Michael Russell Uy Gonzales
*****@*****.*** / ********************@*****.*** +65 90077430
EXECUTIVE SUMMARY
Highly motivated, result oriented with more than 17 years of experience in Test, Product, NPI, Supplier Quality Engineering in the semiconductor industry
Knowledgeable in wafer sort, assembly and final test qualification and process with extensive experience in OSAT/subcon management.
SKILLS
Black Belt Lean Six Sigma Trained (2013) / Green Belt Lean Six Sigma Certified (2009) Statistical tools and software (JMP, Galaxy)
Production and Quality Management tools (FMEA, DOE, SPC, C&E / Fishbone, CAR /8D etc) Knowledge in supply chain, procurement, logistics, supplier quality Operating Systems (Windows, Linux, UNIX) / MS Office Application (Word, Excel, PowerPoint etc.) WORK EXPERIENCES
1. Globalfoundries Singapore (Jul 2015 – present) MTS Postfab Engineer
Lead customer and interplant NPIs to OSATs
Analyze product / manufacturing issues, deep dive root cause and implement corrective / preventive actions.
Manage and improve product quality, yields, cycle times and on-time shipment
Drive OSAT KPIs (cycle time, yield, CARs etc) and work on improvement plans to achieve the targets
Manage new test program, tester, hardware qualifications & production buyoff to subcon.
Drive CIPs and cost reduction to improve company profit margin
Raise PR/PO for engineering and hardware purchase and validate cost induced with procurement.
Provide valuable input to QBRs
Globalfoundries acquired IBM Microelectronics Division in July 1, 2015 2. IBM Manufacturing Solutions PTE Ltd (Oct 2008 – Jun 30, 2015) Staff Engineer
Manage Wafer Test, Assembly (Wirebond) and Final Test subcontractor in Asia for ASIC and RF products
Drive and champion NPI from US (Burlington) to subcons including tool qualification/release.
Analyze product issues at subcon to deep dive root cause and implement corrective actions.
Lead and conduct and annual audit at subcon
Drive and review 8D/CAR for quality improvement at supplier sites
Review supplier specs, control plans and procedures for compliance to IBM’s criteria & requirements
Lead and drive special projects and CIP (Continuous Improvement Projects)
Collaborate with internal team (SQE, E2E, Planning, and US overseas team) in ensuring products are manufactured and delivered to customers with good quality and reliability and on time. SIX SIGMA BLACK BELT ROLE
Coach Six Sigma Green Belts on their respective project.
Serve as an external Black belt panel for certifying green belts
Represent the whole Product Engineering team on the Site Process Innovation initiatives 3. Chartered Semiconductor Manufacturing (Jan 2008 – Oct 2008) Associate Engineer
Collaborate with Process Integration (PI) Engineers and Yield Enhancement (YE) Engineers for any fab related issues seen evident after sort to promote yield improvement.
Drive activities with different subcons through commonality analysis and communicating with Turnkey Engineers and corresponding subcon PE for any probing set-up related issues.
Document wafer related issues for easy tracking
Provide product engineering support to failure analysis lab for electrical fault isolation.
Provide technical expertise to CE and subcon to help customers run product-level evaluations 4. United Test and Assembly Center LTD (Dec 2006 – Jan 2008) Associate Engineer
Provide support for final test devices and wafer sort lots in production line
Creation and updating of stdf and summary files to customer
X-ray and analysis of high conti units and feedback to engineer and report to customer
Updating of daily yield report and feedback to customer
Identify and feedback findings of abnormal issue to respective Product Engineers 5. Analog Devices Inc. (Jun 2004 – Oct 2006) Test / Product Engineer
Communicating with Product Line counterpart in Wilmington, MA to coordinate product issues and projects on a bi-weekly basis.
provide data for QA failures and establish prevention of future recurrence
regularly monitor manufacturing yield and make yield improvement projects
yield analysis evaluation of new products
disposition of lots on hold due to product related issues as well as valid in-line sampling failures that are potential reliability risk
bench testing and verification
AWARDS / ACHIEVEMENTS
o Authored / co-authored 3 patents successfully filed and granted Patent Application
Efficient Method of Retesting Integrated Circuits (US9494650)
Screening Methodology to Eliminate Wiresweep in Bond and Assembly (US9470740)
Real-Time Remote Auditing (US20150332279)
o 2017 Globalfoundries Spotlight Award (QFN ~300k cost saving for sourcing benchmarking) o 2015 IBM Outstanding Innovation Award
o Manufacturing Leadership Award for Operational Excellence Leadership Award (2015) - member o 2014 IBM Eminence and Excellence Award
o 2013 IBM Green Star Award for the Test Salvage DOX project o Spot Awardee for resolving Motorola Customer Return in Analog Devices Philippines (2006) TECHNICAL PAPERS / PUBLICATIONS
o Method of Using Parametric Data to Screen Modules in Final Test to Safeguard Product Quality (2016) IP.com
- author
o Applying Lean Six Sigma in Manufacturing (2014), Surface Mount Technology Assembly (SMTA) Conference Southeast Asia – co-author
EDUCATIONAL BACKGROUND
2017 – 2019 National University of Singapore
Postgrad: Master of Science in Management of Technology 1999 – 2004: Mapua Institute of Technology (Manila, Philippines) Degree: Bachelor of Science in Electronics and Communications Engineering TRAININGS ATTENDED
1. Project Management Training – Gandhi Murugan
2. Black Belt Lean Sigma Training – Luca Bencini
(Master Black Belt)
3. AUTOCAD Training – Crown Systems Pte Ltd
4. Teradyne VBA Fundamentals – Alan Tham
5. Intro to JMP for Engineers – Dr. Veronica Czitrom 6. Basic DOE – Dr. Veronica Czitrom
7. RF IC Technology – Prof. Simon Wong
8. Labview Training – Engr. Geoffrey Pablo
9. Data Analysis Training – Engr. Manny Malaki
10. Coaching the Coach – Chot Reyes
11. My Management of my Peso – Francisco Colayco
REFERENCES
Available upon request