William D. Ryan

Cell: 512-***-****

***** ******* **. ******, **. 78726

adscwo@r.postjobfree.com www.linkedin.com/in/williamdryan

*-***** ***** ****, ******* Management, Engineering & Quality Professional

An engineering veteran at achieving exceptional performance levels. Outstanding track record for delivering design improvements and best-in-class processes, within both High Tech and Financial Services. Consummate Professional, Lean Six Sigma Black Belt, with mastery leadership and mentoring skills. Proven change agent at Dell Financial Services, Dell Technologies, HP TippingPoint, and Bose. Expert in the following areas.

Program and Project Management

Lean Six Sigma Black Belt

Process Efficiency and Optimisation

Industrial Engineering and Reengineering

Outsourcing, and site transitions

Creative solutioning of complex problems

Best-in class (BIC) PCBA manufacturing capability

BIC High Level Assembly capability for HMLV/HVLM

Continuous Flow Manufacturing with SMED

PCBA, HLA, 3PL configuration to order

EMS and ODM supplier selection

Dual US and EU Passport holder (Ireland)

Industry Publication: - PCBA Quality Process Audit (QPA) by William Ryan

This publication is the definitive process assessment document for Printed Circuit Board Assembly (PCBA). Its purpose is to match manufacturing capability with product complexity to deliver the best possible quality cost effectively. Released initially in 1996, it underwent updates through the years and has been adopted industry wide as the definitive PCBA manufacturing guide by such companies as Dell Technologies, Bose, Philips Medical, GE Medical, HP-TippingPoint, and also sub-tier EMS providers.

Dell Publication: - Issue Management System for Service Support by William Ryan

This publication defines the methodology for the early identification of systemic field quality issues and the process to expedite containment and resolution of such issues improving NPS, CSAT and brand loyalty.

Professional Experience

Process Engineering / Six Sigma Black Belt Consultant

Dell Financial Services / Dell Technologies – Round Rock, TX. (May 2017 - present)

Changing industry from High Tech to Financial Services within Dell was seamless. Processes and problems exist in every industry and opportunities to apply Six Sigma methodologies are ubiquitous. Currently leading business critical projects and initiatives to drive change, improvement, and efficiency. Applying Lean-Six Sigma approaches to problems to identify root cause, the sources of error, and engineering solutions to reduce the probability of occurrence and the severity of the effect, more detectable and robust to variation.

Led several campaigns to dive improvement in Consumer phone consent from 24% to 68% to enable digital collections.

Implemented an Artificial Intelligence/Machine Learning approach to Collections to optimize channel, best time, and cost.

Investigated the root causes of Management Action Plans (MAPs), e.g., Vendor Contracts, Credit Reporting.

Created and negotiated binding contracts for Collection Providers, including specialized agencies for Bankruptcy, Reaffirmations, and Deceased, for the US and Canada.

Reengineered the Bankruptcy and Debt Sale processes for profitability and effectiveness.

Developed new processes and procedures to manage End of Lease for Dell/EMC products combined.

Senior Principal, Services Supportability Strategist and Process Engineer

Dell Technologies – Round Rock, TX. (Oct 2011 – May 2017)

Identified opportunities for warranty cost reduction and quality improvement, by engineering new approaches and tools to improve customer satisfaction with solutions offered and delivered, driving process efficiencies by developing and reengineering methodologies within Dell Service and Support.

Developed the ‘Issue Management System’ which is the gold standard for managing systemic field quality problems.

Drove development to engineer a field BIOS recovery process, avoiding the need for motherboard replacement and repair, leading to $16M in savings annually. Achieved this using the power of data, analytics, and through influence.

Identified field issues earlier and faster solution development. This Trigger Process led to $9M in cost avoidance.

Instituted CLCA tracking program to ensure root cause is resolved and not just the symptom. $12M in cost avoidance.

Identified the cause for the delta in dispatches between the US and Brazil. Best practice sharing led to $5M in savings.

Achieved $2.2M in savings/ annually by driving the development a self-help storage f/w upgrade wizard.

Drove the development of the capability to push HDD f/w updates into the install base, thus avoiding HDD replacement.

