Process Engineer Tester

Zhixiong Xiao

**** **** ***, *******, ** *****. Email:************@*****.***, Cell:510-***-****

Work experience:

TDK Invensense, San Jose, CA - Senior Staff Foundry Engineer. 12/2021 to 03/2023

• Work with world well known foundries for MEMS IMU and microphone to solve technical problems.

• Prepare layouts for PCM test structures.

• Setup and join technical review meetings.

• Failure analysis and propose solutions.

• Improved key product yield to a reasonable rate.

• In charge of key process projects.

• Familiar with all the quality test(shock test, centrifuge, BHAST and THB, etc) GMEMS Tech, Milpitas, CA- Principle process engineer. 09/2019 to 11/2021

• MEMS microphone process development with multiple world leading IC/MEMS manufacturers.

• Build comprehensive data file for 6 products and data cor-relationship analysis.

• Data failure analysis for chip process and package.

• Process flow preparation for MEMS microphone and IMU(accelerometer + Gyroscope).

• 2 patent application and patent and literature investigation.

• Weekly meeting with foundries.

• Work with local vendors for parts investigation.

• Work with other foundries in US for IMU process preparation.

• Key technical support for process, data and failure analyses. TE connectivity/MEAS, Fremont, CA – Staff project Engineer. 4/2018 to 08/2019

• ANSYS simulation, Ledit layout, process development, test for low pressure (1in water column) capacitive pressure sensor.

• Failure analysis for piezo-resistive high pressure sensors.

• 85%/125C reliability test.

• Project timeline preparation.

Finisar Corp. Fremont, CA- Senior Process Development Engineer. 05/2013 to 2/2018 Process development for multi-fiber optic projects, which include CATV TOSA/SFP+ TOSA/100G CFP2 TOSA/100G QSFP28 TOSA/ROSA /COF TOSA/BOSA and 100G CFP2 Coherent/100G CFP4 Coherent TOSA etc.

• Process development, fixture design and application software development for receptacle laser welding (Nanosystec laser welder). Characterization and data collection and failure analysis.

• Process development, fixture design and application software development for Die attachment(MRSI+Tresky).

• Familiar with lens active alignment and epoxy selection and annealing.

• Familiar with seam sealing process and hermetic testing.

• Failure analysis for DFB laser diode and packaged TOSA/ROSA components.

• Work with software engineer to develop equipment.

• Write work instruction for laser welding, die attachment and lens alignment for multiple projects.

• Visit and transfer processes and projects to oversea manufacturing facility. Meggitt/Endevco, Sunnyvale, CA- Product development engineer -09/2007 to 03/2013.

• Design drop test accelerometer package and package process for cell phone industries up to 90kg (Ceramic design, cable, case and cover design with Solidworks).

• Test/package/process /equipment selection for high temperature low base strain super high stable airplane tire pressure monitoring sensor (up to 500psi and 260C, 0.02% of FSO change over 150days at 270C.)

• Low base strain high stable pressure sensor package on leading wing edge for wind-tunnel test

(<0.03Psi).

• Feasibility study for high temperature silicon pressure sensor and package (up to 500C).

• Silicon through via and other MEMS projects(DRIE/EDP/KOH etched die stability comparison, sensitivity non-linearity study for DRIE etched pressure dies)

• Build two 60 channel sensor stability tester(-55 to 125C thermal cycling).

• Build 20 channel sensor stability tester (-55C to 400C).

• Build sensor stability tester with vacuum capability up to 600C.

• Developed SOI pressure sensor and ultra high g PR damped accelerometer(20k and 60kg, yearly silver medal of Sensor Magazine) .

• Improved yield for new MEMS products for 10 times.

• Developed flexible circuit and die mounting for aero-space application(low base strain application)

• Developed solder ball bonding process on FR4 and ceramic substrate and passed -40 to 125 C thermal cycling test.

• Writing specification, training operators and running qualification lot. Allvia, Sunnyvale, CA - Process integration engineer 03/2006-09/2007 Developed processes for through via and blind via void free copper electroplate with via aspect ratio larger than 10 for advanced vertical interconnects, System-in-Package solutions and hermetic packaging.

