SIKHAMANI BANDI

PCB Board Design Engineer,

adke7t@r.postjobfree.com.

+91-725*******.

CAREER OBJECTIVE:

Seeking company with the potential to expand and grow in which my PCB Layout skills can be utilized to their fullest.

ACADEMIC DETAILS:

B.Tech (Electronics & Communication Engineering) from PEC(JNTU University), 2008.

12th from Sri Prathibha Jr College, Kandukur, 2003. SKILL SET:

1. Have experience in Cadence Allegro Library (ADW & EDM) and Layout tool [Version – 16.6 & 17.2]

2. Creates Logical Symbols, Land pattern footprints of all type of electronic components, mechanical parts, Sockets, mechanical drawings and other PCB related parts.

3. Have experience in delivering PCB CAD layout of High Density – High speed, mixed, Analog, Digital, RF designs, flex designs etc. 4. Worked on many high speed interfaces like PCIE, DDR4, Display Port, Thunder Bolt Signals, HDMI, and USB3 in INTEL SoCs. 5. Have experience in HDI Micro via technology, Multilayer PCB Layout & routing, impedance/length matching, RF design, blind/buried vias.

6. Have experience in constraints settings for DFA, DFM, DFT and interface design class and types.

7. Gerber files generation and engage with ME to ensure quality of board.

8. Have basic knowledge of Signal integrity, Power integrity, EMI/EMC, Mechanical and Thermal analysis with respect to PCB board layout.

9. Create a project using Allegro EDM flow manager and concept HDL, process the design through packaging, export to the PCB editor. 10. Capable of working long hours.

EXPERIENCE DETAILS:

1). PCB Layout Engineer @ Klaus IT Solutions Pvt.Ltd(Nov 2017 – Present).

Client: Intel Technologies India Pvt.Ltd

Responsibilities:

1. High speed PCB Layout with Cadence 16.6 & 17.2 and OrCAD Capture.

2. HDI Designs with Micro Vias, Stacked via & Via-in-Pad 3. Import netlist and interact with DEs and DFM Engineers. 4. Multi-layer PCB design Placement and routing, constraints settings. 5. Complete assembly drawings.

6. Professional fabrication documents.

7. Good exposure to EMI/EMC and DFM/DFT, Signal integrity requirements to adhere Quality assurance.

8. Create Logical and Footprint symbols and upload into EDM servers. 9. Automation and Skill scripting knowledge

2). Embedded Hardware Engineer @ Radiant Coral Digital Technologies (March 2015 – Nov 2017).

PROJECTS:

1. UAV Auto-pilot.

2. CC3200 WiFi Board.

3. CAM Controller based on DM368 SoC.

4. Power back-up system based on Fuel Cell Technology. Responsibilities:

1. Focus on innovation and initiatives to improve entire new product development cycle from Kick-off till Product launch (including concept designing, supplier selection, testing & design finalization, and verification/validation activities).

2. Design & develop boards for Aerospace/Defense (Autopilots, Quadrotors), Wi-Fi/BT Boards, IP Camera Boards, Hybrid Power supply Boards.

3. Design & Development of Schematic and High Speed PCB layout

(Double and Multilayer) using OrCAD and CADENCE as per IPC standards.

4. Have Knowledge on processor & Micro-controller, FPGA, DDR2, DDR3, Flash, USB, RJ45, RS232, RS485, Ethernet, I2C, SPI Protocols.

5. Create schematic, library management, footprint and symbol creation of all components based on Datasheets.

6. Creates and maintain Engineering documents (BOM, DRC, GERBER, and PICK & PLACE).

7. Order PCB Prototypes.

8. Create 3D computer model by using Google SketchUp. 9. Joined with R&D team to develop and improve future projects and fixing the bugs.

2). Electronics Engineer @ Micro Cell Computer Technologies (July 2011 – March 2015).

PROJECTS:

1. Interactive Voice Response System (IVRS).

2. 50W mini inverter.

Responsibilities:

1. Design & development for IVRS Product based on 8051 Microcontrollers, Power supply Boards.

2. Design & Development of Schematic and High Speed PCB layout

(Single, double and Multilayer) using Cadence/Allegro tool. 3. Create schematic, library management, footprint and symbol creation of all components based on Datasheets.

4. Coordination with process engineering, production, marketing and sales departments to establish and evaluate design concepts for manufactured products.

5. Evaluate, Debug, Assemble the Product for delivery. 6. Working on various testing procedure like EMI/EMC using Zigs & Fixture with CRO, Multi Meter.

3). Graduate Trainee Engineer @ XL Telecom & Energy Ltd (June 2009 – March 2011).

Responsibilities:

1. PCB Board design for Double layer boards

2. Footprint creations and library management.

PERSONAL PROFILE:

Date of Birth : 20-06-1985.

Marital Status : Married.

Wife’s Name : Indira Priyadarshini.

Passport No : K1387801.

Languages Known : English, Telugu, Kannada, and Tamil. Present Address : #3, Thimmakka Building, 1st floor, 2nd Cross, Muniswamappa Layout, A Narayana Pura,

Bangalore – 560016.

DECLARATION:

I hereby declare that the information given above is true as per my knowledge and belief.

DATE: SIKHAMANI BANDI.

PLACE:

Contact this candidate