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Manager Engineering

Location:
South Yarmouth, MA
Posted:
August 23, 2020

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Resume:

Senior USA/International (Asia) Manufacturing Executive

Asia Manufacturing Strategies Implementation, Asia Supply Chain Management, Continual Process & Performance Improvement

Proven top performer and action driven problem solver with a stellar record of operational success and continuous improvement in high volume manual, semi-automated and fully automated operations in both semiconductors and battery manufacturing. Imaginative thinker with exceptionally strong analytical and conceptual skills complemented with significant international experience. Excellent cross-functional team leader, cross-cultural communicator and cross-organization motivator determined to cut costs, improve quality, accelerate delivery and significantly exceed corporate goals.

Highlights of Achievements

Career Overview

Over 30+ years of progressive international operations management and manufacturing experience with expertise in:

Transforming Greenfield property into large and complex world class factories operating at full capacity.

Driving major improvements with both Asia and USA suppliers.

Executing new product launches and operations turnaround initiatives.

Outperforming industry; quality, cost, and delivery benchmarks.

Implementing lean manufacturing methods, processes, tools, and techniques.

Skillful cross-cultural negotiations.

Building should cost models to set cost targets for negotiation with subcontractors.

International/USA Accomplishments

Started up of six large battery factories in China and a pilot line in Korea

Started up two large state of the art battery factories (fully automated) in MI/USA

Started up a factory in Scotland – led yield improvement team

Started up assembly/packaging system factory in MA

Managed several consolidation programs (semiconductor and battery) to other factories to drive cost.

Managed several technology transfers from 4” factories (semiconductors) to 6” and 8” factories.

Started up and managed several semiconductor plants both in digital and analog technology

Industry Recognition and Education

General Motors acknowledgement-best built coating plant in the industry

Texas Instrument Safety Award – most improved

8’’ Fab (200mm) of the Year Award

Bryant University – BS Finance/Accounting Major

Quinsigamond College – Engineering Major

Professional Experience

Vionx Energy, Woburn, Ma Jun 2015 - present

VP of manufacturing/Operations/Supply chain for a vanadium reflow battery startup company. Responsibility include implementing the Asian supply chain for balance of plants, managing the stacks build at the USA contract mfg.(Jabil), setting up local to the customer electrolyte toll house (Canada), managing the field installation(s) and managing the shop floor proto builds at Woburn Ma.

STION CORPORATION, HATTIESBURG, MS Apr. 2014 to June 2015

VP of Operations for thin film solar panel manufacturing with 160 employees.

Responsible for ramping volume from 100 panels per day to 1000 panels per day on a

7 x 24 operations. Manage 7 direct reports with responsibilities for Facilities, Equipment Repair, Operations, Supply Chain, Process Engineering and two support functions from HR and Finance.

FLUIDIC ENERGY - SCOTTSDALE, AZ 2013 to 2014

Director of Manufacturing for plants in Scottsdale, Arizona and Bogor, Indonesia.

Responsibilities included scaling the factories for volume ramp, safety, yield and cost.

Managed 5 direct reports; 28 employees in Scottsdale and 101 employees in Indonesia.

A123 SYSTEMS, INC. – WALTHAM, MA 2006 to 2013

VP of Operations for Worldwide Manufacturing with nine direct reports and 12 factories across three countries (3 USA, 7 China, 1 Korea) and 2 sub-contractor plants in China and Taiwan. Responsibilities include the following KPI’s: Safety, Yield, Cost, Delivery and Quality.

Built all factories from Greenfield to ramp.

Start-up -one year from PO release to first start. (China)

Battery assy. yields improvement from 1st start-up of 70% to high 95+% (2yrs) – Tools used QIP process. Current yields at 98%.

Cost reduction programs (2x dl reduction, yield improvement 2nd source suppliers/material and substitutions)

Implemented quality programs; APQP, TS16949 certified, ISO 9001 and ISO 14001

Factories are vertically integrated to drive cost down in support of major automotive, grid, and commercial product business applications

UNITRODE/TEXAS INSTRUMENTS – MERRIMACK, NH + Tucson AZ 1998 - 2006

Vice President/Fabrication Manager of $260M Wafer Fabrication Operations with responsibilities for two Fab Operations on a 7X24 schedule with 340 employees.

Started up 6” BiCMOS Fab operating at 1400 outs per week

Streamlined 4” Fab Operating a 1500 outs per week

SIPEX CORPORATION – San Jose, CA 2002-2003

VP of Manufacturing of 6” Wafer Fab and Probe Operation. Responsibilities included 6”

BiCMOS Wafer Fab and Probe area with 300+ employees and direct accountability for Engineering, Equipment Engineering, and Facilities for a 7x24 operation.

Improvement in yields from 85% to 92%

Cost improvements by 25%

Cycle time improvements 5 weeks to 3 weeks

Probe yield improvement on high runners from 80% to 90%

DIGITAL EQUIPMENT/INTEL CORPORATION – Hudson, MA 1979-1998

Director of $500M Wafer Fab Operation (1995-1998) Manufacturing responsibilities encompassed all 8” Wafer Fab Operations included over 800 employees on a 7x24 schedule. Process technology included CMOS .5u, 3layer metal, 15-layer mask step process, .35u, 4 and 6-layer metal processes with up to 24 masking process steps. Managed Process Engineering, Equipment Engineering and Repair, Operations, CIM, Production Control, Facilities, Yield Engineering, Industrial Engineering and Build Out.

Start-up of Fab 3 in 1984 and Fab 6 in 1996

End-of-life of Fabs 1, 2, 3 and 4

Consolidated Andover Chip and Wire Operation into Hudson for significant cost savings

Restructured Fab 3 & Fab 6 from technology to cost focused, team-based operation

Streamlined Post Fab operations improve cycle time by 6x, reduced cost by 50% and increased production by 2x.

Converted several operations in both Fab and Post Fab to 7x24 operations

Manufacturing Manager of $200M Semiconductor Operation (1991-1995) Responsible for both Front End and Back End functions. Duties included overall operations for 6” wafer fab deliverables as well as Post Fab die deliverables. Technology included 6”, 7x24 wafer fab operations with .5u processing, 20 mask levels and 4-layer metal. Post Fab Operations included Probe, Back Prep, and Assembly (internal), Burn-in and Test.

Post Fab Operations Manager (1987-1991) with complete management responsibilities for Process Engineering, Operations and Equipment for 7x24 operation with total personnel of 300+. Areas of responsibilities included Probe, Assembly, (internal and external) Burn-in, Test, Production Control and Training.

Wafer Fabrication Production Manager (1983-1987) Responsible for two VLSI Fab areas. A 4” pilot line which excelled in fast cycle time and low defect density and a 5” fabrication line capable of running 2500 wafer starts per week. Both lines manufactured CMOS devices. Staff included three senior supervisors, eight supervisors, five trainers and 100 direct labor employees.

Senior Supervisor (1981-1983) for a three-shift operation in the areas of Photo, Diffusion/Thin Films and Etch. Staff included seven supervisors and 60 direct labor employees.

Production Supervisor (1979-1981) Maintained yield and productivity of Bipolar and CMOS processes. Responsible of the activities in Diffusion, Thin Films and Photo for 25 direct labor employees.



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