ROMANO BOLADO
Torrance CA 90504
Mobile # : 717-***-****
Email : adrgo3@r.postjobfree.com
SUMMARY :
Certified J-STD-001 IPC Specialist
(Requirements for soldered electrical and electronic assemblies)
Have both aerospace and military experience as well as familiarity with specs
Key team member in setting systems to meet and implement ISO 9001 compliance
Efficiently and effectively understands systems to meet the requirements yet not overregulate
the flexibility required to get things done
Get the job done without excessive cost and shows a long term savings
PROFESSIONAL EXPERIENCE :
Eaton Aerospace
March 2021 – up to present
Electronic Assembler
Certified IPC J-STD-001 Specialist
Soldering of PCB/Hybrid assembly (Aerospace and Military) with the use of microscope per IPC 610 A/B
Mechanical assembly
Wire harness assembly
Preparation of kit and inspection of PCB/HYBRID assembly per IPC 610 A/B
QSC Audio Product LLC CA
May 2016 May 2020
QA Inspector / Electronic Assembler
Monitor and perform audits on the PCB assembly system line. Input results in Oracle as required
Xray/AOI/Final Inspection of finished good PCB assembly
Perform the first article inspection and perform online audits
Perform and interpret all assembly documentation, engineering drawing and assembly aids
Maintain the required daily standard of productivity with a consistently high level of quality
Janteq Corp. CA
May 2015 – May 2016
Electro/Mechanical Assembler/ Wire Harness Assembler
Mechanical assembly
Wire harness assembly
Preparation of kit and inspection of PCB assembly IPC 610 A/B
Soldering of PCB assembly by using of microscope per IPC 610 A/B
Ametek CA
February 2015 – May 2015
Electronics Assembler / Wire Harness Assembler
Full kitting and preparation of kit
Hand soldering of Smt microchips/IC’s by using microscope
Touch up and inspection of PCB assembly per IPC 610 A/B
Assemble of wire harness assembly, tinting and crimping
Soldering of wires to terminal and inspection of solder connections quality per IPC 610 A/B
Meggit Corp. CA
February 2014 – October 2014
Die Attache Assembler / Soldering
Full kitting. Set up and operate screen printer, preparation of gold paste / platinum gold paste and resistors paste
Run screen printer for metallization and inspection of substrate board
Run and apply nonconductive / conductive paste to substrate
Manuel die attach hybrid resistors and capacitors and inspection of substrate assembly per IPC 610 A/B
Use microscope for soldering of microchips / IC’s to PCB assembly
Extron Corp. CA
April 2011 – August 2011
SMT Machine Operator PCB Final Assembler (soldering)
Set up and operate SMT machine
Tear down and set up all the feeders for the next kit
Set up screen printer
Touch up and final inspection of PCB assembly per IPC 610 A/B
Use of microscope for soldering of microchips / IC’s to PCB assembly per IPC 610 A/B
Lucix Corp CA
February 2009 – June 2009
West Bond Wire Bonder Operator / Die attach / PCB Assembler (soldering)
Set up and operate West Bond machine and inspection of Hybrid assembler per Aerospace IPC
Set up and operate Gap welding machine
NASA / Aerospace Certified
Soldering of microchips / IC’s to PCB assembly per IPC 610 A/B
Advance Photonics Inc. CA
July 2008 – January 2009
K&S Wire Bonder Operator / Die Attach / PCB Assembler (soldering)
Set up and operate K&S auto/manual wire bonder machine
Run / Process first article and inspect the substrate assembly per IPC 610 A/B
Use microscope for soldering of microchips / IC’s to PCB assembly and inspection of PCB per IPC 610 A/B
Manual die attach using of West Bond die attaches machine
Soldering of PCB assembly per IPC 610 A/B
CTSEMS Corp. CA
July 2006 – June 2008
SMT Machine Operator / PCB Assembler (soldering)
Set up the program and operate SMT machine
Screen printer machine, Reflow machine and inspection of first article per IPC 610 A/B
Use microscope for soldering of microchip / IC’s to PCB assembly per IPC 610 A/B and reworking of MRB
Dytran Instrument Inc. CA
July 2005 – April 2006
SMT PCB / Hybrid Assembler (soldering)
Soldering of PCB / Hybrid assembly with the use of microscope
Transducer mechanical assembly, preparation of kit and inspection of PCB / Hybrid assembly per IPC 610 A/B
Soldering of PCB assembly by using of microscope per IPC 610 A/B
RAD Technologies Inc. CA
July 2004 – May 2005
SMT Machine Operator / PCB Assembler (soldering)
Preparation of kit, set up the program and operating of SMT machine
Screen printer
Reflow machine
Soldering of PCB assembly
Inspection of first article per IPC 610 A/B
Use of microscope for soldering of microchips / IC’s to PCB assembly
Natel Engineering Corp. CA
March 2002 – February 2004
MRSI Die Attach Machine Operator Tech / Die Attach assembler
Set up the program and operating of MRSI machine
Reflow machine
Soldering of PCB assembly by using of microscope
Inspection of first article per IPC 610 A/B
Operate manual die attach machine
Teletrac Inc. CA
July 2000 – June 2001
SMT PCB Prototype Assembler (soldering)
Full kitting
Soldering of microchips / IC’s to PCB assembly per IPC 610 A/B
Mechanical assembly
Prototype assembly
Inspection of first article per IPC 610 A/B
Final inspection of PCB assembly per IPC 610 A/B
Use of microscope for soldering of microchips / IC’s to PCB assembly
Micro Memory Inc. CA
July 1999 – June 2000
SMT Machine Programmer / Technician
Programming of SMT machine
Preparation of kit
Set up and operate SMT machine
Screen printer machine
Reflow machine
SMT statistical process control and SMT line supervision
Preventive maintenance of SMT equipment
Inspection of first article per IPC 610 A/B
ISI Co. CA
November 1998 – June 1999
SMT Machine Operator / Technician / Programmer
Programming of SMT machine
Set up and operate SMT machine
Screen printer machine
Reflow machine, soldering of microchip / IC’s and inspection of PCB assembly
Define and set up a new production process
SMT process supervision and inspection of first article per IPC 610 A/B