Alexander Parish Hackettstown, NJ *****

Passionate Developer and Innovator, Creative Thinker and Problem Solver

Email: adrize@r.postjobfree.com, Tel: 908-***-****

Summary

Striven for accomplishment and integrity professional with 20+ years’ an international experience in high technologies with concentrating on many facets of semiconductor and electronics industries. Experience of maintenance, troubleshooting, and repair of aircraft’s electronic equipment such as radar, recognition and navigation systems, IR sight, compass, and radio. Expert at various research and data analysis, new products development per V-Model of Product Development, introduction, and manufacturing in highly regulated environment including RoHS compliance with strong focus on customers’ confidence maintenance and enhancement. Possessor of an extended international experience to manage or coordinate activities of Marketing, R&D, Design, Test, Production, Applications, and Failure Analysis teams from one side and components or materials suppliers and manufacturers from other side to develop, qualify per AEC, JEDEC, or MIL Standards requirements, and manufacture various products for automotive, avionics, defense, infrastructure, and wireless applications. Vast knowledge and experience with Component Engineering processes and defining of components’ requirements with respect to specifics of applications, including an appropriate component screening and qualification requirements, obsolescence and DMSMS system management. Adept to apply variety of failure analysis techniques, including non-standard methods and apparatus development and implementation, to identify root causes of failures, develop and implement corrective and/or preventive actions. Continuous analysis of products performance and cost, areas of improvements identification and practical cost effective decisions development and implementation without diminishing of products’ quality/reliability and safety. Inspires respect and trust with constantly demonstrated strong abilities to apply new approaches and motivations to achieve and exceed project goals with diverse collaborative teams on time and within or under budget.

Professional Highlights:

* Confident management of new product development processes, introduction, volume ramp, and mass production support to achieve various products maximum effectiveness, maintain and enhance profit growth. Critical problems such as poor performance, catastrophic failures, obsolescence/DMSMS issues resolution in the timely and cost effective manner.

* Successful accomplishment of several $5M+/year or 5M+ parts/year projects with strong adherence to the ISO 9001 QMS requirements and meticulous attention to details of products specifications, quality/reliability, safety, and customers’ requirements.

* In-depth knowledge and an extended international experience dealing with such devices and technologies as BJT, MOSFET, IGBT, CMOS, HBT, HEMT, Bi-FET, LED and lasers, photo and Schottky diodes, SAW and BAW filters (Si, SiC, III-V, II-VI and piezo materials) for DC, RF, high -speed,-voltage, or -power electronics and systems design, development, and/or manufacturing.

* Hands-on experience with variety of hardware such as power and signal sources, microscopes (acoustic, electronic, infrared, optical, and X-Ray), oscilloscopes, signal analyzers and meters, manual probe station, laser trim machine, and components testers.

* Design, manufacture, and implementation of unique specialized test/diagnosis apparatus to reveal low reliable products due to: 1. Wide variations of some crucial parameters such as an excessive and/or highly non-uniform values of thermal resistance, threshold voltage, and/or leakage current; 2. Presence of latent internal defects or flaws such as weak or intermittent connections, poor products’ starting materials properties and/or integrity of products’ constructions.

Core Competencies:

* Release of complete production documentation such as BOM, assembly and packaging specifics (components and materials selection; die attachment by solder, silver epoxy, or sintered silver; wire bonding or flip-chip interconnections, package injection molding, marking, sawing), wafer probe and final test plans specifications.

* Continuous performance and cost analysis of new and/or existing products and areas of most effective improvements identification through procurement savings, complexity reduction, and risk management. DMSMS management by means of suppliers selection and an effective supply chain establishment including usage of GIDEP and AVCOM guidelines, databases, and tools.

* Products yield losses, quality/reliability and field related problems root causes identification and resolution by means of usage of Six Sigma, SPC tools, DOE, 8D-, 5S-, and Four-pronged investigative trust Methodologies, the Shainin System, Destructive or Nondestructive failure analysis. Corrective and preventive actions development and implementation, CAPA system establishment and/or maintenance. Conducting PPAP, applying DFMEA and PFMEA rules and results to maintain RPN < 100.

