Mechanical Engineer Assistant

Nayan Goyal

**** ****** *****, ********, **, ****5 240-***-**** adjs1p@r.postjobfree.com LinkedIn - www.linkedin.com/in/nayangoyal

Professional Portfolio - https://nayangoyal7.wixsite.com/engineeringportfolio EDUCATION

University of Maryland (UMD) College Park, MD

M.Eng., Mechanical Engineering, GPA: 3.37/4.0 May 2020 Rajiv Gandhi Proudyogiki Vishwavidyalaya (RGPV) Indore, India B.Eng., Mechanical Engineering, CGPA: 7.31/10 May 2017 WORK EXPERIENCE

Mechanical Engineering Intern Aerolab LLC, Jessup, MD Nov 2020 - Jan 2021

• Performed structural and modal analysis of the wind tunnel parts using SolidWorks to verify the structural integrity and to calculate the fundamental frequencies of the model.

• Optimized the mechanical performance of the wind tunnel parts by adding supporting structures to the areas prone to failure.

• Modified the wind tunnel design to shift fundamental frequencies of the structure to avoid resonance.

• Provided engineering support by creating parts, assemblies in SolidWorks, along with detailed fabrication and installation drawings of wind tunnel parts.

Faculty Research Assistant University of Maryland, College Park, MD July 2020 - Oct 2020

• Designed a biomedical device known as BondTrue 2.0 in SolidWorks which utilizes a cost-effective dressing to apply a constant tension around the wound to promote healing.

• 3D printed the prototypes in Ultimaker S5 and tested them to provide feedback to the physician.

• Modelled the design performance of constant tension element by conducting FEA in ANSYS and used the results to drive design changes.

Graduate Research Assistant University of Maryland, College Park, MD Jan 2019 - May 2020

• Designed an ergonomic surgical device known as Bondtrue 1.0 to automate the process of surgical incisions and sutures which was fabricated using an Ultimaker 3D printer, by collaborating with a physician for FDA approval.

• Modelled the plastic deformation response of layer jamming composites which was validated using Digital Image Correlation (DIC)

• Developed an analytical method by adapting the theory of Continuous Stiffness Measurement (CSM) to quantify the degradation in material properties of metals at a localized region subjected to cyclic loading. Mechanical Engineering Intern BoxUp, Knoxville, TN Feb 2019 - May 2019

• Designed the components of modular endoskeleton product that can be easily installed in a shipping container using SolidWorks.

• Conducted structural analysis on the endoskeleton model to validate its structural integrity using ANSYS.

• Reduced the cost of the endoskeleton product by 20% after replacing the aluminum component in the model with structural steel.

• Proposed concept designs for a solar panel mounting system to be installed on the roof of a shipping container. Engineering Intern Volvo Eicher (VE) Commercial Vehicles Limited, India Jun 2016 - Aug 2016

• Designed Operational Method Sheets (OMS) for the automotive parts of a Pro 3008 truck model and validated its implementation on the assembly line with the help of technicians.

• Performed a quality inspection for the cabin of the vehicle and implemented solutions for removing existing defects.

• Developed a system for the identification and management of trolleys by using the 5S method to reduce incurred production losses. PROJECT EXPERIENCE

3D Printed Upper Limb Prosthesis (UMD), Team Leader Apr 2019 - May 2019

• Led a team of 4 people in the design and fabrication of a customizable and cost-effective prosthetic hand ($3 - $5) which was 3D printed in Makerbot using a PLA material.

• Simulated the model in ANSYS to measure the joint strength & maximum stresses in the prosthetic hand while gripping objects which showed that the model can withstand a maximum load of 70 N ideal for day to day usage.

• Tested the prosthetic hand using an IMADA MX-500 testing machine to validate the simulation results. Designing parts for FDM/FFF AM technologies (UMD), Team Member Feb 2019 - Mar 2019

• Awarded 1st place in a design challenge for designing a bridge capable of supporting 20 lbs while only weighing 15.3 grams.

• Minimized the mass of the bridge by using the Topology optimization function in SolidWorks which optimized the material layout within the design space.

• Reduced the post-processing time for a 3D printed model by generating tree support structures in Meshmixer for easy removal. Individual Case Study Redesign on Disc Braking System (UMD), Individual Project Mar 2018 - May 2018

• Analyzed the performance and drawbacks present in an existing disc braking system.

• Applied different design methods such as Word Tree method, Triz & Biomimicry to create several new designs of the disc braking system.

• Performed calculations to evaluate the performance of several redesigns of the disc braking system and compared their performances and costs to select the best design.

Multi-Terrain Robot (RGPV), Team Leader Mar 2016 - May 2016

• Led a team of 5 people to design and fabricate a robot that utilized a rocker-bogie mechanism for moving in rough terrains.

• Improved the performance of the suspension system by using thin-walled box beams as structural members to withstand higher torsion and bending loads, and tapered the beams to reduce the mass.

• Modified the wheel design by incorporating arcs on the circumference to reduce wheel slippage while climbing the stairs. PUBLICATION

R. Acevedo, L. Santos, R. Pedersen, N. Goyal, N. Bruck, S.K. Gupta, and H.A. Bruck, Characterization and Modeling of Layer Jamming for Designing Engineering Materials with Programmable Elastic-Plastic Behavior, Experimental Mechanics. SKILLS

Design & Analysis - AutoCAD, Creo, SolidWorks, CATIA V5, Altair HyperWorks, LS-DYNA, ANSYS, NX 11, and RADIOSS. Data Collection and Processing - Digital Image Correlation, Minitab, MATLAB, Python, and Microsoft Office Suite. Manufacturing and Testing - Lathe, Milling, Universal Testing Machines, Optical Microscope, Laser Cutter & Engraver and MIG Welding. Technical Knowledge - Mechanical Design, GD&T, CAE, Lean Six Sigma, Structural Analysis, Rapid Prototyping & Electronic Packaging.

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