Manager Software

VIVEK CHENGALVALA

***** ********* ***, *********, ** 20850 405-***-**** *****.***********@*****.*** U.S. Citizen PROFESSIONAL SUMMARY

• 18+ years of software engineering experience, including 9 years of project/line management experience, with a track record of increasing responsibilities, with prior experience as technical lead/architect

• Ability to think strategically 3-5 years out, while also maintaining day to day operations, and ready to challenge the status-quo and drive innovative ideas

• Managed large, complex projects spanning multi-function teams, and delivered several successful products

• Built high-performance teams that are self-sufficient and self-organized. Provided leadership to the teams including hiring, coaching and mentoring of architects, and varied levels of software engineers

• Served as the escalation point for complex situations between department and customers

• Flexibility, willingness to learn, and a demonstrated ability to gain proficiency in new industries, markets and technologies quickly

• Domain knowledge/experience in Cloud computing, Video, Machine Vision, Robotics, Connectivity, Big Data, IoT, Factory and Building Automation, Industrial Networking and AI/Machine Learning

• Built, defined, managed and reported departmental performance metrics (KPI) for continuous improvement

• Experience working with consulting partners including project definition, Request For Quote/Proposal creation, SOW creation, and acceptance criteria

• Expertise leading in an agile-based software development environment, using scrum techniques

• M.S Degree in Electrical and Computer Engineering (MS) and Business Administration (MBA)

• U.S Citizen with the ability to obtain and maintain a security clearance WORK EXPERIENCE

Software Development Manager Nov 2019 – Present

Embedded Processors, Sitara Product Line, Texas Instruments, Germantown, MD

• Manage following teams to implement stand-alone products, as well as integrated servo drive systems that are used in CNC machining, factory automation, and robotics, among other uses

• Firmware: Industrial communication protocols (EtherCAT, PROFINET) on ICSSG hardware accelerator

• Software: Motor position feedback protocols (EnDat, Tamagawa) and algorithms for position/velocity control of motors

• Integration: Continuous integration (CI) DevOps of application software with bleeding edge internal and external (to TI) dependencies and generate complete Software Development Kit (SDK) in Yocto/ Open Embedded, Amazon AWS.

• Test: Automation of tests based on Unity, Selenium and LTP-DDT

• Software components span across Linux, Android, TI-RTOS operating systems, and on bare-metal for various Cortex-A, Cortex-R, and Cortex-M cores and TI proprietary hardware accelerators on the SoC.

• Lead discussions on requirements, architecture, design, implementation, and validation, and collaborate across internal development teams to handle requirements from secure/authenticated bootstrapping of heterogeneous cores in the SoC, and flashing of application images to over the air updates

• Direct engagement with Tier1 customers to support co-development and customer ramps, by managing agile deliverables

• Drove software process internally to achieve bi-directional traceability between high level product requirements and detailed technical requirements and to test cases

• Empower the teams, and ensure that each team member is fully engaged in the project, and be a part of continuously improving and growing the long-term capabilities of the team

• Provide technical leadership and mentorship to engineers, architects and team leads. Coach and mentor team members for career development

• Communicate project goals, top issues, risks, critical landmarks to cross functional partners and senior leadership throughout project development

Software Development Manager Jun 2015 – Nov 2019

Embedded Catalog ARM & DSP Processors, Texas Instruments, Germantown, MD

• Managed 3 software development teams, to implement TI's key software product strategy of creating a unified Processor Software Development Kit (SDK) that scaled to support every processor TI sold. 18 different silicon devices supported in one single SDK, the first time in TI.