* Merging vast knowledge and experience, analytical and research, troubleshooting and failure analysis abilities and demonstrated strong project management and planning, team building, training, and coordinating, communication and interpersonal, problem-solving skills.

* Constant customers’ confidence enhancement. Practical cooperation with representatives of Agilent, BAE Systems, BlackBerry, Cisco Systems, EMC Corporation, Huawei, HTC, Kyocera, L3 Communications, LG Electronics, Lockheed Martin, NASA, Motorola, Northrop Grumman, Panasonic, Philips, Raytheon, Samsung, Sony, SpaceX.

Professional Experience

Kearfott Corporation, Pine Brook, NJ 2017 - 2021

Senior Engineering Specialist

Scope: Passive and active electronic and electrical components for variety of innovative solutions for guidance, navigation, and motion control needs to provide positioning and direction information for spacecraft, aircraft, missiles, ships, land and underwater vehicles DMSMS issues (obsolescence, EOL, limited availability, an extended lead time) management in a timely and cost-effective manner. Components’ status, performance, and changes in manufacturing processes continuous monitoring to prevent unexpected losses, potential quality and reliability issues, field related problems specifically. Advanced parts such as DC-DC up or down modules, analog, digital, and RF ICs, optoelectronic, and various discrete active (diodes, bipolar and MOS transistors) and passive (R-L-C and their combinations) devices selection and qualification as necessary.

Summary:

Constantly updated database of components status and availability in accordance with inputs from GIDEP, AVCOM, and distributors. Created various documentation to reflect changes of products’ manufacturing processes, manufacturing and/or test sites, performance and/or quality/reliability, marking and/or labeling, shipping sites.

Subject Matter Expert:

Various components availability confirmation and an alternate component advisory as necessary. Proactive identification of an alternate components and their sources of supply for the parts with limited availability to minimize the adverse effects of obsolescence/DMSMS issues on Company products’ readiness, schedule, quality/reliability, and cost (for crucial products and critical customers specifically).

Bottom-Line Contributions

Continuous concentration on obsolescence/DMSMS issues prevention by means of maintenance of the most effective and proactive DMSMS system management. Overall, management of 10K++ electronic and electrical components.

Collaborated and acted with Design, Quality, Planning, and/or Procurement teams to prevent or resolve such DMSMS issues as components’ sudden obsolescence and short coming EOLs in a timely and cost effective manner.

Permanent analysis and implementation of best practices to monitor, trace, search, perform logistic and engineering analysis related to the reduction and elimination of the adverse effects of obsolescence/DMSMS issues.

Created variety of necessary documentation to appropriately implement in the Company products newly identified components (replacement and new designs’ parts) and existing components diverse changes.

EncoreX Video Wall Systems, Union City, NJ 2010 – 2012, 2016 - 2017 Engineering Project Lead

Scope: Management of installation and services (maintenance, troubleshooting, and repair) of progressive LED based information and advertisement video wall systems, specialized professional high-end audio and video equipment. Collaboration with manufacturers of electronic devices, various consumer electronics and power control systems regarding new products development, an advanced or an appropriate components selection and their applications.

Summary:

Accomplished several projects per customers’ requirements with up to 9 X 27 panels per video wall system. Conducted PPAP reviews of variety of components for the specialized electronics with applications in high-speed and/or high-altitude environment.

Subject Matter Expert:

Confirmation of readiness or identification of latent problems for variety of electronic and electrical components for sophisticated applications in avionic or space electronics. Bottom-Line Contributions

Finalized specifics of assembly and final tuning of multi-panel video walls. Trained technical personnel accordingly.

Provided meticulous attention to quality/reliability requirements of materials and components for applications in harsh environmental and mechanical conditions (temperature, humidity, pressure, shock, acceleration, and vibration).

EPCOS, Inc., Iselin, NJ; Maitland, FL 2016 - 2016

Power Module Engineer IV

Scope:

Development, qualification, wafer probe and final test set up, transfer to and mass production support of multi-band PAMiD modules (PCB, PA, BAW duplexer and filters, electronic switches, coupler, and passive SMD parts) for LTE applications. Products’ performance, yield, and quality/reliability maintenance and enhancement.

Summary:

Maximized effectiveness of production team by means of providing focused instructions to select an appropriate hardware, correct assembly and tuning processes and to set up final test specifications.

