Resume

PERSONAL PARTICULARS

Name: Jin Donglin

Nationality: China

Age: 30

Contact Number: +82-103*******(Korea);

Address: **, **************-**, ********-**, Incheon, Republic of Korea Email: adil5u@r.postjobfree.com

ACADEMIC QUALIFICATIONS

Master of Engineering (Information and Communication Engineering) INHA University (Korea) 09/2013~07/2015

Bachelor of Engineering (Electronic Information Engineering) North College of Beijing University of Chemical Technology (China) 09/2009~07/2013 CAREER SUMMARY

An application & service engineer with rich technical support experience for inspection and metrology tools, which are mainly used in advanced packaging process, such as HBM, FOWLP and System in Packaging process. Supporting most advanced customer sites in semiconductor industry such as SAMSUNG, SKHYNIX, ON-SEMICONDUCTOR and MICRON. CORE COMPETENCIES

Proficient in supporting tool application, increase baseline (application step) to improve tool usage. Familiar with customer process and needs. Understanding for competitor application.

Ability to manage projects and solve problems independently, including tool installation, troubleshooting, application support and extension. Responsible for MICRON sites by myself with 6 tools.

Specialized in Machine vision algorithm, have development experience, quickly understand tool’s function and algorithm.

Patient, customer oriented, multi-task, able to work well under pressure and overcome tight schedule. Usually develop programs to improve my work efficiency.

Multi language speaker, can communicate in Korean, Chinese and English. PROFESSIONAL EXPERIENCE

ADVANCED TECHNOLOGY Inc. KOREA 2015.08 - 2018.09

Technical POC for Micron Singapore, responsible for application & maintenance service support for 4 wafer inspection tools, which are used in back grinding, wafer sawing process, mainly inspect particle or crack in chip pattern, chip edge chipping. 2 substrate metrology tool which are used in chip attach and stack process in substrate, mainly measure chip tilt and thickness.

Solve hardware and software issues, trouble shooting and provide solutions per customer requests. Improve tool usage and new function development, co-work with R&D Team in Korea.

Perform recipe setup, optimization, and give customer training. UNITYSC. FRANCE 2018.10 - Present

Provide application support to customer in Korea (SK-Hynix, On-Semi, Samsung and Amkor) for metrology and inspection tools, which are mainly used in HBM Process. Specialized in tool application, responsible for tool installation to sing-off.

Understand customer needs, check detail specs and inform to HQ correctly. Lead meeting and communicate with HQ about pending issues, development items etc.

Understand customer process and improve tool usage. Regarding metrology tools, most of steps (CB, MOLDING, MBG, EDGETRIM and EBR) of total thickness are measured. Regarding inspection tools, every steps (CB, BSG, ETCH, PR Coating) are inspected for various defects (delamination, bubble, crack, particle, chipping). ACHIEVEMENT

Main contributor for the 1st ATI wafer backside Inspection module successful buyoff in Global Micron.

Main developer for automatic defect classification function successful use case for ATI backside inspection tool - more than 90% achieved for 7 type of defects.

Complete all applications works by myself for 1st UNITYSC inspection tool in SK Hynix.

During the Master period, 1 Journal paper and 1 IEEE paper are published. Get JUNGSEOK scholarship all semester in INHA University (2013~2015). SKILLS

Keywords Inspection & Metrology Tool Application, Packaging

(Back End) Process, Machine Vision Algorithm

Programming Language & Library C/C++, MFC, OPENCV

Language CHINA, KOREA, ENGLISH

Publication

Google scholar

IEEE: http://ieeexplore.ieee.org/abstract/document/7334183/ Fire Safety Journal: http://www.sciencedirect.com/science/article/pii/S0379711215300333

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