David Fritz

Severn, MD *****

aduu1m@r.postjobfree.com

+1-443-***-****

Objective: To obtain a position capitalizing on my Mechanical, Process and Quality Assurance Engineering expertise and training, while utilizing my leadership/management skills to benefit the organization and corporation.

Work Experience

Directorate Space & Facilities Lead

Department of Defense (DoD) - Fort Meade, MD

August 2000 to Present

Developed and implemented a mission and personnel relocation & consolidation plan to co-locate like missions and avoid $2M+ in lease costs to satisfy significant budgetary cuts. Relocated 1200+ personnel over a 4.5 month period, during a global pandemic, without mission breakage. Lead the pandemic mitigation plan implementation for the second largest directorate to enable mission reconstitution in a safe and efficient manner. Developed the directorate 10 year mission and IT plan and requirements to ensure alignment of the Installation & Logistics group’s short term goals with the directorate’s long term vision and plan. Briefed senior leaders on organizational mission readiness and plans to address significant gaps.

Mission Assurance Team Lead

United States Department Of Defense - Fort Meade, MD January 2015 to December 2019

Lead the establishment of a Congressional mandated Mission Assurance (MA) site for a no-fail mission. Developed the facilities, manpower and equipment requirements to stand up an the MA site to produce products exact in form, fit and function to products produced at the principal production location. Implemented 100% machine inspection of the deliverable against design specifications. Procured equipment from commercial suppliers that did or could be modified to produce “copy exact” products. Coordinated tours for site senior leadership, as well as funding representatives. Information Assurance Liaison

United States Department Of Defense - Fort Meade, MD January 2006 to December 2015

Liaison Officer responsible for interfacing with US GOV CIOs and CISOs for mission support within the agency’s approved authorities and responsibilities. Ensured adherence to legal doctrine for each agency by directly interfacing with mid-level leadership and personnel from customer organizations and agency Office of General Counsel (OGC). Provided time critical response and support to unforeseen events or situations impacting national safety and security. Daily duties included:

· Coordinated policies and procedures responses to RFIs from other DoD and IC members.

· Coordinated tours for Directors, Agency Principals and DOD J6 personnel.

· Produced mission briefings and events.

Special Processing Lab Microelectronics Fabrication Chief United States Department Of Defense - Fort Meade, MD January 2003 to December 2006

Leader of operations for sub-micron Application Specific Integrated Circuits

(ASICs) fabrication for mission critical applications. Managed 4 Division Chiefs developing process and cycle times goals, ensuring on-time delivery of fully processed silicon wafers to the Test and Assembly groups for packaging and wafer level testing. Oversaw the transfer of commercial product flows, deriving equipment and process specifications required to meet product design rules. Mentored Production, Maintenance and Engineering Team Leads on agency permissible recognition to increase affiliate morale, directly impacting product yields and cycle times. Chaired monthly production meetings to review fabrication performance against established goals. Provided support and resources for root cause analysis, engineering experiments and corrective action implementation in response to Out of Specification (OOS) events and trends. As an ISO9001:2000 Lead Auditor and the Management Representative, employed training and knowledge to obtain ISO9001:2000 registrations for the Wafer Fabrication and Assembly Operations. Lead 110+ civilian, contractor and military personnel during times of extensive overtime to meet stringent production deadlines. Developed methods to provide real-time recognition for any affiliate going above and beyond, which maintained a high morale level. Worked with site facilities, safety, and process engineering teams to cultivate an environment of “Safety First”. Mask Making Engineering Team Lead

United States Department Of Defense - Fort Meade, MD January 2001 to December 2003

Managed engineers and technicians assigned to maintain and continually improve process and equipment performance for 4x and 5x photomask production within a Class 10 clean room. Partnered with an equipment vendor enabling the installation of a 10M+ e-beam system required to develop a .25 micron process flow. Cost sharing under the CRATA agreement allowed the agency to realize significant eqiupment procurement savings, while providing the vendor with a non-commercial source for test plates and designs. Developed process flows, equipment qualification procedures, process and product specifications required to meet design limits. Engaged with equipment suppliers to evaluate and qualify next-generation processes and equipment, leveraging industry advancements to drive production output, cycle times, and defect reduction while improving the production capabilities for the current equipment set. Ensured accuracy and consistency of product metrology results, implemented process improvements to remove sources of variation.

