** ****** ***, ******, ** RICHARD CHIM
Home: 978-***-**** Sr. Test Technician and Sr. Process Technician
*********@*****.***
SUMMARY
A safety and goal-oriented Technician with solid experience in Semiconductor manufacturing operation and clean room protocol. Comfortable working and around hazardous gases and chemicals.
CHEMICAL Cleans/Etches (Liquid Processing): RCA Clean, Pirahana, BOE, Xylene, Sulfuric Acid, Hydrogen Peroxide, Hydrofluoric Acid, Acetic Acid, DiH2O/H2SO4/HF(Straight) (Glass etch), EDP, KOH, TMAH, Nitric Etch, Copper Etch, Gold Etchant, TFA (Gold Etchant), Titanium, Aluminum Etch, Acetone, Isopropal Alcohol, Methanal, Ammonium Fluoride, Xylene and Gas type: PH3-Phosphine, N20-Nitrous Oxide, H2-Hydrogen, SiH4-silane. Wear protective equipment (PPE) including working uniform, steel toe shoes, hair net, safety glass, bump cap, nitrile glove, PPE face shield respirator.
EXPERIENCE
MATERION PRECISION OPTICS. THIN FILM COATING TECH IV. Westford, Massachusetts 05/2019 - Present
Cleaning and Inspection: Working in a clean room lab environment. inspecting various types of optical glass.
Coating Systems: Maintaining, loading, operating and troubleshooting various kinds of deposition systems including magnetron sputtering, linear variable sputtering, Ion Beam sputtering, Ion assisted deposition, metallization chambers.
Coating Process: Ta2O5/SiO2, HfO2/SiO2, Nb2O5/SiO2, Al2O3/SiO2, Si/SiO2, NiCr, Ti/SiO2
Filter Types: Narrowband, Wideband, Edge filter, Beam splitter, Anti-reflection, Linear Variable filter etc.
Database maintenance and adjustments, process run sheets and process checklist sheets, load and operate machines.
Testing: Using various test equipment to analyze the spectral qualities of filters as well as the qualities of metalized parts.
Using Ohm Meters to tested conductive quality of coating and inspection.
Material Reclamation: Using a heating process to de bond various materials and reclaim precious metals.
Perform duties within the corporate EH&S Standards and place proper emphasis on safety and quality.
MICROSEMI CORP. SENIOR SEMICONDUCTOR MANUFACTURING TECH. Lowell, Massachusetts 04/2004 - 05/2019
E-Beam Evaporation PVD, MRC, Sputtering &Temescal, Airco, Sharon, deposited include Pd, Ti, Pt, Au, NiCr, Ni, AuGe
Thin-film deposition using sputtering electron-beam, setup, modifications, and preventative maintenance on vacuum coater
Chemical acid processing BOE/MOAT, 100:1, 10:1 Etch (wet/dry), ST22, ACT412, Plating-Electroless/Electroplate
PECVD, RIE and wafer plasma etch process, diffusion furnace annealing, LPCVD, MOCVC oxide/Boron/Nitride.
Perform data collection and work closely with a team of Process Sustaining Engineers
Process wafers according to detailed wafer traveler documentation and lead trains new employees process and equipment.
Perform duties within the corporate EH&S Standards and place proper emphasis on safety and quality.
CORNING CORP. SENIOR PROCESS TECHNICIAN, R&D. Wilmington, Massachusetts 02/1995 - 03/2004
Hands on experience developing in Silicon, Gallium Arsenide, Indium Phosphide, MEMS device fabrication on glass wafers.
Experience with DRIE, ALCATEL, LAM, BRANSON, PECVD, processing including Polyimides
Provide process support and have given development input to R&D Engineering Teams on several key projects including
processes on: MEMS, RF Switches, Bio MEM’s, gas detector, and gas Injectors and inspection.
Daily operational tasks include chemical acid Etch Processing (both wet and dry), electroplating/strip and hand on process.
Performed electrical test, include system test, automated test and wafer probe, DC/RF test equipment.
Set up test station, including laser, detectors and electronics to performing test and reliability on MEMs devices.
Lead and train new employees and cross train current employees in all job function.
MACOM CORPORATION. WAFER FAB PROCESS TECHNICIAN. Burlington, Massachusetts 10/1990 - 02/1995
Thin film deposition, sputtering, Lam 490/590, Temescal, Sharon Airco, Veeco, CHA50, E-Beam Evaporation
Wet/dry, PECVD, RIE and wafer plasma etch process, diffusion furnace annealing, LPCVD, MOCVC oxide/Boron/Nitride.
Perform data collection and work closely with a team of Process Sustaining Engineers
Front side including wafer test, rough and final polishing, surfaced inspection, dicing and laser marker both silicon/GaAs
Test module performance in automated. working on military products in ISO 9001 /AS9100 controlled environments.
Set up operation, automated test and associated test equipment to lowest component Varactor, Pin Diodes, Mesa Beam.
Works to prints, schematics, specifications, process sheets, electrical testing of RF/Microwave component and MMIC wafers.
Performs test troubleshooting to component level testing and measurement acceptance of production, final components.
Performs the set-up, calibration, testing and troubleshooting of circuits, components, instruments and mechanical
Electrical test including system test, RF and DC test, operated oscilloscopes, spectrum analyzers, voltmeters.
Work with automated systems and manual test equipment, test fixtures and wiring harnesses, test results into database.
EDUCATION: Shoreline High School - General Studies, Electronic - Seattle, Washington
Shoreline Community College - Electronics - Seattle, Washington US Citizen