electrical design on numerous products including:
FNA Pleasant Prairie, WI Designed, coded and shepparded through agency testing the intelligent gas and electric pressure washing equipment sold through Home Depot. The “Pressure Ready” products now on sale under the DeWalt name use the DeWalt 5S3P battery packs to run the starter motor of the internal combustion engine powered models.
Technical lead on the second generation Bias Power constant power module product line.
JB Industries Aurora, IL DV-40 digital vacuum gauge, DM-4 digital manifold and low cost Pirani sensor
Bretford Franklin Park, IL Power Sync Carts for institutional laptop and tablet charging, storage and software maintenance
Metropolitan Industries, Romeoville, IL Conceived and designed the Ion+ family of mercury-free hi-reliability sump pump control products
Signode Glenview, IL Designed and coded PM motor drive and control units for the BlueTooth connected, Li-Ion powered “GripPack” line of hand-held industrial strapping tools. Five varieties of GripPack tools are currently being marketed. Also designed and built an advanced automated battery tester for life testing Li-Ion battery packs and started proof-of-concept work on BLDC based strapping tools. Designed private-labeled version of the Bosch “Litheon” series BAT612 and BAT620 and companion AC operated chargers for use with the GripPack product line.
ML Technologies February 2003 to March 2006
Partner/Sales Engineer/ST Product Manager
Schaumburg, IL
Joined ML to manage ST Microelectronics and Vitesse Semiconductors lines. Major customers included Tellabs, Lucent and Arris. Technical and sales support of networking integrated circuits for Carrier Ethernet, PON and legacy optical (SONET) and wireline telecom standards.
Vitesse Semiconductors January 2000 to February 2003
North Central Regional Sales Manager
Camerillo, CA
From the NC office in Barrington, IL I managed the four rep territories in the North Central market consisting of IL/WI, OH/MI/IN/W.PA, MN/W.WI and KS/MO/IA. With Vitesse's offering of telecom and datacom chips major customers were: Tellabs, Lucent, Rockwell Collins, Rockwell AB, IBM Rochester and Seagate.
PMC-Sierra January 1997 to June 2000
Central Area Manager
Burnaby, BC
Managed a 20 state, six rep firm territory from Utah east to Pennsylvania for PMC-Sierra's high performance line of telecommunication integrated circuits. Major customers included Tellabs, Lucent, L3, Cadent, Motorola, Fore Systems and Adtran.
IBM Microelectronics August 1993 to January 1997
Central Area Manager
Barrington, IL
Managed 19 states organized into 6 rep firms. Major accounts included Cray, Tellabs, Philips, 3COM and Seagate. Territory revenues grew in excess of $150M/year.
Samsung Semiconductor June 1990 to August 1993
Central Area Manager
Itasca, IL
Central Area Manager
Managed 16 states and eastern Canada organized into 5 rep firms. Major accounts included Cray, Tellabs, Philips, 3COM and Seagate. Territory revenues grew in excess of $150M/year.
More employment history available upon request.
Education and Training
Stout State University - University of Wisconsin
Industrial Education - Electronics
Menomonie, WI
Freshman and sophomore years in industrial education was like repeating high school - transferred to University of Illinois Chicago and changed major to applied mathematics.
University of Illinois at Chicago
Applied Mathematics
Chicago, IL
After taking a year off to earn money for college I was accepted into the honors mathematics program. The challenge was refreshing but maintaining a normal course load including honors math and working part time proved to be unsustainable. An industry contact made my extensive knowledge of semiconductors, especially microprocessors, known to technical management at Advanced Micro Devices. This resulted in my being recruited me to be a Field Applications Engineer for AMD.
Activities and Honors
Extra Class Amateur Radio License holder
References
Available upon request