Process Engineer Chemical Engineering
Resume:
Donald Mitchell
Burlington, Massachusetts 01803 ************@*****.***
SUMMARY
A focused and goal-oriented process engineer, with a strong background in wafer processing, characterization, yield analysis, and continuous improvement. An ambitious and driven engineer, who is detail-oriented and focused on achieving goals. An effective team player and contributor, who is willing to go the extra mile to achieve results.
EXPERIENCE
BAE Systems, Nashua, New Hampshire 2016-2020
Engineering lead for Electron Beam Lithography production area. Created jobfiles for the tool for new products.
Generated tool specific CAD datafiles necessary for new product exposures. Coordinated daily workflow with production control. Worked closely with field service to maintain maximum tool uptime.
Agiltron Electronics, Woburn, Massachusetts 2015
Provided contractor services at Rochester Institute of Technology (RIT) located in Rochester, New York.
Worked with process personal in their cleanroom facility to troubleshoot a wafer stepper overlay issue with one of their products. Personally solved the problem, the pattern layout data was corrected, and they were able to then correctly pattern the wafers with the correct alignment.
Raytheon Company, Andover, Massachusetts 2012-2014
Engineer, Photolithography Support Second Shift Operations
Provided engineering support for all frontside and backside photolithography operations on second shift. Responsible for dispositioning of discrepant material. Identified root cause and reacted to findings. This could involve shutting down processes, equipment, or gathering effected wafers for containment. Communicated to the team any shift
issues using emails or trouble reports. Provided decisions to release material (rework, scrap/terminate, continue).
ALPHA INDUSTRIES, Woburn, Massachusetts 1989-2009
SKYWORKS SOLUTIONS, Woburn, Massachusetts 2009-2012
Engineer, Yield Engineering
Monitored Process Control Monitor (PCM) electrical data for the various process technology families. Generated critical parameter reports on a weekly basis and presented to the group. Responsible for problem lot and wafer disposition on a daily basis. Correlated final test parametric yields to PCM test data and wafer processing equipment history. Qualified new epitaxial wafer campaigns for release. Utilized data analysis programs, including DataPower and JMP.
Engineer, Metrology 2005-2008
Managed the operation of a KLA CD scanning electron microscope. Created measurement programs for all production products at critical points in the process. Provided off-shift training as necessary to support 24/7 operations. Utilized a Focused Ion Beam (FIB) milling system and an Amray scanning electron microscope for new process characterization.
Engineer, Electron Beam Lithography 1989-2004
Independently pursued varied development programs for integrating electron beam lithography with GaAs processing techniques. Responsibilities included wafer processing and SEM analysis. Provided electron beam lithography support for production requirements, including mask and reticle fabrication. Developed resist processes, including tri-level structures for mushroom gates and bi-level schemes to maximize throughput. Made extensive use of an S200 Cambridge Scanning Electron Microscope (SEM) in process development and troubleshooting. Managed a small group for production support. Led the effort for the selection and purchase of a new E-beam lithography system.
ADDITIONAL EXPERIENCE
MICROWAVE SEMICONDUCTOR CORPORATION, Somerset, New Jersey, 1987-1988. Engineer, Electron Beam Lithography. Responsible for the operation of a Philips direct-write electron beam system. Performed exposure, development, and inspection of direct-write integrated circuit lithography on GaAs wafers. Participated in the development of novel resist systems to tailor profiles for T-shaped metallized gates. Contributed to establishing methods for the transfer of pattern files directly from the Computer-Aided Design (CAD) Group to the E-beam facility.
IBM CORPORATION, East Fishkill, New York, 1985-1986. Co-op Microelectronic Engineering. Performed nitride parameter adhesion experiments comparing the direct application of HMDS with STAR 2000 vapor deposition. Conducted silated resist repeatability studies for replacing a multi-level resist lift-off process with a bilevel process. Line width measurements were measured, using a Nanoline IV. The data was analyzed and organized for presentation through the Statistical Analysis System (SAS). Investigated and reported the lot-to-lot variation of terpolymer electron beam resist sensitivity. Monitored the daily operation of the process line.
EDUCATION
ROCHESTER INSTITUTE OF TECHNOLOGY, Rochester, New York
Microelectronics Engineering Program, 1984-1986
SYRACUSE UNIVERSITY, Syracuse, New York
Bachelor of Science in Chemical Engineering, 1983
MOHAWK VALLEY COMMUNITY COLLEGE, Utica, New York
Associate of Science Degree in Engineering Science, 1981
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