• Silicon copper via interposer.

• Void free through via plating.

• Wafer carrier for thin wafer processing at high temperature.

• Back-side and front side via processing.

Microassembly Technologies, Richmond, CA - MEMS design engineer 1/2005-03/2006

• Design, part of fabrication, test and simulation of a tip-tilt-piston mirror system. Static, mode, thermal, transient, and electrostatic contact simulations with ANSYS.

• Static, mode, transient and electrostatic contact simulations with ANSYS for 1W level switch with billions cycles capability. Build an analytical model with electrostatic, damping and contact forces and torques with Mathcad.

• Static and mode simulations of gyroscope.

• Thermal compression bonding for packaging.

• Electroplating system.

• Mega Watt high power laser experiment.

• Twyman Green interferometer for ultra small area flatness and movement check.

• Fizeau interferometer

• Vacuum package

• Hermit package.

• High g package.

Microelectronics Research Center of NJIT’s - Physics Department 7/2000-12/2004 Worked as a research engineer on pressure sensors, micro-mirrors, cross-connects, and variable capacitors.

• Fiber-optical Fabry Perot pressure sensor with a resolution of 3 Pa for partial discharge monitoring in oil transformer for Public Service Enterprise Group Company.

• Differential high resolution capacitive pressure sensor for American Sensor Technology with 0.3 Pa resolution.

• An angle-based design approach for rectangular electrostatic torsion actuators.

• Analytical model of electrostatic torsion actuators with nonlinear spring bending constant.

• Electrostatic torsion mirror with 95% stable travel range.

• Electrostatic torsion cross-connects with 16 16 array.

• Electrostatic variable capacitor with 600% tuning range.

• SU-8 100 C thermal compressing bonding technology.

• Mass flow sensor with Coriolis force.

• Bimorph cantilever temperature sensor.

• Built a home-made anodic bonder.

• Built a home-made photolithography.

• Taught MEMS course for graduate students.

TUDelft, Netherlands & Institute of Microelectronics, Peking University-Research Assoc. 1996-2000

• Micro silicon accelerometer with a resolution of 0.3mg.

• Anti-stiction polysilicon surface micromachining technology.

• Low cost Si/Si wafer bonding tester.

• Micro gyroscope with symmetrical spring suspension.

• Silicon/silicon 180 C low temperature bonding.

• Silicon/silicon nickel bonding technology.

• Silicon/glass Ti/Ni bonding technology.

• Silicon/glass fusion bonding technology.

Education:

7/1996: Ph.D. in Microelectronics at Southeast University, P. R. China. Skills: • More than 20 year experiences on MEMS device design, processing and packaging

(pressure sensor, accelerometer, gyroscope and variable capacitors, etc). Multi-DOF mechanical modeling and simulation. Have 3 patents.

• Good at ANSYS, Ledit, Coventor (MEMCAD), Solidworks, Mentor Graphics, PSpice, Protel, MathCAD, AutoCAD, MATLAB and JMP statistics analysis.

• SMT solder ball bonding and reworking to FR4 and ceramic substrates. Aluminum, gold, solder glass and SU-8 thermal compression bonding, silicon fusion and anodic bonding with Karl Suss and EVG bonders, MEMS vacuum, hermit, vacuum and high g packages. Copper via electroplate and daisy chain manufacturing, bulk and surface micro-machining technology. Familiar with the R&D small lot prototyping to volume production.

• Good at all kinds of MEMS front and back end processing. West bond wire bonding. Accelerometer automatic calibration system. EFD Ultra TT gel, solder paste and conductive epoxy dispense. Solder ball bonding rework system, KOH silicon wet etch, Gold, Cr and Al wet etching, HF/BOE SiO2 etching, M-pyro solvent based wafer cleans, Sulfuric acid/H2O2 wafer cleaning, Phanton and AXIC RIE, Plasma Therm Deep Reactive Ion Etching, STS DRIE, Finetech flip chip bonder, silicon oxidation, LPCVD, PECVD, gold electroplate, electrode-less nickel gold plating, Aluminum Zincation, Karl Suss photolithography, Varian, CVC and MRC metal sputtering, evaporation, Copper electroplate, VEECO 3300, negative resist and polyimide laminator, Nano-metrics film tester, IR and ultrasonic die or wafer inspection, SEM and Dektak metrology tools.

