PAUL GREGOLYNSKYJ

PROCESS SYSTEMS ENGINEER

Address: ***** * **** ***, ********, AZ 85308

Phone: 623-***-****

Email: adg5a1@r.postjobfree.com

Over 25 years of experience in the engineering and designing of Process and Mechanical systems in the semiconductor and aerospace industries.

Process Discipline Lead on projects from the conceptual design phase, providing scope development, cost estimating, calculations, equipment selection, specifications, and equipment & distribution designs.

Education

Bachelor of Science, Mechanical Engineering, University at Buffalo, Buffalo, New York

Registrations, Licenses, Certifications

Professional Engineer (Mechanical): Arizona

Representative Projects:

INTEL CORPORATION

300mm Semiconductor Facility, Rio Rancho, NM

October 2018 – September 2020

Lead Process Systems Engineer – Engineering, design, and construction support services to produce detailed design documents for the programming, design, and construction of Hydrofluoric Waste treatment and Solvent Waste collection systems. Evaluated code and permitting requirements, assessed condition of existing systems, reviewed utility matrices, compared existing system capacities to the new demands, and determined system reuse, expansion, or replacement.

INTEL CORPORATION

300mm Semiconductor Facility, Kiryat Gat, Israel

January 2018 – September 2018

Process Chemical & Specialty Gas Systems Engineer – Produced detailed Process Chemical and Specialty Gas systems design documents for a 200,000 SF Class 10/ISO 4 semiconductor manufacturing facility. Served as design coordinator for various design projects. Reviewed submittals and responded to RFIs. Worked on-site to support and coordinate construction activities.

ARGONNE NATIONAL LABORATORY

Center for Nanoscale Materials, Argonne, IL

January 2017 – December 2017

Lead Process Systems Engineer – Led a team to produce engineering calculations and detailed design documents for a cleanroom expansion. Evaluated tool lists, layouts, and utility matrices, and analyzed system capacities for a 91,300 SF research facility. Reviewed product submittals and provided design support during construction.

ASM AMERICA, INC.

Various Small Projects, Phoenix, AZ

October 2016 – August 2017

Lead Process Systems Engineer – Produced detailed Tool Install and Specialty Gas systems design documents, including layouts, facility hook-up, pressure drop calculations, and specifications; Point-of-use abatement systems; Distribution capacity analysis & design; Utility assignment database management; Interdisciplinary coordination for layouts, power, controls, life safety, fire protection, and exhaust; Construction coordination.

MICRON TECHNOLOGY, INC.

300mm Semiconductor Research & Development Facility, Boise, ID

August 2015 – March 2017

Lead Process Wastewater Systems Engineer – Led a team to provide engineering, design, and construction support services to produce detailed design documents for the programming, design, and construction of the Industrial Waste, HF Waste, Copper Waste, Ammonia Waste, and Industrial Chemical systems in an existing 199,350 GSF R&D facility. This involved assessing the condition of existing systems, including evaluating the new Utility Matrix, comparing existing system capacity to the new demands, determining system reuse, expansion, or demolition and replacement, and assessing the ability to meet current codes and permitting requirements.

LEVEL 10 CONSTRUCTION LP

Silevo California Technology Center, Sunnyvale, CA

December 2014 – December 2015

Lead Process Wastewater Systems Engineer – Led a team to provide engineering, design, and construction support services to produce detailed design documents for the programming, design, and construction of the Industrial Waste, HF Waste, Copper Waste, Ammonia Waste, and Industrial Chemical systems in an existing 199,350 GSF R&D facility. This involved assessing the condition of existing systems including evaluating the new Utility Matrix, comparing existing system capacity to the new demands, determining system reuse, expansion, or demolition and replacement, and assessing the ability to meet current codes and permitting requirements.

NORTHROP GRUMMAN

DMEA 20k SF Cleanroom Feasibility Study, McClellan, CA

July 2013 – September 2013

Lead Process Wastewater Systems Engineer – Investigated the conversion of up to 18,000 SF of an existing facility to house an ISO 3 cleanroom to support 90 nm technology on 200 mm wafers. Located necessary tools in a 14,700 sf area with the option of adding an additional 4,591 sf. Addressed upgrades to existing systems including UPW, wastewater treatment, specialty gases, and process chemicals.

