PCB Designer

PRADHEEP V

adno1y@r.postjobfree.com

Mobile: +91-848*******

Professional experience:

PCB Design Engineer with 2 years 4 months of experience in Power supply, RF PCB layout and High-Speed PCB design using Cadence Allegro and Altium Designer.

Skilled at problem solving related to the design, fabrication and assembly. Professional Experience

Organization : Embizon Technology. Bangalore, India. Designation : PCB Designer

Duration : 04 Feb 2019 – Till Date

EDA Tools (Schematic, Layout and Footprin )

● Cadence Allegro (16.5, 16.6, 17.2 and 17.4).

● Altium Designer

● IPC Library Experts

Gerber Tool

● CAM350 10.2

Educational Background

Qualification Institution

Year of

Passing

Percentage

BE

Mechanical

Bannari Amman Institute

Of Technology.

2018 65%

DME Pandiyan Polytechnic College. 2015

84%

Job Responsibilities:

Studying the customer requirements

Estimating the design and providing quote

Drawing schematics for all type of Electronic Circuit diagram.

● Creating symbols and footprint as per the IPC 7351B standard.

● Board designs as per customer requirement.

● High Speed Digital and mixed signal PCB design expertise.

● Designed Power, Control, Digital, Analog, RF & High Frequency applications PCB's.

● Knowledgeable in micro-via, buried/blind-via and pad-on-via technology and other complex designs using BGA and LGA components.

● Experienced in controlled impedance (with 50E, 90E,100E and 120E) layer stack up and routing.

● DDR3, Ethernet,USB and HDMI layout design techniques.

● Worked on High Layer count boards (14 layers) Power PCB Layout.

● Worked well in a team environment with design engineers and software engineers to design evaluation test boards.

● Panel creation for different boards using CAM350.

● Creating & Checking the Gerber & Plot files.

Description:

Planning with a different fan out pattern instead of going with regular one which might increase the number of layers for routing and this helps us to take more traces out of the BGA.

To decide on the stack up by considering the requirements of the design.

Placing decoupling, series termination resistors and other critical passives right under the BGA pins by choosing a minimum recommended footprint dimension so that we get more space to accommodate all the components inside.

Placement of the critical components, mating connectors, regulators and other devices at a desired location within the specified boundary.

Routed all types of critical nets with via modelling and anti-pad clearances and with all clearance specifications for better Signal integrity of the design. Responsibilities:

With my experience at Embizon and work knowledge from Dover, Pathpatner, I know the benefits and importance of team work in a globally competitive world and I know the factors necessary for an effective team development.

I can well work with team on multiple jobs at a time on a short term challenge which I already have much experience in it.

Can make a good communication and able to present a good and effective meetings.

Provide technical support to my team.

Other Key Jobs Which I Handled Includes:

SH3 (EINFOCHIPS)-Bangalore

● Tool’s: Cadence Allegro

● Client: EINFOCHIPS, INDIA

● Stack up :12 layers

● Responsibility: Complete PCB layout activities

BOARD TITLE - CARRIER: This board includes major interfaces such 14(HDI DESIGN) layers with high speed of 10Gbps, Length Matching Differential Signals with 100ohms Impedance.

BOARD TITLE -SOM : This board involves 12 (HDI DESIGN) layers with high speed 10Gbps,Length Matching Differential Signals with 100ohms,Impedance,1099pins BGA,484pin BGA, Transformer, USB connectors.

DEVICE MAIN BOARD (EINFOCHIPS)-Bangalore

● Tool’s: Cadence Allegro

● Client: EINFOCHIPS, INDIA

● Stack up :8 + 4 layers (RIGID FLEX)

● Responsibility: Complete PCB layout activities

BOARD TITLE - BRAINNAVI:This board includes major interfaces such 8+4(RIGID FLEX) layers, Length Matching Differential Signals with 50ohms RF signals,90ohms USB Impedance signals and power board. IAA DCU (PATHPATNER)-Bangalore

● Tool’s: Cadence Allegro

● Client: PATHPATNER, INDIA

● Stack up :8 +4 layers (RIGID FLEX)

● Responsibility: Complete PCB layout activities

BOARD TITLE –IAA DCU- This board involves 12 layers with high speed SIGNAL, eMMC BGA with 0.8mm picth 153pins, Pcie interface,CPLD with 324pins, 1.0mm FunOS ASIC with 537 pins.

BOARD TITLE –PDLC- BOARD- This board involves 6 with 15 Amps of current with the combination of Power module and Signal Module BOARD TITLE –BROS DCU- BOARD- This board involves 8 with 10 Amps of current with the combination of Power module and Signal Module ELBOW TESTER (DOVER)-Bangalore

● Tool’s: Altium Designer

● Client: Dover India Pvt Ltd, INDIA

● Stack up :10 layers

● Responsibility: Complete PCB layout activities

BOARD TITLE – ELBOW TESTER: This board involves 10 layes by using microcontroller with Length matching Differential of 90ohms and 100ohms . Personal Profile

Name : PRADHEEP.V

Father’s name : VELLIYANGIRI.M

Address : 332 MIG TNHB

PHASE 2

TIRUPATTUR (DIST), Tamilnadu.

Pin-635 601

E-Mail ID : adno1y@r.postjobfree.com

Phone No : +91-848*******

Date of birth : 20-06-1997

Sex : Male

Marital status : Single

Nationality : Indian

Language know : English, Tamil

Declaration:

I, Pradheep V do hereby confirm that the information given above is true to the best of my knowledge.

Date: Signature

Place: Bangalore. (Pradheep V)

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