Subject Matter Expert:

Root causes of product weak performance and yield losses identification. Collaboration with functional groups across the Company to develop and implement solutions to prevent and eliminate defects and failures.

Bottom-Line Contributions

Identified PAMiDs and BAW filters yield losses and field problems root causes and collaborated with Design, Process, Assembly, and Test teams to resolve such problems in the timely and cost effective manner.

Improved products performance and quality/reliability by means of development and implementation of cost effective methods to analyze wafer probe or module final tests results, reveal parts with latent internal defects among successfully passed tests products, and prevent field failures specifically.

Astrodyne TDI, Hackettstown, NJ 2014 – 2015

Test/Reliability Manager

Scope:

Management of test and reliability activities to improve quality, delivery time, and cost of Company products. Dealing with variety of AC-DC, DC-DC, DC-AC power modules, frequency changers with up to 10 KW of output power and over hundred amperes of DC or AC output current (single or multiple phases) for various applications.

Summary:

Management of test and reliability activities to improve quality, delivery time, and cost of Company products. Dealing with variety of AC-DC, DC-DC, DC-AC power modules, frequency changers with up to 10 KW of output power and over hundred amperes of DC or AC output current (single or multiple phases) for various applications.

Subject Matter Expert:

Creation of approaches to an enhanced test and troubleshooting methodology, new advanced components selection, training of technical personnel accordingly. Development and implementation of innovations to maintain and enhance products yield, quality/reliability and prevent field failures specifically.

Bottom-Line Contributions

Identified major manufacturing related problems such as designs shortcomings, improper components selection and placement, poor wiring, interconnections, or isolation which resulted nonconforming materials or field failures.

Developed and addressed corrective and/or preventive actions and approaches to reduce products yield losses, test time, and an overall cost, to improve products quality/reliability and prevent field failures.

Cooperated with customers on products applications and/or reliability problems, field failures investigations and resolution in the timely manner.

Vigorously collaborated with Design, Engineering, Procurement, Planning, and Manufacturing Teams to resolve problems in the timely and cost effective manner, maintain and enhance customers’ confidence with regard to Company products.

TriQuint Semiconductor, Inc., San Jose, CA 2012 – 2013

Senior RF Product Engineer

Scope:

Maintenance of production yield and quality of assigned RF products such as various amplifiers (PA, BA, VGA, and LNA) based on Si or III-V materials and CMOS, HBT, or HEMT Fab processes, down converters, diplexers, single and multi-band SAW and BAW filters for wireless and infrastructure applications.

Summary:

Transferred developed and qualified RF products from Development to Manufacturing Engineering. Improved performance to achieve yield in the range 90% - 99+% on all manufactured RF products. Subject Matter Expert: Orchestrating activities for product development, test set up, qualification and transfer to mass production. Introduction results to the Product Management Community in accordance with scheduled milestones. Root causes of nonconforming materials identification and resolution. Interaction with functional groups across the Company to reduce products sensitivity to the Fab, assembly and/or packaging processes, wafer probe and final tests variations.

Bottom-Line Contributions

Identified root causes of excessive wafer probe and/or final test yield losses (related to the die design, Fab process, assembly, package sawing and/or test) for several critical products and advised corrective approaches to resolve problems.

Collaborated with various Engineering groups such as Applications, Failure Analysis, Design, Fab Operation, Assembly, Test (final and wafer probe), and Marketing to resolve yield and field related problems and maintain customers’ confidence.

Developed analytical methods to separate passing final test SAW and BAW filters with latent internal defects (such as intermittent connections, leakage) without conducting additional tests, test time and cost of product increase respectively.

Anadigics, Inc., Warren, NJ 2001 – 2010

Principal Member Technical Staff (New Product Development/Introduction)

Scope:

New RF product development, qualification, wafer probe and final test set up, transfer to and mass production support. Wafer probe and final test nonconforming materials, field problems root causes identification and resolution. Products performance, quality/reliability, and yield maintenance and enhancement.

Summary:

As a leader of cross-functional Product Implementation Team (PIT, 12–17 members on-board) developed over 20 products (based on III-V materials and HBT or Bi-FET Fab processes single and multi-band PAs and FEMs) for wireless applications. Successfully transferred qualified products from Development to Production Engineering. Achieved and maintained wafer probe and final test yield in the range 95% - 99+% on all manufactured products.