INTEL CORPORATION

Semiconductor Manufacturing Facility, Chandler, AZ

November 2011 – October 2013

Lead Process-Mechanical Systems Engineer – Led a team to produce detailed Process systems design documents for the programming, design, and construction of the Ultrapure Water, Compressed Air, Process Vacuum, Process Cooling Water, and Bulk Gas systems for a pilot facility used for a substrate plating process. The manufacturing area is approximately 137,000 SF with 148,000 SF of support space spread over two levels. In addition to the manufacturing and support areas, the project included all utility and yard functions, including associated dock areas, wastewater treatment, support warehouse areas, and a dock. Also worked closely with M+W Group’s construction management team to react to additional design scope, develop construction cost estimates, review and approve equipment submittals for procurement, and to help resolve conflicts in the field.

GLOBALFOUNDRIES

Semiconductor Manufacturing Facility, Malta, NY

May 2011 – October 2011

Lead Process Systems Engineer – Provided engineering, design, and construction support services for the installation of new 20nm TD tools on the East and West sides of Fab 8.1. This involved modifying facility systems to support the increased demands of the tools, and integrating it into the revised design documents. The work included design calculations, layouts, space coordination, and integration of an updated Utility Matrix for the 20nm tools.

FIRST SOLAR

First Solar MSA01, Mesa, AZ

December 2010 – April 2012

Lead Process Systems Engineer – Led a team to provide engineering, design, and construction support services of Process facility systems for the construction of a new state-of-art Thin Film Solar Module Manufacturing Factory. This 625 MW facility, including auxiliary support buildings, will be suitable for leading-edge photovoltaic fabrication.

INTEL CORPORATION

Semiconductor Manufacturing Facility, Rio Ranch, NM

July 2010 – August 2011

Lead Process Systems Engineer – Led a team to produce detailed PSSS systems design documents for the programming, design, and installation of SG, BSG, BCD, & PCD systems. Stick assignment analysis; Code/HMIS analysis for chemical quantities; Pyrophoric/flammable gas storage design; SG tube trailer, y-cylinder, bottle farm, GC, VMB, IGT, GIB layout & install; BSG lateral design; BCD tank, tote, drum, CDU, MVB, JVB, TVB, SVB, CVB layouts, conversions, upgrades, & install; Slurry lateral loop design; Layout design for chemical segregation, trenching, egress paths, clearances, safety showers, distribution highways, max pipe runs; Pressure drop calculations; GC, VMB, piping/tubing, valve specs; POU abatement systems & chillers; Interdisciplinary coordination for layouts, penetrations, power, I&C, LS, comm, FP, exhaust, ventilation; Process utilities lateral capacity analysis & design; Utility POC assignments; Vendor bid evaluations; SDC; FOR

INTEL CORPORATION

Semiconductor Manufacturing Facility, Rio Ranch, NM

May 2010 – October 2010

Process Systems Engineer – Provided engineering services for the analysis of P1268 Sort on the New Mexico Campus in the existing RR9 Sort facility. The project consisted of basebuild facility modifications including the installation of various new systems and the re-use and renovation of existing system sources and distribution. The project also included all process scope of work to support the conversion including new bay laterals and Sort cleanroom facility components. The project consisted of the utility capacity and distribution design analysis for the P1268 SORT program requirements. The utility capacity design analysis included compiling existing site loads data, and projected project loads associated with new and existing processes. The analysis included re-use assumptions, and identified shutdown implications of existing facility infrastructure necessary to perform any upgrades. Reviewed and validated utility system sharing with other Factory areas. Identified proposals on each system level of sharing between adjacent factories with pros/cons and team recommendation.

INTEL CORPORATION

Semiconductor Manufacturing Facility, Rio Ranch, NM

October 2009 – August 2010

Process Systems Engineer – Provided engineering services for the programming, detailed design, and construction support associated with facilitating the manufacturing site for ramping 300mm production while retaining residual 90nm processes in the existing factory. The project included the retrofit of F11X and the conversion of F11S from 200mm to 300mm technology, including modifications of various support areas such as the bulk gas yard, chemical rooms, spec gas rooms, and wastewater treatment. The project consisted of basebuild and PSSS facility modifications including the installation of various new systems, the re-use and renovation of existing systems, as well as new distribution from existing areas.

GLOBALFOUNDRIES

Semiconductor Manufacturing Facility, Malta, NY

January 2009 – December 2009

Lead Process-Mechanical Systems Engineer – Led a team to provide engineering, design, and construction support services for Process-Mechanical systems including Process Cooling Water, Compressed Air, Process Vacuum, and Cleaning Vacuum systems for a new 300,000 SF wafer fab facility. The 1,605,400 SF facility, located on a 222-acre site, includes the Fab, manufacturing support areas, administration building, data center, and CUB. The facility is designed to meet LEED® Gold criteria for sustainable design. Worked closely with M+W Group’s construction management team to react to additional design scope, develop construction cost estimates, review and approve equipment submittals for procurement, and to help resolve conflicts in the field.

