I am a Process Assembly Engineer seeking a full-time position in any field of semiconductor or
manufacturing industry, where I can apply my skills and knowledge for continuous improvement and advancement of my career. I have board experience as sustaining engineer to maintain production stability as well as process development which to obtain efficient mass productivity with quality of the products as well as supporting new product introduction(NPI) line. Aside from being a line sustaining, I also work as an offline engineer on die attach process that provides solution on any process difficulties and report generation regarding customer feedback.
• Set-up and operate ASM die bonder machine (AD889, AD898, AD828, AD8912, AD830, AD838 and AD8312).
• Focuses on die attach process efficiency for SOT, MSOP, SSOP, SOIC, TQFP and QFN packages.
• Responsible for line sustaining in accordance to specifications, controls and standards.
• Process stabilization for CPK improvement with minimal process deviation and safe manufacturing systems while improving production rates, efficiencies, yields, costs and changeovers.
• Develop and adapts innovation for process efficient, more productive, cost effective and most important of all high quality standard.
• Develop or provide innovative solutions to any problem occurrences and improvement plans for die attach process.
• Qualification or evaluation of new epoxy and leadframe material for process improvement.
• Perform evaluations, DOE, product and process capability analysis in order to improve product and process capability or quality.
• Buy-off and qualification of new die bonder model machine.
• Wafermap reference creation and verification for correct Bin wafermap pick process.
• Provide and accomplish at least minimum of 3 quarterly objectives or projects for process and quality improvement.
CHRISTIAN DAVE A. BUTAWAN
PROCESS ASSEMBLY ENGINEER
P R O F I L E
P R O F E S S I O N A L E X P E R I E N C E
Process Engineer II
Microchip Technology Thailand
Apr 2016 – Current
#33 Banjo West Tanauan City, Philippines
adi8lj@r.postjobfree.com
+669********(Thailand Mobile#)
• Perform quarterly updates and revision of Failure Mode and Effects Analysis
(FMEA) for the defect controls and station documentation.
• Perform SPEC’s revision for the process updates with the alignment of the current controls.
• Analyze customer returns and determine the root cause of failure mechanism.
• Attending customer meeting feedback regarding the product failure related to die attach process or product development.
• Generate low yield reports, MRB on any yield below customer trip point and 8D reports with root cause analysis regarding the customer feedback issues.
• Perform revision, enhancement and introduction of existing and new test methodologies to improve yield success ratio, manufacturing cost and to reduce test time.
• Conduct machine data validation and analysis for process qualification.
• Conduct Measurement System Analysis (MSA) on high magnification scope, X-Ray machine and die shear test for yearly calibration.
• Support New Product Introduction (NPI) on material verification and product optimization prior processing.
• Provide weekly report per cycle time improvement, defect reduction and project development for cost reduction.
• Development of new or modified process formulations, definition of processing or handling equipment requirements and specifications, review of processing techniques and methods applied in the manufacture, fabrication and evaluation of semiconductors
• Perform machine optimization on die attach machine platform specifically ESEC2008, ESEC2100 and ASM8912SD.
• Line sustaining on production line for any process difficulties, material discrepancy and process verification.
• Generate internal reports regarding on any low yield lots affecting productivity and process efficiency.
Process Engineer I
Amkor Technology Phils.
Jan 2013 – Oct 2014
E X P E R T I S E E D U C A T I O N
MASTER DEGREE Master in Business Administration Major in Management June, 2018 – Current ST. Roberts Bellarmine Bangkok Thailand
(Currently Studying for MBA degree)
COLLEGE Bachelor of Science Major in Chemical engineering June, 2008 – April, 2012 University of Mindanao
COLLEGE Bachelor of Science Major in Chemistry
June, 2005 - March, 2008 Mindanao State University
(Incomplete Degree)
• Process Line Sustaining
• Process Controls and Efficiency
• Process Development
• Project Development
• Report Generation
Process Engineer II
Amkor Technology Phils.
Nov 2014 – Mar 2016
• Automotive Training for IATF 16949
March 2019
Microchip Technology Thailand
• Electrostatic Discharge Training
November 2018
Microchip Technology Thailand
• Advanced Electrostatic Discharge Training
November 2017
Microchip Technology Thailand
• Failure Mode and Effects Analysis
May 2017
Microchip Technology Thailand
• 8D WITH ROOTCAUSE ANALYSIS
November 2014
Amkor Technology Philippines
• BASIC STATISTICAL WITH PROCESS CAPABILITY
January 2014
Amkor Technology Philippines
• Measurement System Analysis
June 2013
Amkor Technology Philippines
• 7QC TOOLS
April 2013
Amkor Technology Philippines
Ekgachai Kenganantanon
Department Assembly Manager
Microchip Technology Thailand
Stephen Candido
Former Section Manager
Amkor Technology Philippines Inc.
T E C H N I C A L S K I L L S T R A I N I NG or S E M I N A R S
• Leadership
• Communication
• Visual Presentation
• Process Knowledge
• Process Optimization
R E F E R E N C E S
Jerome Amado
Former Department Manager
Amkor Technology Philippines Inc.
I hereby certify that the above information is true and correct to the best of my knowledge and belief. CHRISTIAN DAVE A. BUTAWAN