Photolithography and Etch Process Engineer

United States Department Of Defense - Fort Meade, MD January 1999 to December 2001

Monitored production processes for OOS events and trends causing lower product yields. Supported production personnel with equipment qualification, analysis of adverse system performance and incoming material abnormalities. Partnering with Maintenance and Test personnel to correlate yield changes to process shifts or equipment setup/performance. Ensured equipment and process qualifications were completed in advance of priority HOT and HAND CARRY lots movement into the bay. Emergency Response Technician (ERT) trained to respond to chemical events prior to adversely impacting fabrication personnel. Collaborated with Development, Process Engineering, Quality, Manufacturing, and other departments developing and maintaining production and process flows for sub- micron ASIC production. Developed and documented specifications for procured toolsets and incoming raw materials required to meet design rules. Provided expert insight into tool and process capabilities, including the upgrading of temperature control of photo-resist to the point of dispense on MTI coaters, Mentored and trained manufacturing personnel and engineers with industry best practices to minimize photo-resist and chemistry usage during coating and developing operations. Application/Process Engineer

Dai Nippon Screen (DNS) Electronics - Dallas, TX

January 1997 to December 1999

Charged with developing customized photo-resist and developer processes to minimize costs and maximize customer Return on Investment (ROI). Worked with customers within the Mountain and Pacific regions providing tailored track configuration/setup to meet customer’s throughput and quality requirements Characterized the customer’s current photolithography processes to minimize photo-resist and developer usage while minimizing track induced defects. Partnered with customer process engineers and technicians to tailor preventative maintenance schedules to maximize system up-time and Mean Time Between Failure (MTBF) statistics. Responded to hard down track and process events directly affecting customer profitability. Worked with customer Research & Development groups and photo-resist vendors to develop photo-resist processes taking advantage of industry advances in imaging quality while minimizing operating costs. Provided detailed engineering analysis and documentation to support process development, transfer and implementation into high volume manufacturing. Provided enhanced equipment configurations and coating/developing recipes ensuring equipment and process stability while tightening specification and control limits.

Photolithography and Etch Process Engineer

National Semiconductor Corporation - Fort Meade, MD January 1995 to December 1997

Engineer worked on second shift of a 24/5 production schedule. Monitored production processes and equipment setup for OOS events and trends causing lower product yields. Supported production personnel with equipment qualification failures, and analysis of abnormal product characteristics. Partnered with Maintenance and Test personnel to correlate yield changes to process shifts, incoming materials or equipment setup/performance. Ensured equipment and process qualifications were completed in advance of priority HOT and HAND CARRY lots movements into each bay. Emergency Response Technician ensuring chemistry events are properly addressed without negatively impacting fab personnel. Mentored production personnel with proper PPE usage and the potential harmful outcome of non-standard processing methods. Collaborated with Engineering, Quality, Manufacturing, and other departments to address process variation outside of acceptable limits. Computer Technician

Computer Sciences Corporation - Fort Meade, MD

January 1994 to December 1995

Responsible for maintenance of network and system baselines utilized to test and evaluate DOD system level data integrity devices. Developed and executed test plans derived from contract deliverable while documenting any abnormal conditions or events. Procured hardware and software to establish 2 network enclaves which accurately represented the operational network for deliverable deployment. Developed training plans for users ranging from PHD to High School graduates. Education

Bachelors of Science in Mechanical Engineering

University of Maryland

Skills

• MS-Office

• Applied Materials software

• LAM OEM software

• Various other semiconductor equipment sets software

• MEBES OEM software

• Workstream, shop floor management software

• Blueprinter/ARCHIBUS CAD software

• ASM OEM software

• Process Engineering (10+ years)

• ISO 9001 (10+ years)

• DoD Experience (10+ years)

• Root Cause Analysis (10+ years)

• Six Sigma (7 years)

• Manufacturing (10+ years)

• Research & Development (6 years)

• Fabrication (10+ years)

• Quality audits (7 years)

• Lead Auditor (4 years)

• Lean Manufacturing

• Internal Audits

• Product Development

• Process Improvement

• Budgeting

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