UNIVERSITY OF UTAH

Sorenson Molecular Biotechnology Building Salt Lake City, UT

January 2009 – January 2010

Lead Process Systems Engineer – Led a team to provide engineering, design, and construction support services for the Neuroscience and Biomedical Technology Research Building, a $130 million, 230,000 GSF building focused on neuroscience and biomedical engineering research, with significant imaging, bioengineering, and vivarium components. The facility supports the creation of nanoscale devices such as biosensors, microfluidics, and drug delivery system. The facility is designed as Best-in-Class building, eligible for LEED® Gold certification.

KURCHATOV INSTITUTE

National Nanotechnology Laboratory, Moscow, Russia

December 2007

Lead Process Systems Engineer – Led a team to provide engineering services for a 22,000 SQM nanotechnology facility developed within an existing multilevel structure built in the 1980s. Engineering design is influenced by strict air emission and liquid waste criteria. Facility will include 700 SQM of wet and dry laboratory space, a 3,200 SQM production cleanroom and a 600 SQM pilot line cleanroom for production testing and research focusing on biosensors. This will be the premier nanotechnology research center in the Russian Federation and one of the largest nanotechnology research facilities in the world.

GEORGIA INSTITUTE OF TECHNOLOGY

Marcus Nanotechnology Building, Atlanta, GA

December 2007 – July 2009

Lead Process Systems Engineer – Led a team to provide engineering, design, and construction support services for a 190,000 GSF multi-level facility for nanoscale research, the largest nanotechnology research facility in the Southeast US. The MNB includes 30,000 NSF of cleanroom space with sub-fab and fan deck, as well as 5,720 NSF of conventional laboratories space, offices, conference facilities and informal gathering and interaction spaces.

ARGONNE NATIONAL LABORATORY

Center for Nanoscale Materials, Argonne, IL

2003 - 2007

Lead Process Systems Engineer – Led a team to produce detailed design documents and all necessary engineering calculations for PCW, CDA, PV, N2, UPW, AWN, and H2 systems. Evaluated tool lists, layouts, and utility matrices, and analyzed system capacities for the 91,300 SF research facility. Reviewed product submittals, answered RFIs, and provided support during construction. The facility is intended for research in artificial vision, biological intervention, environmental sensing and remediation sensors, and chemical catalysts.

INTEL CORPORATION

Semiconductor Manufacturing Facility, Santa Clara, CA

2003

Process Systems Engineer – Provided programming, detailed design and engineering services for the construction of Phase 2 of the IMO facility to meet capacity space needs for P1264 Phases 1 & 2 and the EUV pilot line. Provided programming and detailed design of process systems for the expansion of a Class 1 clean room space of approximately 12,400 SF in the IMO M2 building and construction of approximately 3,400 SF of new Class 1 clean room space between M1 and M2. The work for this project included long lead item identification/quantity, utilities capacity evaluation, and detailed construction drawings. Responsible for field verification and analyzing existing utility demand of the building systems to accommodate new installation and/or tie-ins, and identify any system upgrade requirements. Also ensured the existing building operation was minimally impacted during construction, and provisions were made to provide temporary services as required. Consistently made site visits to investigate systems and to meet with client’s project managers and facility engineers to examine system capacities and review design packages.

OAK RIDGE NATIONAL LABORATORY

Spallation Neutron Source (SNS), Oak Ridge, TN

2001 - 2003

Mechanical Engineer – Provided programming, master planning, facility design, and construction support services. Reviewed equipment submittals for compliance with project specifications, modified and submitted design documents in response to design change requests, and evaluated and clarified design documents to meet project standards. The 75-acre SNS campus consists of a Central Utility Building, a Front End (ion source) Building, a Linear Accelerator, Accumulator Ring, Central Helium Liquefaction Building, Target Building for experimental systems, and a Central Laboratory and Office Building (CLO). SNS is a collaborative project among six national laboratories that provides researchers with the most intense pulsed neutron beams in the world.

INTEL CORPORATION

Semiconductor Manufacturing Facility, Chandler, AZ

2000

Mechanical Engineer – Provided engineering design services for the remodel of a 20-year old manufacturing facility on an existing campus into a Class 1/10 cleanroom. The 26,000 SF space was configured into a bay and chase arrangement that includes gowning facilities and modularized space for future cleanroom expansion. The existing mechanical system in the interstitial space was modified and upgraded to accommodate the new cleanroom and to integrate with the existing structural steel and new air plenum system. The project was successfully completed on a fast-track 12-week design and documentation schedule.

