Engineer Engineering

SUMMARY:

I’m working as Senior Process Engineer with 5.1+ years of experience in material inspection and production planning according to customer targets at chip fabrication, manufacturing, process planning and engineering analysis for machine and tools. Enthusiastic engineer with dedication to better performance in the area of managing labor, materials and equipments.

Experience in performing, Chip Monitoring, Work shift scheduling and Document Maintenance.

Sound knowledge in Chip Fabrication, Programming of Chip and Placing the Wiring of Chip in CNC Machines.

Experience in Wafer Cutting and Heating and Die Bonding on Lead Frames by Using Alpha Sem.

Sound knowledge in Wiring of Chip with Gold and Silver threads in Alpha Sem.

Good knowledge in Alpha Sem and Siemens Manufacturing Operations Management.

Experience in MS Office and SRS Documentation.

Good knowledge in Setup of IDT and KOA Corporation for Thermistors for both Die Bond and Wiring.

Sound knowledge in Setup of THAT Corporation and ON Semiconductors for Amplifiers for both Die Bond and Wiring.

Experience in performing Planning Independent Requirement (PIR), Executing Cycle of Production.

Sound knowledge in Process and Production Based Analytics with Customers End.

Good knowledge in Methods, Managing Labor in Assembly Line, Production Run Steps. PROFESSIONAL EXPERIENCE: Organization: NATRONIX, CHENNAI, INDIA

Duration: June 2015-Till Now

Role: Senior Process Engineer

Product: Thermistors and Amplifiers IC’s

Duty: FOL to EOL

Description: Fabrication of solid core from the wafer and manufacturing integrated circuits. Our product is used by Electronic devices to improve the electron charges conduction in the circuit without get heated. Responsibility:

Engineering:

Developing process planning chart and assembly traveler for fabrication of solid core to storing of IC’s using MS Office.

To coordinate with production plan with engineers and labors for manufacturing with safety in shop floor.

Coordinating production process in daily basis and take lead of shift output.

Providing technical support for all departments and implementation of product packaging.

Implementing reduces of reject part and improving standards of rework part with improving bottle neck capacity of machines.

Performing strategy for operational inspection and equipment maintenance.

Developing line inspection and quality improvement of parts. MATHESH K S

SENIOR PROCESS ENGINEER

*******.*.*@*****.*** Contact Info: +91-882******* Manufacturing:

Performing material inspection for during the procurement of solid core using radiography.

Cutting the solid core to Wafer and curing them with heating and Thermo graphic Techniques.

Attaching the Number Color Code on core for Chip Monitoring using micrometer.

Providing the Die bond of the chip from the Wafer to Lead Frames with Alpha Sem.

Using Silver and Gold thin wires for implementing the circuit on the Chip by Wire Bonding techniques.

Checking the bonding of Silicon Stud on the Bonded and Wired chip using Ultrasonic Welding continued by heating it with furnace.

Slicing the semiconductors and placing in the strip of Arrays for packaging. SKILLS: Software Knowledge SAP Production Planning (SAP PP), Alpha Sem, Catia, Solidworks, Arduino Matlab, Microsoft Office - Word, Excel, PowerPoint. Domain Knowledge Project Execution Plans, Project Monitoring and Reporting, Process Improvement, Production Planning, Planning Independent Requirement, Executing Cycle of Production.

Material Inspection Wafer Inspection and Heating, Radiological Examination of Semiconductors, Line Inspection of Production Parts.

Process Planning Process Timing, Production Scheduling and Creation of Assembly Traveler, Engineering Traveler, Root Cause Analysis

Engineering Analysis Line Inspection and Engineering Uptime and Downtime Analysis Chart Production Daily Production Methods, Managing Labor in Assembly Line, Production Run Steps, Diagnosing Breakpoints and Work in Budget Plans Sample Monitoring Chip Dicing, Die Bonding and Placing, Wiring with Gold and Silver threads for Circuiting, Plastic Coating in Heating Furnace.

Others Status Reporting, Training and Documenting

EDUCATION:

Bachelor of Technology in Mechatronics Engineering with 6.262/10 CGPA from SRM University, Chennai, 2015.

HSC with 80.2% from SSVK Matriculation Higher Secondary School, Chennai, Tamilnadu, 2011.

SSC with 79.6% from SSVK Matriculation Higher Secondary School, Chennai, Tamilnadu, 2009. AWARDS:

Best Team Leader award for FOL to EOL in 2020.

Best Customer Service Team award in 2019.

Top Training Coordinator in IDT Project of the year 2018.

Top Performer Award for Process Statistics of the year 2017.

Top Trainee Performer in IDT Project of the year 2016.

Letter of Appreciation for the Guest Lecture on the topic of “Industry 4.0” in Department of Electronics and Communication at Dr. M.G.R Educational and Research Institute University on 12th July 2018.

Certificate of Appreciation in GNIIT for Engineers – Enterprise Application Development for IT Software Development and got GOOD GRADE conducted by NIIT Academy at New Delhi in 2018.

Certificate of Appreciation in Professional Skills for IT Software Development and got GOOD GRADE conducted by NIIT in 2015.

PUBLICATIONS:

Mathesh K S, Satheesh Kumar G “Design, Fabrication and Implementation of Deweeding Robot”, International Journal of Mechanical and Production Engineering, Volume- 5, Issue-6, Page 95-99, 2017. COMMUNICATION SKILLS:

WRITING : English, Tamil

SPEAKING : English, Tamil, Marathi, Hindi(Beginner) PERSONAL PROFILE:

Address : 1/14, Periyalwar Street, 2nd Lane, NH-1, Maraimalai Nagar, Chengalpet District, Tamil Nadu, India.

Date of Birth : 29/01/1994

Passport : T9858511

Passport Expiry : 21/10/2029

Marital Status : Single

Nationality : Indian

DECLARATION: I hereby declare that the above furnished details are fully true to the best of my knowledge and belief Place: Maraimalai Nagar (MATHESH K S)

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