Mechanical Engineering

MARTIN R. PAIS, Ph.D., PE

North Barrington, IL **010 - 224-***-**** - **********@*****.***

https://www.linkedin.com/in/martin-r-pais/

TECHNOLOGIST MECHANICAL

Proficient electronic packaging technology leader/visionary with a demonstrated ability to combine strategy and tactics to deliver a results-oriented mobile cellular innovation environment. Indefatigable and assiduous work ethic, creating and directing a collaborative work environment with a sense of purpose for all, driving organizational and individual success

CAREER HIGHLIGHTS

Innovator with demonstrated success in creating vision, developing strategy, establishing roadmaps, and focused implementation of innovation into product. Responsible for electronic packaging architecture, magnetostatics, materials, structural and thermal management integration to enable significant size and mass reductions while enhancing quality and reliability.

Consulting Technologist with experience, computational and experimental, in electronic packaging architecture, acoustics, combustion, environmental robustness, magnetostatics, materials, structural, thermal management and, vibration. Instituted process for technology transition from inception into product. Spearheaded and instituted proto simulation (anywhere, anytime, anyone), as integral to product design and development, to cut over 73% in cycle time and labor.

Leader creating collaborations, pulling technologists to create multidisciplinary teams to draw a synergy for integration. Delivering consistency in technical services to organization through formatted training and lessons-learned knowledge management. Managed a team of over 40 technologists spread over 9 countries, leveraging their strengths with robust, actionable deliverables; mentoring employee engagement, career development and, retention.

Entrepreneur founder of two companies, won over 24 contracts. Coordination of worldwide engineering development for seamless product design, integration across nine centers in Americas, EU, and Asia. Chaired patent committee and drove IP portfolio.

PhD, MSME - University of Kentucky; BSME - Indian Institute of Technology; PE-KY, IL

CORE COMPETENCIES

Directed and worked on products/projects, which involved:

Electronic packaging

Ball-Grid and Land-Grid Array BGA/LGA, Package-on-Package PoP, WLCSP, Chip-on-Glass COG, Chip-on-Flex COF.

High Heat Flux Cooling

Two-Phase: spray and jet impingement Flow boiling, pool boiling.

Single Phase: spray and jet impingement, forced and free convection.

Thermal Management

Heat pipes, ice accretion on aircraft, turbomachinery, permeation, microchannel cooling, cryogenic cooling, multichip module cooling.

Magnetics

Magnetostatic and Electromagnetic simulation and testing.

Combustion

Coal gasification, droplet combustion, scrub water treatment and purification, degassing of fuels, endothermic fuel for cooling

Design, Fabrication and Testing

Pressure vessels, liquid-vapor separators, vacuum brazing high-pressure cryogenic flow loops, vapor condensers, chiller systems with phase-change materials (PCMs), HVAC systems, and heat exchangers

Structural

Static, dynamic, drop/impact

NVS

Acoustic noise reduction, vibration, and seismic isolation

ERP

Environmental robust packaging of electronics, conformal coat, conformal film

DAC

Data acquisition and closed-loop process control: temperature, pressure, fluid flow, electrical power, displacement (rotational & linear), stress and strain

Tools

IDEAS, COSMOS, Abaqus-CAE, 6SigmaET, ANSYS, FLUENT, ICEPAK, CST, JMAG, ProE/Creo, Flux

PROFESSIONAL EXPERIENCE

Fellow and Director, Mechanical Architecture and Innovation Group, MOTOROLA-MOBILITY

Spearheaded magnetostatics, materials, structural and thermal architecture, simulation and test integration into product development for virtual prototyping. Enabled key technology components (high impact structures, displays, multilayer chipsets, haptics, materials, etc.) from inception, through feasibility, and final certification. Responsible for the total cost of ownership, flexibility through modularity. [36 Patents (6 pending); 2 Engineering Awards].

President and founder, CUDO TECHNOLOGIES, LTD. 1/2012 – Present

Provided consulting services primarily in electronic packaging, structural and thermal management, acoustics, vibration, and fossil & bio fuels. [Over 20 contracts, 1 patent]

Research Faculty, DEPARTMENT OF MECHANICAL ENGINEERING, UNIV. OF KENTUCKY

[19 journal, 46 conference, and 22 internal publications]

MOTOROLA-MOBILITY, A LENOVO COMPANY, Chicago IL 1/2012 – Present

Fellow and Director, Mechanical Architecture and Innovation Group, 1/2017 – Present

•Led new product form factors definition, user interfaces, experiences that leverage the introduction of flexible displays, extreme high datarate capabilities, gaming interaction. Identified, leveraged and, implemented laminate structures for low creep and fatigue, thermal storage and spreading, mobile-mod interfaces.