Quality & Operations Engineering

Hewlett Packard - TippingPoint – Austin, TX. (Jun 2008 – Oct 2011)

Improved hardware quality from business-critical failure levels (measured in %s) to world class six-sigma performance (measured in DPPM) within nine months, by implementing manufacturing excellence at the EMS sites, product transfers to alternative sites so as to match process capability with product complexity, and by identifying design and design margin issues leading to ECOs, component changes, firmware updates and software changes to resolve the design issues that were driving failure.

Achieved significant ‘Shift Left’ Manufacturing Process Capability enhancements & improvement.

Identified and resolved previously unrealized product design and DFX opportunities.

Instituted ‘Rapid Response’ for new products to expeditiously capture and address field failures.

Transitioned all products to a new CM achieving step functional yield and delivered quality improvement.

Selected new ODM partners, significantly reducing DTM, with outstanding cost and quality results.

Achieved a 10x improvement in Field Quality, resulting in a 55% reduction of warranty costs.

Eliminated the use of 3rd part screening equating to approx. 1% of annual sales revenue.

Transitioned all products from EMS to HP Puerto Rico. Bringing Lead Free capability and CFM concepts to the site, while re-engineering HLA processes to encompass Poke Yoke and FMEA concepts. This achieved a 20% improvement in yield performance with zero system hardware field failures by the time of leaving HP

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Supplier Engineering, Electronics Outsourcing

Bose Corporation – Framingham, MA. (Jun 2005 – Jun 2008)

Developed and implementation a Strategic Supplier Selection and Management model for outsourced electronic products. Achieved significant performance and cost improvement by developing and onboarding CMs/ODMs to achieve the same high-quality expectations of Bose US manufacturing but in low-cost manufacturing geographies.

Created the necessary tools to develop electronic suppliers to meet Bose capability expectations.

Built and aligned a team of professionals to execute the strategy with the necessary technical skills.

Transitioned over 64 complex electronic products through this model leading to an average of 30% process yield improvement, 10% reduction in Warranty Costs with a 4x savings in labor costs.

Drove the implementation & utilization of DFM/DFT for outsourced PCBA designs yielding >20% in cost savings.

Supplier Engineering, Circuits Assembly Consultant

Dell Technologies – Round Rock, TX. (Jun 2000 – Jun 2005)

Mentored and developed a world-wide team of Dell and supplier employees to drive effective server PCBA Migration, NPIs, Product Transitions, Site bring-ups, Process Technology Development, DFX, Quality Sustaining, and Continuous Improvement projects, utilizing a Lean Six-Sigma approach.

Developed a Paradigm Shift methodology (Safe Launch) to ensure successful Product Launches.

Drove supplier capability and successfully launched multiple new Products achieving step-functional yield improvement.

Initiated and drove the Best-Known Practice Program for PCBA and HLA manufacturing to achieve transformational quality improvement at suppliers. Achieved 85-125% improvements Y/Y.

Achieved Dell Six Sigma Black Belt certification for a PCBA (X-Ray) project leading to $4.5M in savings.

Developed and successfully deployed the PCBA Quality Process Audit (QPA).

Developed and deployed a Complementary Test Strategy for PCBA utilizing API, AOI, AXI, ICT, and FT.

Mentored and developed the China based Supplier Engineers, providing leadership and technical assistance.

Educational Background

B.Tech., Bachelor of Technology, (Production Engineering for Electronics)

University of Limerick, Limerick, Ireland.

M.Eng.Sc, Masters of Engineering and Science (Industrial Engineering & Quality)

National University of Ireland, Galway, Ireland.

Master’s Thesis: A Comparison of Western versus Taguchi Experimental Design Methodologies, DOE.

Certifications:

Ford Statistical Process Control

Lead Quality Assessor ISO9000 (Batalas UK)

Dell Lean Six-Sigma Black Belt

Advanced Business Analytics University of Texas

TEFL Teach English as a Foreign Language.

Travel: Extensive travel and cultural experience throughout Asia, Europe, the Americas.

References available on request or via LinkedIn. www.linkedin.com/in/williamdryan

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