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Design Engineer Engineering

Location:
Imphal, Manipur, India
Posted:
November 27, 2020

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Resume:

Desired Industry:PCB Designing

Name:Satheeskumar

Mail id:adh6cs@r.postjobfree.com

Contact no:+91-866*******

Career Objective:

To be associated with a progressive organization that gives scope to utilize my skills and experienced electronic engineering while enhancing my professional development and to be a part of a team that dynamically works towards the growth of the organization thereby giving satisfaction to me. Professional Experience:

Caliber Interconnect solution & Pvt Ltd at Coimbatore From:- June 2017 to Present

Designation:- Design Engineer.

I have been working as a PCB design engineer for 3.5 years. My responsibilities are to design a board from schematic to Gerber for all ATE boards.

Handling projects on Probecard, Design of the various customers from USA & Japan countries with managing design engineering operations involving designing.

Techno-Proficient Skills:

EDA Tool : Cadence Allegro V17.2, V16.6

ORCAD

CADVANCE

CAM350 (Basic & IPC netlist checking)

AutoCAD V2002

Operation System : Windows

Strength:

Ensuring On time Project schedule and deliver with quality

Flexible, able to respond to rapid changes.

Multi-tasking skill and has the ability to work in a competitive environment.

Ability to manage a various design.

Ability to work on multiple fields and problem solving skills at critical situation.

Designs Handled:

DESIGN( Cadence–Allegro&CADVANCE)

More than 60+designs handled in ATE probe cards in both vertcal and cantilever types in Allegro and cadvance tools for Japan and US customers. I have worked in a maximum 70 layer stackup in ATE board.Also Worked in 50ohm and 100ohm impedance matching signals and RF signal layer boards. 1

Summary of Knowledge & skills:

Highly capable in all aspects of layout design and troubleshooting, including:

Procedure development for layout design and verification;

Requirements and data consistency analysis;

Schematic capture, library management, footprint and symbol creation;

Bill of materials (BOM)

Coordination between schematic, planning, manufacturing, and quality assurance departments.

Worked on ATE boards like Teradyne J750Ex, Ultra-Flex, 93K, Advantests,T2000.

Educational details:

B.E-Electrical and Electronics Engineering from COIMBATORE INSTITUTE OF TECHNOLOGY(CIT) in 2017, Coimbatore, and Secured First class with 81 %.

Higher Secondary-Biology-Mathematics from Vedhha Vikass Higher Secondary School in 2013, salem. Secured 97 %.

Secondary Schooling Level from G.R.Matriculation school in 2011,salem, Secured 94 %.

Skills & Responsibilities:

• Analyze the customer input and provide the pre-quote to the design.

• To work with client Engineers in front end for design requirements.

• Schematic symbol creation, Schematic development & Netlist generation.

• Footprints importing and Perform High Dense component placement as per customer requirement.

• Placing decoupling, series termination resistors and other critical passives right under the BGA pins by choosing a minimum recommended footprint dimension, so that we get more space to accommodate all the components inside.

• Applying critical Routing constraints for Physical, Spacing and Electrical considerations.

• Consider mixed signals (Analog & Digital) routing and separate the GND reference.

• Perform high speed differential pair routing to meet signal integrity and EMI/EMC requirements and delay matching with tight tolerance.

• Apply datasheets layout recommendation for power regulator circuits.

• Perform power plane segmentation considering the current rating and enable good a Power Distribution.

• Basic DFM and DFA validation checks, Fab Drawing preparation as manufacture standard.

• Gerber generation, assembly files preparations and bill of materials (component selection).

2

• Handled multiple Projects for Global customers simultaneously. Achievements:

Total Numbers of Project done:

ALLEGRO WITH ORCAD : 35

CADVANCE : 25

I have received “Best performer of the Team” Award on March 2020 Projects Handled:

Project : 1

Project Name : Probe Card(J750 EX TESTER)

Tool : Orcad & Allegro

Design summary :

• This is a 54 layer impedance controlled board.

• Used the 50 ohm and 100 Ohm signals.

• Board contains 750 components.

• Also used digital slots, HVDPS and CTO instrument’s in this design.

• Board thickness 6.35mm and used Fr4 material.

Responsibilities:

Analyzing & Schematic creation

Component Placement and fanout

Constraint setting

Routing & power Segmentation

Stack up formation and Fabrication note generation

Non electrical & Gerber Generations.

Project 2:

Project Name : Probe Card(93K TESTER)

Tool : Orcad & Allegro

Design summary:

It is a Direct docking Probe card design which involves testing of BGA with 3035 pins. And used 50ohm, 90ohm &100ohm impedance signals and the design completed in 48 layer stack-up in strip line fashion.Also we used PS1600,AV8(MCA),MSDPS,UHC4 & DPS32 instrument’s.

Responsibilities:

Analyzing the given input

Library & Schematic creation.

Component Placement&Constraint setting.

3

Fan out, Routing and Plane segmentation.

Stack-up preparation.

Bom, Gerber file and assembly file preparation.

Exposure to Probecard Designing Testers:

Advantest (T2000 & T6577,T6575)

Teradyne (Ultraflex & J750EX)

Verigy (93K)

Other Responsibilities:

Worked as a Design Engineer with good problem solving skill.

Prepared presentation for Probe card designs and required tools. Personal Profile:

Name : SATHEESKUMAR.R

D.O.B : 06-03-1996

Father's name : RAJA.V

Sex : Male

Marital status : Unmarried

Linguistic proficiency : Tamil,English,Hindi(Read,write) Nationality : Indian

Blood Group : B +ve.

Hobbies : Surfing the internet,playing and learning about cricket.

Declaration:

I hereby declare that the above given particulars are true to the best of my knowledge and belief.

Place: Coimbatore.

Date: Yours Sincerely,

(SATHEESKUMAR R)

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