Engineering Technician Manufacturing Engineer

Dennis Rosseau

*** * ****** ******, *********, MO 64658 • 916-***-**** • adurrn@r.postjobfree.com

Summary

Electronic engineer with over 20 years’ experience in multiple disciplines. Proven track record of managing projects, large and small as well as successfully collaborating with local and international teams.

Skills

Proficient in Linux, Unix, WindowsX

MS office (Word, Excel, PowerPoint, Access, OneNote), JIRA, SVN (subversion tortoise), VI, SharePoint, Knights/Cadence (physical layer layout)

Statistics; Tableau and JMP (Six Sigma Green belt)

Worked within frameworks of ISO9k, ISO9kTS, JEDEC, AEC, Automotive, space, consumer, and server product markets

Extensive system & component power measurements

Author of numerous technical documents of complex procedures used across cross functional teams

Well versed in most laboratory (scopes, power supplies, TLA, meters) as well as automotive tools (scan tools, hand tools, pullies)

Work Experience

NXP – via US Tech Solutions - Chandler, Az 10/2021 to 2/2022

Product Engineer on TPMS and a variety of automotive MEMS sensors

Work within AEC framework to qualify automotive sensor products

JMP analysis and analytical assessments of data sheets

Extract and Analyze Advantest V93k test flow and data in excel and JMP

Intel – via Kelly Services – Folsom, Ca 02/2020 to 07/2020

Client SSD Validation Debug Engineering Technician

Work in an Agile Scrum Framework that utilizes JIRA tracking tool

Support Engineering team with experiments to root cause SW/HW/FW compatibility failures

Remanufacture M.2 drives with latest Firmware to meet evolving OEM updates

Execute python scripts to parse register fail state and kick off validation test

Guidepoint – New York, NY 04/2019 to 02/2020

Professional Technical Consultant

Consulted with international clients to advise on general semiconductor FAB issues, management structures, Research and Development strategies and industry specifics such as automotive, consumer and other extended temperature applications

Micron Technology – Folsom, CA, 03/2006 to 03/2019

Systems Product Development Engineer,

Developed components utilized in an FPGA platform; Designed experiments, collected data using Python scripts for quality and reliability data for an emerging product.

Component Product Development Engineer,

Individual contributor working across the full product lifecycle to get emerging memory viable for production.

Contributed and led periodic task force meeting to address tests time, yield, failure analysis, quality and reliability issues as well as other gates to qualification.

Drove DOE to understand main process (Indium contamination/electromigration to select device switch) flaw that led to largest single discovery of endurance reliability.

Manufacturing Engineer,

Integrated cross functional teams to take product from new concept technology to materialization on world’s first production qualified phase change memory component.

I drove root cause for several fault isolations on highest pareto items that brought probe yields, test time, quality and reliability to production levels.

I was a key contributor to overseeing and giving technical input for changes from probe to backend test for screening, test time and overall quality and reliability of production worthy part.

Intel Corporation – Folsom, CA

Product Quality and Reliability Engineer, 03/2000 to 03/2006

HVM – owned highest volume NVM products quality and reliability performance metrics. Managed screen development, training given to Shanghai China, and overall guidance to other engineers.

Collected quality and reliability data using a variety of ATE test systems to get memory devices from concept to high volume production meeting JEDEC and ISO standards required by individual customers.

Oversaw BVG TF that salvaged $480 million dollars of materials from F11 (New Mexico). Collected data, worked with cross functional SME’s and derived risk assessment.

From first silicon, debug, qualification, to production, high volume manufacturing, products end of life, and merging the new product specification match to customer requirements (FEQ).

On several occasions drove technical assessment, screen/fix, and communication to customers for FACR’s.

Education

Six Sigma Green Belt Certification (3741855): 10/2019

Expert Rating - Online

Bachelor of Science: Electronic Engineering

ITT Technical Institute – Rancho Cordova, CA: 01/2000

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