•Chief thermal architect 5G integration, delivered 1st in market 5G MOD.

•Work with Qualcomm and Verizon developed 5G Mobile-MODEM-Network communication method for thermal-based data-rate mitigation.

•Develop sub-millimeter flat heat pipes and RF tolerant heat sinks.

•Principal in the implementation of architecture and design across 16 products.

•Patents 10, Applications in process 6.

Fellow and Director, Materials and Mechanical Technology Group, 9/2014- 12/2016

consolidated the Lenovo-Motorola simulation groups to manage four sites in north America and China. Drove roadmaps, consistent methods, specifications for a quality product; developed career plans. Identified and implemented technologies with emphasis on magnetostatics, structural shock damping, thermal spreading.

•Designed and set up test facility for 3D magnetic field measurement; implemented to assess coupling in wireless charging, de-sense in magnetic compass, force fields in magnetic latches.

•Developed process to simulate forces induced in permanent magnet-based latching systems.

•Created process to characterize magnetic materials and validate with force and field measurements.

•Implemented methodology to fine-tune probabilistic material failure assessment.

•Developed and implemented methodology to test and model viscoelastic, adhesive, and ceramic materials.

•Implemented methodology to manage thermal scenario through active modulation of processor frequency, RF-modem, charging line-up while maintaining user experience.

•Principal in the implementation of architecture and design across 11 products, Patents 9.

Fellow and Director, Materials and Mechanical Technology Group, 1/2012 - 8/2014

Consolidated materials and mechanical group under new parent Google. Prioritized and implemented structural driven material enhancements, scratch and water resistance, thermal energy storage, cycle time reduction.

•Developed array imager mechanics and thermal management.

•Created and implemented glass lens in-mold integration.

•Devised methodology for OLED-frit structural characterization and integration mechanics.

•Automated test system for IR imaging & call box.

•Developed and implemented assessment criteria based off strain gradient and area of influence.

•Instituted automation of mesh methodology consistent with mobile size and feature.

•Created and implemented methodology for leveraging composite fiber in structural architecture.

•Implemented automated test methodology for wireless navigation including RF & Solar.

•Chip-on-Flex COF integration and characterization.

•Provided comprehensive design assessments across 38 programs.

•Patents 1.

ADDITIONAL RELEVANT EXPERIENCE

MOTOROLA-MOBILITY, A LENOVO COMPANY, Chicago IL

Fellow and Director, Simulation and Mechanical Technology Group

Fellow and Director, Mechanical Simulation Group

Distinguished Member Technical Staff and Chief Technologist, Electronic Packaging Innovation Center

Distinguished Member Technical Staff and Senior Technologist, Advanced Thermal Lab.

UNIVERSITY OF CENTRAL FLORIDA, Orlando, FL

Assistant Professor

CUDO TECHNOLOGIES, Lexington, KY

Founder and President

ISOTHERMAL SYSTEMS RESEARCH, Lexington, KY

Founder and Vice President

UNIVERSITY OF KENTUCKY, Lexington, KY

Research Associate

Postdoctoral Research Associate

EDUCATION

UNIVERSITY OF KENTUCKY, Lexington, KY

Doctoral Student

Masters Student

Academics and research in coal gasification.

•Created electro-discharge direct coal gasification for in-situ coal mine seams.

•Built 1kA, 60 kW arc gun with traversing and power control.

•Modified ton moving bed coal gasifier for scrubbing and high-pressure treatment of effluents with in-situ process control using gas chromatographs, air and water flow, temperature, and feed control.

•Conference paper 1, Report 2.

INDIAN INSTITUTE OF TECHNOLOGY, Madras, India

Bachelors Student

PROFESSIONAL MEMBERSHIP

ASME: Fellow, American Society of Mechanical Engineers

Member ASHRAE American Society of Heating, Refrigeration, and Air-Conditioning Engineers

CTIA working group; IEST Institute of Environmental Sciences and Technology (Past); IMAPS International Microelectronics and Packaging Society (Past)

LICENSES

Professional Engineer License, KY # 18339, IL # 062-055586

PROFESSIONAL ACTIVITIES

Member, Motorola Science Advisory Board

Chaired, Motorola Patent Committee

Chaired, Motorola Technical Ladder Committee

Paper Review, Journal of Thermophysics and Heat Transfer

Board of Trustees, Village of North Barrington, Illinois (Past)

Trustee Liaison, Plan & Zoning Commissions, Village of North Barrington, Illinois

OTHER

Patents/pending - 36/6

Journal publications - 19

Conference papers - 46

Technical reports - 22

Technical reports Motorola Internal - 32

Engineering Awards/Bravos - 2/8

R&D Contracts - 24

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