AGXIN J

Jurong west street ** * +**-**** **** * adgif6@r.postjobfree.com

CAREER OBJECTIVE

A Hardware design Engineer with more than 8 years of experience in Hardware design and development,Seek- ing for a challenging lead role in product design and development that requires engineering education and expe- rience to design and develop innovative hardware solutions. COMPETENCIES

• Hardware Architecture

• Project Proposals

• Design Analysis and review

• Circuit simulation

• Hardware Documentation

• Schematics Design

• ERP management

• BOM optimisation

• SI and PI analysis

• PCB Design and validation

• Mechanical and Thermal design

• Gerber review and FAB coordination

• Board bring up DVT and FCT

• Debugging and testing

• Production support

• System Integration and testing

• EMI /EMC compliance testing

• Automotive transient testing

• Environmental testing (Thermal Humidity)

PROFESSIONAL EXPERIENCE

Total Experience 8 years 3 month

HPE -(ARUBA)1 Depot Cl, Singapore, 109841.

Hardware Engineer II- November 2018 - Till Date

• NPI board bringup

• NPI-Testing co-ordination

• Alternate supplier identification for MSQ

• Memory,DIMM modules,ComE module Qualification

• EOL Parts Replacement Identification and Qualification

• Debugging and Trouble Shooting of Network Core and Edge Switches

• Field return and production failure Debugging

• Identify and Debug Production Automation issues of NPI Products

• Identify and Troubleshooting Issues in Cache Units

• DVT and margin testing

• Climatic testing

• SIFOS and HI-POT testing

VVDN Technologies Pvt Ltd Chennai, India

Tech lead- Hardware Design,April 2018 - November 12 2018 Hardware Design Engineer, June 2016 – March 31 2018

• PRD and HDD and Block level architecture,Component selection and class-A BOM preparation.

• ERP database creation and management,Symbol and Footprint validation,

• Schematics design and drafting and review.

• DC analysis,Power budget estimation,BOM optimisation .

• PCB Design guideline preparation,Defining Impedance and length matching requirements.

• Stack up planning,Defining power plane requirements.

• PCB design validation, SI/PI validation.

• Gerber review and DFM /DFA checks,Mechanical design review.

• Heat-sink /Fan selection and Thermal design review.

• Stack-up and Fabrication input preparation,Addressing FAB query.

• Software Input Documentation,Test Plan preparation,DVT and PCR document preparation.

• Board bringup, Testing and Debugging,System Integration

• Production input documentation,Assembly Instruction preparation,Production test setup development.

• Product certification for PTCRB,FCC and CISPR testing,Automotive transient testing. TATA POWER SED Bangalore, India

Hardware Design Engineer, March 2015 – May 2016

• HRS and DR Documentation,Schematics design.

• ERP database management,Symbol and Footprint validation for components .

• PCB review,DDR3 interface validation, SI analysis for High speed serial links,PI analysis . Gerber re- view and DFM Checks,Mechanical Design review,Thermal Design review .

• Stack-up and Fabrication Input preparation.

• Board Bring up and testing,DDR3 NAND/NOR Flash interface Bringup testing.

• RCW Creation,PTP and PTR documentation .

• Software Bring up support and system integration .

• EIM/EMC Testing for the product in MIL-STD461-F for CE102/CE101,RE101,RE102 . INDUS TEQSITE /DATAPATTERNS INDIA pvt Ltd Chennai,India. Hardware Engineer PCB design July 2012 – March 2015

• Schematics design and Drafting from Block digram, ERP Database Management .

• Symbol and Footprint creation and validation for components with data sheet specification .

• SI analysis for High speed serial links Pre and Post Layout Validation .

• DDR3 interface validation,PI analysis.

• Stack-up design and Preparation, Fabrication Input preparation.

• PCB Design of Analog and Digital and RF boards in Standard and customised dimension.

• Gerber documentation review and DFM/DFA Checks,Mechanical interference check.

• Board Bring up and testing PTP and PTR documentation. PROFESSIONAL SKILLS

• Schematics design using Dx-designer and Schematic Capture .

