Problem solver, self motivation
Tessolve semiconductor, Coimbatore — PCB Design
July 2018 - November 2020
● Full Contact Wafer -Level Burn-in Probe card
● Enhanced Vertical Probe Card
● Ospray Probe Card
● High Density Modular Tester
Design Work flow
● Designed over 400 components for placement including Through hole and SMD components.
● Difficult power plane creation which includes maximum of 64 amps power plane per layer.
● Routing and length matching has been performed for digital and high speed signals.
● Achieving connection and DRC clean up .
Nandha Engineering College (Autonomous), Erode,
Tamilnadu — BE-Electrical and Electronics Engineering July 2014 - April 2018
Chinasamy ammal Higher Secondary School,
Tirupur - Tamilnadu - 641602.
June 2012 - April 2014
● Good knowledge
● Cadence Allegro 17.2
● Valor NPI
( CAM Validation)
● Mentor Graphics