PRATEIK SANGEKAR
MECHANICAL ENGINEER
682-***-**** *******.********@*******.*** https://www.linkedin.com/in/prateik-sangekar/ Dallas/FW, TX-75043 Experienced Mechanical Engineer passionate about Product Design and Development, Finite Element Analysis, Material Testing, Manufacturing Engineering, and Electronics Packaging. Proven skills to read, analyze and interpret blueprints/drawings, create/modify 3D parametric models and implement process improvement techniques and conducted quality inspection. Problem solving ability to work independently and as a cooperative team member. SKILLS
• Computer Aided Design (CAD)
• Design for Six Sigma
• Finite Element Analysis (FEA)
• Siemens NX
• SolidWorks
• ANSYS
• Electronics Packaging
• Failure Effect Mode Analysis
• Design for Manufacturing
• Additive Manufacturing
EXPERIENCE
Larson Electronics LLC., Kemp, TX
Mechanical Engineer March 2019 – Present
• Design explosion-proof industrial lighting and fixtures, and power distribution units using 3D CAD modeling software
(SolidWorks), resolve design/fabrication issues on the fabrication floor.
• Analyze requirements, functional specifications, design specifications while creating products with parts made from laser-cut, water jet, sheet metal bending process, CNC machines and weldments.
• Develop custom and mass production designs by working alongside cross functional teams of Electrical and Mechanical Engineers to combine solutions in the products.
• Perform FEA analysis and validate the product for operation conditions using SolidWorks Simulation, implement changes to improve manufacturing processes.
• Create Engineering drawings of assemblies using Geometric Dimensioning and Tolerances (GD&T), and BOM for release to fabrication utilizing ASME Y14.5 drafting standards.
• Reverse Engineering on current products, interoperate fabrication personnel to allow for improvements from Fabrication, and solve manufacturing problems. Able to manage multiple projects simultaneously.
• Using Additive manufacturing for prototyping new products, undergo testing and bring them through the manufacturing process.
EMNSPC Laboratory, The University of Texas at Arlington Graduate Research Assistant July 2018 – March 2019
• Conducted material characterization of PCBs (FR-4 and Megtron 6) using Thermo-mechanical analyzer and Dynamic mechanical analyzer.
• Developed 3D models of electrical components from new concepts and 2D drawings for running simulation and analysis. (SpaceClaim)
• Performed Structural (Stress/Strain) and Thermal Finite Element Analysis simulations using ANSYS, for reliability of semiconductor packages.
Elm Enterprises Pvt. Ltd., Mumbai, India, Mechanical Engineer January 2016 – June 2016 Technic Constructions, Mumbai, India, Mechanical Engineer October 2014 – September 2015 Siemens Ltd., Mumbai, India, Mechanical Design Intern January 2013 – March 2013 PROJECTS
Temperature Measurements in Microfluidics May 2018 Comprehensive study of distinct temperature measurement techniques for PDMS chips:
• Microfluidic Whole-Chip Temperature Measurement Using Thin-Film Poly dimethylsiloxane/Rhodamine B
• Dynamic Temperature Measurement in Microfluidic Devices Using Thermochromic Liquid Crystals
• Microfluidic Channels with Integrated Ultrasonic Transducers for Temperature Measurement and Method Thermal Cycling of a BGA package November 2017
• Created a Semiconductor package model with SolidWorks, Conducted FEA for thermal and stress analysis.
• Reported the deformation and stress subjected on the package as a result of thermal cycling simulations. 3D Printed Intake manifold October 2017
• Designed an intake manifold using additive manufacturing approach, created a CAD model using SolidWorks.
• 3D printed intake manifold for optimum airflow using a Fused Deposition Modelling additive manufacturing process. EDUCATION
Master of Engineering – Mechanical Engineering, The University of Texas, Arlington, TX May 2018 Bachelor of Engineering – Mechanical Engineering, University of Mumbai, India June 2014