• Layout Simulation using Hyperlynx Pre and Post Layout analysis using EYE Diagrams for Serial links

• IBIS-AMI channel analysis for BER.

• Timing analysis, Jitter and Skew analysis, DDR simulation wizard for interface validation.

• Circuit simulation using LT SPICE and TINA .

• PCB design and review using Expedition PCB and OrCad PCB Designer .

• BOM and Product documentation using MS OFFICE.

• Component creation,Symbol and footprint validation using Library Manager.

• Worked on DFM/SI-DRC Tools ODB++ Viewer and Valor, Hyper-lynx DRC.

• Flashing and debugging tools like Code-warrior, and CCS .

• Familiar with windows /Linux Red-hat and Ubuntu OS.

• Familiar with using I2C and SPI protocol analysers MDO and DSO and multimeters

• ERP management tools like Team-viewer Bizbox and JIRA .

• Has performed EMI/EMC in TUV SAMEER and Tata power SED LAB. DESIGN EXPOSURE

• I2C,SPI, CAN, PARALLEL DDR3,NAND NOR interface

• UART,RS 232,RS 485,SGMII,RGMII

• HDMI,DVI,I2S,PCIe 2.0

• MIPI-CSI,USB2.0,USB3.0

• Processor based, Controller based,FPGA based COM-E or SOM based designs

• FMC based XMC based

• VPX based signal processing module

• CMOS Image sensor /Image signal Processor LTE /Wi-Fi /BT modules PROJECT DETAILS

MSQ-QUALIFICATION -RIDLEY /LAVA

In ARUBA for RIDLEY

• DDR4-DIMM Qualification and margin testing for Management module in Ridley

• COME module GDDR5,SPI Flash and Cyclone V Qualification for Line cards

• EMMC DDR3 Qualification for LAVA/Zeus

• Margin testing for all the Qualifications .

• TEST Coverage documentation for Line cards and Management modules for NPI Ridley IN-CAR DASH CAMERA 3-NAAG

In VVDN for NetraDyne.

• ICDC is a integrated cost effective version of its predecessor with TX1 LE processor from Nvidia which is compact and supported with swappable LTE connectivity module to support multiple carriers

• It has four cameras with MIPI interface synchronised to each other through the sync generated from ISP used for HDR video processing of road facing camera

• It has a 9 axis MPU for determining the change in position of the truck.This data is integrated to the VSS and GPS signals from the truck and external GPS module to create a highly accurate truck location and velocity

• It has a USB 3.0 support which can be used for connecting additional cameras present on the truck

• It has a fully compatible night vision support using lens with dual band IR cut filter for driver facing camera with IR illumination and ALS for illumination sensing. ACHIEVEMENTS

• Received a Token of appreciation for Employee the Year 2016-2017

• Conceptualised the design in the first prototype in all the designs

• Appreciation from customer during onsite visit to customer site at SanDiego USA

• Has promoted to Lead a Team for the NAAG Project at VVDN EDUCATION

St.XAVIERS CATHOLIC COLLEGE OF ENGINEERING, Chunkankadai, ANNA UNIVERSITY, Thirunelveli .

Bachelor of Electronics and Communication Engineering, May 2012 GPA: 7.33

Participated in district level technical paper presentation Has won Second price in Villgro technical paper presentation YETTACODE HIGHER SECONDARY SCHOOL, Yettacode,K.K district Higher secondary Education, March 2008

Percentage 89.08

Has won first price in School science Exhibition

Secondary school Education, April 2006

Percentage 90.4

PERSONEL PROFILE

Name : AGXIN.J

D. O. B. : 17 th August 1990

Gender : Male

Mobile : +65 83463201

Marital Status: Single

Citizenship:India

Country : Singapore

Linguistic proficiency: English,Tamil,Malayalam

Passport NO : K4518748

VISA :B1/B2 USA

EP-G3815980T

Strengths: Confidence & Excellent Design and analysis Skills Hobbies : Reading,Gym, Net Surfing DECLARATION

I hereby declare that the particulars given above are true to the best of my Knowledge and belief. Place: Singapore

Date: 9-1-2020 (AGXIN.J )

Contact this candidate