• Industrial Software/Firmware: redundancy protocols (HSR, PRP), Precision Time Protocol (PTP), Time Sensitive Networking (TSN) for Industrial Ethernet on Linux with offload to TI’s hardware IP

• SDK Integration & Test: Continuous integration (CI) DevOps of application software with bleeding edge internal and external (to TI) dependencies and generate Linux and Android Software Development Kit (SDK) containing customized Embedded Linux distribution in Yocto/Open Embedded, and Android Open Source Project (AOSP) build environments

• New Product Development Engine (NPDE): Co-piloted with Product Marketing in defining demo applications to win business in new and emerging markets of Machine Learning, Deep Learning, Robotics, ROS, Industry 4.0 transformation, Grid Infrastructure, and Appliances. Led the engineering teams to develop these applications and to integrate and deliver via Processor SDK

• Program manage 3rd Party outsourcing firms for maintenance/support of legacy products

• Test-driven development (TDD) and continuous integration (CI) techniques, and agile project management

• Grew the business adding 100s of customers in a broad set of applications and domains, and supported software updates with scalable, sustainable test automation

• Recruited and mentored software engineering team members, and interns

• Provide technical leadership as well as manage a team of software engineers who work cross-functionally with silicon architects, digital/RTL designers, DV engineers, algorithm researchers, high-level OS developers and end-user experiences app developers

• Collaborated with cross functional teams in global locations to build software architectures that resolve complex business problems

Software Development Manager Feb 2011 – Jun 2015

Embedded Multicore Processors, Texas Instruments, Germantown, MD

• Managed software and test engineers in the design, development, integration and test of software/firmware development kit (SDK) for TI's high performance and Multicore SOCs. The SDK provides the core foundational building blocks (such as OpenMPI, OpenCL, OpenMP, OpenEM, C66x Libraries, platform abstraction) and sample applications to facilitate application software development, specifically for high performance computing (HPC) and video infrastructure (VI) markets

• Responsible for staffing, schedules and employee assessments, with first line manager skills

• Lead cross-functional meetings with other managers/engineers from Application support, documentation, marketing and FAEs to achieve on-time commitments and identify/resolve issues

• Develop and maintain program schedules; Track and report program status

• Strong technical contribution and brainstorming with software/codec architects in efficient multi core, multi- chip system partitioning of real time multimedia software and video codecs such as H265/HEVC, H264, MPEG2, AVC-Intra and JPEG2K, resulting in several patents.

• Lead software engineering efforts in creating Linux SDK with user space components for offloading processing to PCIe based acceleration cards plugged into X86 servers. This SDK is the foundational software for OpenCL

• Program/Project manage multiple 3rd parties/engineers for new codec development and maintenance of legacy codecs.

• Collaborated with the marketing teams in penetrating new markets and gain share in existing markets.

• Lead engineering discussions in pre/post-sales engagements, captured customer requirements, prepared RFQ responses, proposed feasible solutions.

• Led execution of engineering deliverables to facilitate robust demos at trade shows such as NAB, IBC, Embedded World, ISC West etc.

• Co-piloted with Product Marketing and engaged with strategic customers to determine various benchmarks, key care-abouts and optimizations to promote TI solution Engineering Team Lead Jul 2008 – Feb 2011

Video Infrastructure, Texas Instruments, Germantown, MD

• Played a key role in the Video Media Gateway Application for 3G right from feasibility study to product development and deployment on C6486 Multicore DSP

• Interacted with key customers, did feasibility studies, provided bench mark data by extensively profiling several video codecs on TI DSPs, interacted with the marketing/sales teams, provided early evaluation releases and helped win strategic customers for Video Media Gateway and Video transcoding of packet applications.

• Designed, implemented and patented graphics and text content overlay on video streams in media gateway application, where the content to be overlaid resides on an external server

• Designed and developed a flexible task scheduler with proprietary RTOS for packet to packet Video Gateway multi-channel, multi core trans-coding/trans-sizing and transrating solution

• Designed and implemented the fragmentation free dynamic memory sub-system for the video application. The memory requirement for different codecs, resolutions, jitter buffer depths is significantly different and the dynamic memory manager has to deal with random open-close of video channels without any fragmentation

• Implemented and integrated RFC3016 (MPEG-4), RFC2429 (H.263+), RFC3984 (H.264), RFC4175 (YUV), RFC2250 (MPEG-2), RFC4396 (text) standard video packetization protocols.

