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Engineer Data Analyst

Location:
Livermore, CA
Salary:
USD 50,000 annually
Posted:
July 20, 2020

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Resume:

IZWAN, ZAINOL BAHAR

650-***-**** adep49@r.postjobfree.com www.linkedin.com/in/izwanzainolbahar izwanzb55.wixsite.com/izwan-journey EDUCATION University of California, Berkeley

Bachelor of Science in Mechanical Engineering Graduated Dec 2019 CGPA = 3.30

_ _WORK EXPERIENCES Data Analyst Intern Telekom Malaysia USA Inc. Jan 2020 - Present

Oversees data quotations, records, technical issues, and solutions according to customers and projects.

Pitching sales strategies based on market research and data compilation to Data Sales Manager for deal closure.

Supervises 3 junior interns to facilitate data quotations, and solutions according to customers and projects.

Qualifying and establishing new partnerships in accordance with Telekom Malaysia’s business requirements. Sales Cashier and Food Service Worker Café3 Cal Dining, UC Berkeley June 2018 – Dec 2019

Managed inventory process and product organization in the store.

Handled customers in the in-store check-out process and resolved any customer requirements.

Maintained excellent customer service and provide general assistance in the kitchen and production areas. Student Instructor Leader Skyline College Jan 2017 - June 2017

Encouraged student engagement in a Calculus 1 class of 20 people by administering study sessions weekly.

Enhanced students’ information retention and increased their grade improvement of the student through peer discussion and using smart notes.

PROJECTS Automated Ground Vehicle (AGV) Fire Fighter Design/Software Engineer Aug 2019 - Dec 2019

Built 2 autonomous firefighting vehicles to search for early fire and extinguish it while avoiding collisions in the hope to make advancement to aid California Wildfires rescuers.

Implemented multitasking implementation and real-time software by utilizing PSoC 5lp as a microcontroller.

Maximized user interaction and information delivery by developing a Graphical User Interface (GUI) using LabVIEW.

Control of Unmanned Aerial Vehicle (UAV) Lead/Software Engineer Aug 2019 - Dec 2019

Analyzed and modeled UAV flight by using mathematical modeling and aerodynamics analysis.

Programmed a microcontroller to control UAV in C++ language by implementing various controllers’ system.

Developed a controller program for the drone that can hover over obstacles and land on a specified location. Informative Spine Brace Lead/Design/Software Engineer Aug 2018 - Dec 2018

Collaborated with an Electrical Engineer mentor to engineer a spine brace based on customer requirements that gives feedback to users by adding sensors and a microcontroller.

Devised interaction between sensors and user’s activity by programming an Arduino that alert users when they do activities that are against doctor’s advice.

Prosthetic Hand Lead/Design Engineer Aug 2018 - Dec 2018

Improved prosthetic hand functionality which is to have specific control on each finger.

Engineered and fabricated mechanisms that can specify the fingers movement using SOLIDWORKS and 3D printer. LEADERSHIP EXPERIENCES Mechanical Design Lead Pioneers in Engineering (PIE), UC Berkeley Sept 2017- Apr 2018

Entrusted as a key role to design mechanical parts of robot’s components for the 2018 Robotic Competition.

Liaised with a team of Electrical and Software Engineer student to develop robot station controllers.

Optimized the design by using finite element analysis with ANSYS and built prototypes by using a 3D printer.

Invented enclosure design using SOLIDWORKS to protect circuit boards and built it by using a laser cutter. SKILLS Language: Bilingual Malay and English.

Software: SOLIDWORKS, Fusion 360, AutoCAD, ANSYS, FEniCS, ParaView, LabVIEW, MATLAB, C++, Python, PSoC Creator, Arduino, Adobe Illustrator CC, LaTex and Microsoft Office. Fabrication: 3D Printing, Laser Cutting, Water Jet, CNCs, Milling Machines, Engine Lathes, and Drill Presses. Relevant Coursework: Electronics for IoT, Feedback Control Systems, Control of UAV, Biomechanics, FEA method, Mechatronic Design, Heat Transfer, 3D Modeling, Mechanical Behavior of Material, Manufacturing & Tolerance, Thermodynamics, Fluid, and Solid Mechanics, Design of Microprocessor-Based Mechanical Systems, Product Development, and Experimentations & Measurement.



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