INTEL CORPORATION

Semiconductor Manufacturing Facility, Chandler, AZ

1998 - 2001

Project Manager / Mechanical Engineer – The scope of work included all P860 TI designs, MOR efforts, and the entire Fab 22 Flex Scope. The key element in the P860 TI Design was to produce 435 TI design packages before any construction or field verification could take place since the Fab 22 Base Building was under construction, not allowing for any site access. The entire TI ramp included over 1,450 tools, all designed on schedule. Coordinated facility improvement and expansion projects. Engineered, designed, and modified new and existing HVAC and process systems. Provided scope development and design cost estimating.

MOTOROLA INC.

MOS 12 Expansion. Chandler, AZ

1997 - 1998

Mechanical Engineer – Worked on facility support systems such as chilled water, condenser water, hot water, steam, air, and exhaust systems. Calculated space support requirements based on product manufacturing criteria, selected equipment, and reviewed specification outlines based on project needs. Held meetings with other disciplines, clients, and equipment suppliers to coordinate work. Administered work to designers and drafters to evaluate the proposed design. Provided construction support.

INTEL CORPORATION

Semiconductor Manufacturing Facility, Chandler, AZ

1996 - 1997

Project Manager / Mechanical Engineer – Coordinated facility improvement and expansion projects. Engineered, designed, and modified new and existing HVAC and process systems. Provided scope development and design cost estimating. Consistently made site visits to investigate systems and to meet with client’s project managers and facility engineers to examine system capacities and review design packages.

INTERCONNECT TECHNOLOGY

1st Silicon, Kuching, Sarawak

1996

Mechanical Engineer / CAD Designer – Engineering and design of the chilled water system for a 75,000 SF, Class 100 wafer fab facility. This included collecting all cooling loads needed throughout the facility, calculating chilled and cooling water flow rates required, selecting chillers, cooling towers, expansion tanks, air separators, chemical treatment and filtration equipment, chilled water pumps, and condenser water pumps for the system, and designing a piping layout to support this requirement.

ATMEL CORPORATION

Fab 3, Colorado Springs, CO

September 1995 – December 1995

Mechanical Engineer / CAD Designer – Provided engineering and design of the hot water system for an 80,000 SF, Class 1 wafer fab facility. Responsibilities included gathering all load information for equipment requiring hot water, selecting proper equipment for the system, and designing a piping plan.

CYPRESS SEMICONDUCTOR

Fab 5, Round Rock, TX

April 1995 – August 1995

Mechanical Engineer / CAD Designer / Project CAD Coordinator – Engineering and design of the plumbing system for a 32,000 SF, Class 10 wafer fab facility. This involved calculating all domestic water, industrial water, fire water, natural gas, and sanitary sewer requirements, sizing pipe based on flow rates and pressure needs, and designing new layouts for these services. As Project CAD Coordinator, devised a set of CAD standards and procedures to be used. Held weekly meetings to coordinate CAD issues among all disciplines.

SEAGATE TECHNOLOGY

Disk Drive Manufacturing Facility, Minneapolis, MN

March 1995 – April 1995

Mechanical Engineer / CAD Designer / Project CAD Coordinator – Engineering and design of process piping systems for a 50,000 SF, Class 100 disk drive manufacturing facility. Worked extensively with other disciplines and equipment vendors to coordinate work and prepare specifications for CDA, process vacuum, house vacuum, and process cooling water systems. Selected equipment and designed new layouts for these services.

ALLIEDSIGNAL AEROSPACE CORPORATION (HONEYWELL)

Facility Improvement Projects, Phoenix, AZ

October 1994 – March 1995

Mechanical Engineer / CAD Designer – Coordinated mechanical design of facility improvement and expansion projects. Designed and modified new and existing HVAC and piping systems. Provided scope development and design cost estimates for these projects.

SGS THOMSON SEMICONDUCTOR (ST MICROELECTRONICS)

Tool Fit-up, Phoenix, AZ

June 1994 – October 1994

Mechanical Engineer / CAD Designer – Worked on-site with process tool fit-up design and drafting at a 40,000 SF wafer fab and test facility performing field work for coordination of design. Also worked in the cleanroom as a quality control and safety administrator to oversee wall construction and to enforce safety regulations.

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