• Designed and Implemented Video Processing and Play out Unit (VPPU) in DSP which connects the Video Codec and the RTP processing Layer in DSP

• Designed and developed test infrastructure to validate the Video Media Gateway application. The test software modifies MAC, IP, UDP headers in wire shark captures, replicates multiple streams and merges multiple RTP video streams into a single wireshark capture Software Design Engineer Aug 2004 – Jul 2008

High-density Voice Gateway, Telogy Networks, Texas Instruments, Germantown, MD

• Designed and implemented internal TDM (PICMG SFP.1) aka iTDM 1 milli-sec & 125 micro sec mode

• Improved the robustness against malicious attacks of Ethernet, IP, UDP and RTP stacks in DSP

• Worked on TI’s C55x and C64x+ range of multi-core DSPs and improving channel densities

• Rewrite Conferencing capability in DSP to support more than 32 channels in one conference

• Core dump Analysis: TNETV3010 (C55x) is a six-core device where any live core can be used to dump memory of any dead core. I have debugged several field critical issues from forensic analysis on core dumps

• Debugged very tough DSP crashes which are due to Silicon issues. Worked closely with the hardware team in isolating the root cause and finding out work-around

• Provided Engineering support to Tech Support staff supporting 15+ customers from Asia, Europe and North America and directly interfaced with the customers on critical issues

• Front line customer support in integration of TI software, understanding customer application call flows Software Engineer Jan 2004 – Jul 2004

SoftRISC Communication Solutions Inc, Santa Clara, CA

• Developed and optimized code in fixed-point C++ for generation and recognition of DTMF and call progress tones with cadences and it is fully compatible with the ITU-T Q.23 and Q.24 (AT&T) standards

• Implemented entire Caller ID transceiver in On-hook and Off-hook transmission modes conforming to European Telecommunication Standards (ETS)

• Implemented RFC3550 transport protocol

• Worked on Real Time operating systems – Linux and Texas Instruments’ BIOS PATENTS

• “Media gateway with overlay” (U.S Patent: 201********)

• “Real Time Video Image Processing” (U.S Patent: 201********)

• “System and method for adaptively allocating resources in a transcoder” (U.S Patent: 201********)

• “Video processing device with memory optimization in image post-processing” (U.S. Patent: 201********)

• “Efficient Multi core/Multichip partitioning for HEVC (H265) Encoder” WHITEPAPERS

• Accelerating high-performance computing development with Desktop Linux Software Development Kit EDUCATION

MBA Aug 2010 – Dec 2012

University of Maryland, College Park, MD

M.S. Electrical Engineering Aug 2001 – Dec 2003

Oklahoma State University, Stillwater, OK

B.S. Electronics & Communication Engineering Sep 1997 – May 2001 Nagarjuna University, India

SKILLS/COMPETENCIES

• C, C++, Linux Kernel, U-boot, Embedded Linux distribution, Yocto, OpenEmbedded

• Real-Time Operating System (TI RTOS), Bare-metal programming

• Networking Protocols (TCP, UDP, RTP, RSTP, HSR, PRP, TSN, PTP, EtherCAT, Profinet, etc.)

• Continuous Integration, Delivery (CI/CD), DevOps, Jenkins, Docker Container, Hypervisor

• Git, JIRA, bitbucket, Confluence, VersionOne, Eclipse, Visual Studio, DOORS, Clearcase

• Qt5, OpenCL, OpenGL, OpenMPI, OpenVX, GStreamer

• Android Open Source Project (AOSP)

• Amazon Web Services (AWS) - EC2, S3, Cloudwatch, Cloudformation

• Python, Node.js, bash, Ruby, Networking, ROS

• Product Owner, Product Manager, Scrum Master

• Interface with customers to learn and understand requirements as well as describe proposed solutions, providing both pre-sales and post-sales support.

• Experience with Agile (Kanban, Scrum) and Waterfall life-cycle models

• Software engineering best practices including coding standards, code reviews, source control management build processes, testing, and operations automation

• Understanding of traditional software development life cycle (SDLC), including planning, development, requirements management, CM, quality assurance, and release management

• Personnel management of a software team to include performance assessment, career development guidance, assignment onto programs, merit and salary actions, training plans, staffing and recruiting

• Leadership, Mentoring, Coaching

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