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senior Design engineer

Location:
United States
Salary:
$80
Posted:
May 11, 2021

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Resume:

Raghava Alapati

Mobile: +1-737-***-**** E-Mail: adma88@r.postjobfree.com

Linked in: https://www.linkedin.com/in/raghava-alapati-514b82203/

Professional Abridgement

* ***** ** **** ********** in Design, Development, Verification & Validation, Testing, Qualification of Product, Project Lead, Project Management, Procurement of raw material and Scrum Master. Skilled in Analog, Digital and High-speed circuits in Electrical Electronics products make me confident seeking a challenging position in a company.

Employment summary

Oct 2017 –Till Date (3.7 Years)

Organization : Works for Rockwell Automation(Client)

Designation : Hardware Design Engineer

June 2014 – August 2017 (3.3 Years)

Organization : Ananth Technologies Ltd, Hyderabad (India)

Designation : Intern, Trainee Engineer & Design Engineer

Technical Skills

Schematic Tools: Altium Designer, ORCAD Capture & Allegro, PADS, Mentor Graphics Dx Designer & Hyperlynx.

Hardware Design: Analog, Digital, High Speed, AC-DC, DC-DC, Low Power, LDO, Linear Regulator.

Interfaces: Differential lines, PCI, SPI, I2C, I2S, RS232, RS422, Ethernet, Parallel bus, USB, UART, GPS.

Equipment: Oscilloscope, E-Load, logic Analyzer, Power Analyzer, Signal Analyzer, Generators, Multimeter.

Industries: Automotive, Aerospace, Consumer Electronics, Industrial Automation, Manufacturing.

Programming Acquaintance: Ability to read & perceive Existing code in C/C++, VHDL, Verilog.

Standards Exposure: Familiar with BSEE, IEEE, UL Stds and respective Internal company quality STDs.

Documentation: PRD, PDR, FRS, HLDD, DDD, FMEAs, TS, TR, QTP, EMI-EMC, ENV, UM, SIP, Datasheet.

EMI/EMC: ESD, Conducted Immunity, Radiated Immunity, Radiated Emissions, CE, Surge, EFT, etc.

Environmental Tests: Shock & Vibration, Drop test, Stress Test, Temperature, Thermal Cycling.

Design Experience

Good at checking the Feasibility of different ways of doing form ideas generation to Release.

Familiar with engineering design process and product life cycle.

Developed in different types of Analog Sensors signal conditioner modules like Strain, Pressure, Ultrasonic, vibration, acceleration, Potentiometer, Flow rate, Temperature using FPGA & SOC based boards etc.

Designed various digital boards with Microprocessors, Microcontrollers of different Vendors like Microchip, Renesas, Texas Instruments, ST Microelectronics, and Silicon Labs.

Development of Power Management solutions such as DC to DC Converters, Low Drop out Regulators, Linear Regulators, Battery Management, Motor driving control system.

Components Selection, Block diagram, Schematics Preparation, Bill of Material Finalization.

Experience in doing Electrical Wiring diagrams such as Electrical Integration Architecture.

Experience in Multiple interfaces like DDR, SDRAM, SRAM, Flash, RS232/422/485.

Development of motor drives, inverters, SMPS, AC to DC Converters and DC to DC Converters, LDO’s, Linear Regulators.

Experience in test setups, test equipment maintenance, support, inventory, procurement.

Familiar with engineering design process and defining Product hardware Architecture.

Understanding of Basic Firmware and ability to understand existing code and modify it.

Knowledge in Arduino ATMega2560 Evolution board. It is 8-bit Microcontroller with 256K in System Programmable Flash, 54 Digital input/Outputs out of 14 can be used as PWM outputs for Motor control, 16 MHz of Clock speed, input voltage is (7-12V) DC, and 16 Analog inputs.

Knowledge on Inertial Navigation systems (INS), GPS & Inertial Measurement Unit (IMU).

Knowledge on Programmable logic controllers (PLC’s), Analog, Digital Inputs & Output (IO) Modules, Relay Output Modules, LAN Modules, Ethernet devices etc.

Analysis Occurrence

Hands on Experience in Power budget Calculations, Thermal & Heat dissipation Analysis.

Expertise in doing simulations for Analog & Power Electronics circuits.

Experience with PCB layout oversight using Allegro.

Knowledge in High-speed design, Noise suppression techniques.

Expertise in execution of Electrical Design Verification Test cases.

Good electrical measurement techniques.

Excellent debug skills of board and test set-up issues.

Ability to provide innovative test solutions and fixtures.

Expertise in soldering skills for board/test set-up modifications.

Take the product through development, compliance testing, operator testing, ramp up and sustaining.

Experience with Technical document writing using Visio, Word, Excel, and / or PowerPoint.

Experience with Revision and Document control.

Verification & Validation (Testing): -

Experience in doing in circuit Test, Board brings up, Functional Test, and Board level Tests.

Ability to provide innovative test solutions and fixtures.

Works with other functional teams to Investigate root cause issues and find solutions.