Subject Matter Expert:

Orchestrating activities of PIT efforts to achieve projects goals within or under time and budget. Reduction of manufacturing cost, time of volume ramp and to the market eventually. Interaction with various functional groups across the Company to obtain information and resources required to identify yield losses or field issues root causes, to develop and implement solutions to prevent and eliminate products’ defects and failures, to maintain and enhance customers’ confidence.

Bottom-Line Contributions

Coordinated, assembled, and presented data to the Product Management Community regarding the results of all activities required to bring new product from the stage of business case introduction to the stage of mass production.

Substantially participated in the resolution of difficult problems related to the design and wafer fabrication interactions such as circuity and die layout optimization, wafer starting raw material variations and an appropriate application, wafer probe and final test yield losses, an integrated active and passive components robustness.

Identified major assembly related issues involving silver epoxy die attachment, wire bonding, molding, and laminates critical parameters specifications. Demonstrated passion and intensity to release complete product documentation such as BOM, assembly and packaging processes requirements (laminate’s critical dimensions, components accuracy and placement). Extended experience and solutions across various families of products under development and in mass production.

Designed and implemented specialized test/diagnostic apparatus to identify various problems root causes and develop corrective/preventive actions in the timely and cost effective manner.

Collaborated with Test group regarding wafer probe and final test plans set up to maintain specified performance and high outgoing products’ yield and quality/reliability at low test time and overall products’ cost.

Vigorously supported products in mass production and resolved numerous persisting nonconforming materials and field related problems. Several times recognized by Company for resolution of severe yield and quality/reliability problems on a few high-volume products to critical Company customers (major wireless handsets manufacturers) and their confidence recovery.

Transistor Devices, Inc., Hackettstown, NJ 1998 – 2000

Component Engineer

Scope:

Provision of technical insight into an advanced components selection, qualification, and appropriate applications for the new and existing products such as variety of power modules with up to 5KW/325A of output power/current.

Summary:

Created focused Component Engineering function to work with the components manufacturers and Company’s customers to prevent products failures, reduce cost, and provide contributions to the strong profit growth. Subject Matter Expert: High profile components failures root causes identification and problems resolution. Selection, qualification, troubleshooting, and failure analysis of electronic components (mainly power devices such as Schottky diodes, BJTs, MOSFETs, and IGBTs) from the major domestic and international manufacturers.

Bottom-Line Contributions

Developed methods, designed, and implemented specialized test/diagnostic apparatus to aim incoming inspection needs and reveal low reliable power devices due to excessive or non-uniform thermal resistance, threshold voltage and/or leakage current values.

Prepared variety of Work Instructions and trained personnel accordingly to provide up to 100% incoming control of crucial components for the critical Company’s products.

Collaborated with independent failure analysis centers and components manufacturers to resolve problems and maintain an appropriate performance of their products.

Professional Development

EDUCATION:

Federal State Unitary Enterprise (FGUP GZ) “Pulsar”, Post Graduated School, Moscow, Russian Federation MSEE, Specialty Field (Electronic Science and Solid-State Electronics) Moscow Power Engineering Institute (Technical University), Moscow, Russian Federation BSEE, Semiconductors and Microelectronic Devices

Moscow Innovative University, Moscow, Russian Federation Certificate, Manager of the International Business

Additional Training:

BOM accuracy and maintenance; Galaxy Examinator and SpotFire; 8D- and 5S Methodologies; Six Sigma; SPC, DOE; DFMEA, PFMEA, PPAP; Failure Analysis methods and methodologies such as Four-pronged Investigative Thrust and Shainin System; Workshops, Conferences, and Courses with regard to Enhanced Technologies and Processes, Product Development, Project Management, and Marketing.

Awards

Anadigics, Inc., Excellence Award

In the appreciation of excellent analysis, resolution and communication to recover from a top wireless customer’s D-rating on quality and regain business in a tough competitive environment. 2009, 2010

In the appreciation of an outstanding contribution to the development of the world’s best power amplifiers leading to significant design wins with major customers. 2001, 2006

Transistor Devices, Inc., Incentive Award 1999, 2000

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