• Fiber optic TOSA/ROSA component assembly. Receptacle active alignment and welding, lens active alignment and die attachment (MRSI+Tresky). Fixture design and building. Worked on many single and multi- channel project. Data analysis. Epoxy selection for long term stability test.

• Resistance welding, wire blazing, solder glass crystal die attachment, pressure sensor/accelerometer low base strain package for high temperature application.

• Principle investigator of ARMY SBIR contract of "High-g package for MEMS devices". Partial list of Publications:

1. Experimental Study of Micromachined Electrostatic Torsion Actuators with Full Travel Range, Zhixiong Xiao, and K. R. Farmer, Sensors and Actuators A., 114(2004)466-472. 2. Analytical Behavior of Rectangular Electrostatic Torsion Actuators with Nonlinear Spring Bending, Zhixiong Xiao, Wuyong Peng, and K. R. Farmer, IEEE J. Microelectromech. Syst., 12(2003) 929-936.

3. An angle-based design approach for rectangular electrostatic torsion actuators, Z. Xiao, X. Wu, W. Peng and K. R. Farmer, IEEE J. Microelectromech. Syst., 10(2001) 561-568. 4. Acoustic Energy Shifting in Different Temperatures of Transformer Oil, X. Wang, B. Li, Zhixiaong Xiao, Harry T. Roman, Kenneth R. Farmer, submitted to IEEE Power Engineering Society Letters.

5. An Ultra Sensitive Optical Fiber Sensor, Xiaodong Wang, Baoqing Li, Zhixiong Xiao, Kenneth Farmer, submitted to Journal of Micromechanics and Microengineering. 6. Pull-in study for round double-gimbaled electrostatic torsion actuators, Z. Xiao, W. Peng, X. T. Wu, and K. R. Farmer, J. Micromech. Microeng., 12(2002)77-81. 7. Micromachined variable capacitors with wide tuning range, Zhixiong Xiao, Wuyong Peng, R. F. Wolffenbuttel and K. R. Farmer, Sensors and Actuators A, 104(2003) 299-305. 8. Silicon micro-accelerometer with mg resolution, high linearity and large frequency bandwidth fabricated with two mask bulk process, Zhixiong Xiao, et al., Sensors and Actuators A, 77(1999)113.

9. A bulk micromachined vibratory lateral gyroscope fabricated with wafer bonding and deep trench etching, Zhihong Li, Zhenchuan Yang, Zhixiong Xiao, et al., Sensors and Actuators A, 83(2000)24.

10. Bulk micromachined electrostatic RMS-to –DC converter, G. de Graaf, M. Bartek, Z. Xiao, C. J. van Mullem, and R. F. Wolffenbuttel, IEEE Transaction on Instrumentation and Measurement, 50-200*-****-****.

11. Low temperature silicon wafer-to-wafer bonding with nickel silicide, Zhi-Xiong Xiao, et al., Journal of the Electrochemical Society, 145(1998)1360-1362. 12. Silicon/Glass Wafer-to-Wafer Bonding with Ti/Ni Intermediate Bonding, Zhi-Xiong Xiao, et al., Sensors and Actuators A, 71(1998)123-126.

13. Silicon-glass wafer bonding with silicon fusion bonding technology, Zhi-Xiong Xiao, et al., Sensors and Actuators A, 72(1999)46-48.

14. A new process for releasing micromechanical structures in surface micromachining with polysilicon support and LPCVD Si3N4 embedded mask, Zhixiong Xiao, et al., Sensors and Actuators A, 72(1999)189-194.

15. A New Release Process for Polysilicon Surface Micromachining Using Sacrificial Polysilicon Anchor and Photolithography after Sacrificial Etching, Zhixiong Xiao, et al., J. Micromech. Microeng., 9(4)(1999)300-304.

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