Experience in EMI/EMC Tests, Vibration, Acceleration, Shock, Thermal Cycling, High Temperature, Low Temperature, Pressure, Rain, Tropical, High Altitude, Sand & Dust, Bump.

Validated hardware and software in hostile environments by performing environmental tests.

Leadership Roleplay: -

Share the ideas with different suppliers on various design approaches.

Exchange the information with seniors and management to approvals for various stages.

Works with Software team to develop the Graphical user interface platform.

Communicate with Firmware team to write the Programming for the main controller in the board.

Co-ordinate with Procurement team on purchasing the components.

Synchronize with PCB Engineer on Placement, Layout, Layer Stack up and Routing.

Correlate with Mechanical Engineer on Product Dimensions and Arrangement of Connectors.

Collaborates with Management, Product Marketing, Planning, Quality, regarding project progress.

Production/Manufacturing support: -

Develop and maintain instrument/subsystem test station for production.

Expertise in soldering skills for board/test set-up modifications.

Guide Technicians on through hole Component Soldering, Potting and Conformal coating for PCB Assembly and wiring and Involved on Manufacturing Process and Familiar with ROHS & Non ROHS Process.

Knowledge on Stencil usage, Apply Solder paste on bare PCB’s, Programming to SMT machine regarding component locations on PCB, arrange components Reels & Trays respective to machine, Components Assembly, Maintain required Temperature.

Role & Responsibility:

As a Project Lead managed the project from ideas generation to production.

As a Scrum Master Co-ordinated Daily stand-up meeting & Sprint Project Planning with others.

Collection of Requirements and analysis.

High Level Architectural approach.

Preparation of Hardware requirement specification and High-level design document.

Schematic Capture & Layout using ORCAD, Dx Designer, Zuken and Altium.

Component Selection and BOM Preparation.

Design Analysis I.e., Power Analysis and Placement analysis.

Procurement of raw material.

PCB layout support and verification.

Board brings up, testing, Delivery to Customer.

Debug the problems reported by costumer.

Project Profile: -

IO-LINK Master (Team Size: 12)

The applications of this module are in manufacturing industries to establish communication between Sensors & Actuators with Controller. The module has 8 Ports. These 8 Ports are divided into 4 Class A Type and 4 Class B Type Ports. These Ports can be user configurable as IO-Link channels/ Digital Input/ Digital Output channels. It is designed with Rockwell NEO-S ASIC and STM32 Microcontroller. This has high speed Interface like Ethernet speed of 1 Gbps through DDR Interface. The Backplane controller has USB interface and Communication Establish via parallel bus. IO-Link PHY chips are connected through SPI Interface to Microcontroller and Flash is connected to QSPI Interface. The IO-Link Protocol works through IO-Link PHY Chip via M12 Standard Connectors Interface. This module has high current capability of 16A rating through Mini 4/ Mini 5/ L-Code Industry Standard. The high current rating achieved through High side Switch. The input voltage is 18V to 32V.

Analog input Data Acquisition Module (Team Size: 12)

This Module receive Analog input data from sensors in two different modes one is Voltage mode (0-10) V and another is Current mode (4-20) mA. The input data done signal conditioning then given to ADC then processed through FPGA and the digital data as outputs.

Digital Input & Output Module (Team Size: 8)

This Module input and output only Digital type of signals of certain range like 18 V to 32V and this does the process of input signals and send data through Ethernet and USB and will communicate through Backplane to various modules present in the eco system.

Digital Signal Receiver & Processing Unit (Team Size: 10)

This project mainly designed to receive real time data and process high speed digital data for measurement applications. This unit consists of Xilinx SOC, high speed ADC’s and Communication protocols like Ethernet and USB and high-speed interfaces like DDR3.

AC to DC Converter (Team Size: 08)

The applications of this module are in Power electronics and Converters. The Module inputs is 230V AC and Output is 5VDC.

Motor Controlling System (Team Size: 08)

This project has two main goal to control the Motor, by using DRV8825 Texas Instruments Motor Controlling IC, we can eliminate External MOSFET’s drivers and space requirement on board with Microcontroller.

Education Credentials: -

Qualification

Specialization

University

College

Mon & Year

Masters

Power System Control & Automation

Jawaharlal Nehru Technological University Kakinada, India

QIS College of Engineering & Technology

Ongole, India

March 2017

Bachelors

Electrical Electronics Engineering

May 2014

12 th Class

Maths, Physics, Chemistry, English

Board of Andhra Pradesh state, India

Sri Chaitanya Junior College

April 2010

10 th Class

Maths, Science, English

Bhashyam high School

March 2008

Honour & Award: -

oAcquired Appreciation in Various Technical Demos & Presentations at School & College level.

oStood in 14th place in Andhra Pradesh state level Bhashyam school talent test.

Personal details: -

Languages : English, Telugu, and Hindi.

Marital Status : Single

Nationality : Indian

Hobbies : Exploring new technologies, Fitness Workouts, Volunteering Participation.



Contact this candidate