Engineering Safety Officer
Resume:
Duane Brazeau
Beaverton Or **003
Mobile: 612-***-****
Email: ********@***.***
Professional Summary
More than 20 years of Senior Electronics / Engineering Technician experience, with strong component level troubleshooting analytical skills and a broad range of computer expertise.
10+ years of experience in Debug, build, trouble shooting and upgrade CPU, memory, hard disk drive, CPU board and support for all the testing system in the lab, such as Dell, sever system, tablet and video card, To get them ready for testing.
An excellent problem-solver, able to quickly grasp complex systems and identify opportunities for improvements and resolution of critical issues.
Adaptable and proficient in supporting Hardware and Software teams in the prototype design & development of systems in a wide variety of areas.
Ability to operate in extreme high pressure situations, successfully handle multiple priorities and possess a high level of discipline while remaining flexible.
Experience in software and hardware installation for bench setup (mainly PC) and collect data for Engineers.
Proficient in MS office applications (Microsoft Office Excel, Power Point, Outlook) – 10+ years
Working knowledge of Intel and UNIX server hardware configurations.
Familiar with DOS and Windows to test new software and firmware releases from Engineering.
Familiar with all major server components (BIOS, RAID/disk subsystems, NIC, etc.).
Schedule vendor dispatch for parts replacement, and physically capable to change out hard drives, rebuild machines, swap memory, etc.
Network/Systems monitoring, hardware break/fix/replacement, software, firmware upgrades on Windows servers 2003, 2008, and 2012, HP-UX, AIX and Linux OS. Dell, HP and IBM Hardware and VM servers.
Experience with Data Cabling /Computer Facilities maintenance, proven skills in PC repair, trouble shooting
Skills
Supporting, Troubleshooting, Installing, Repairing, Upgrading, Validation, Testing.
Ability to work independently and within a team environment.
Excellent strategic, conceptual and detailed planning.
Education
Bachelor of Science, Manufacturing Engineering Technology- University of North Texas, Denton, TX
(2 Classes to Complete)
Associate of Applied Science, Material Science and Engineering Erie Community College, Williamsville, NY
Training & Certification
Training from Microscopy Society of America and TEM Analysts
Certificate in Analytical Electron Microscopy from Lehigh University
Training and Certification on Omni-Probe and FIB200TEM
Professional Experience
Intel Corporation Santa Clara, CA
Intel Corporation Hillsboro, OR 09/2016 - Present
Engineer Technician
Responsibilities
Attach thermo-couples to sample heat ex changers and server blades and measure temperature.
Assemble thermal test vehicles and sample heat ex changers to CPU sockets in server blade.
Assemble DIMMs with heat sinks, attach thermo-couples, and install in server blade.
Debug, build, trouble shoot and #upgrade CPU, memory, hard disk drive, CPU board and support for all the
Testing system in the lab. Systems supported are sever system, tablets, video cards.
Responsible for electrical measurement tools/equipment, such as digital meters, function generators, oscilloscopes, logic analyzers, etc. Implementation of I2C-based communications between microcontrollers
Responsible for IODV lab which includes Lab safety and equipment maintenance
Prepare TEM Sample
De process return product to determine root cause of failure
MiaSolé / Hanergy, Santa Clara, CA 04/2015 - 11/2015
Senior Failure Analysis Specialist
Responsibilities
Validate and characterize performance and safety related failures or degradation Identify the failure mode Identify root cause mechanism
Identify whether the non-conformance is due to a design issue or manufacturing issue Support assessment of impact and extent of the problem
Make recommendations for engineering or procedural improvements Develop Methods, Models and Systems for evaluating failure mechanisms
Seagate Technologies, Bloomington, MN 08/2007 – 05/2014
Senior Engineering Specialist
Responsibilities
Equipment used: Transmission Electron Microscope, Dual Beam, and Single Beam FIBs; Scanning Electron Microscopes.
Built fully functional FA Lab including Capital Equipment purchasing and got lab equipment from surplus and rebuild microscopes, computers, air tables and CVD system to keep FA Lab in budget.
Supervising FA Technicians
Worked with the design engineers to develop new cutting edge memory products.
Assemble computers according to spec for resale, installing hard drives, optical drives, memory, and occasionally other components.
Provided interdepartmental support on an as-needed basis.
Provided SEM images to check specs on CMP, CVD.
Performed material and defect analysis using Brunker EDS.
Performed circuit edit using FEI’s DualBeam 835 and 300mm Helios PFIB EFI
Micron, Manassas, VA 04/2004 – 07/2007
Senior YE Specialist
Responsibilities
Instruments used include Hitachi 4800, FEI 230 and 235 Dual Beam, FEI Strata, and Quanta.
Tracked failing mechanisms down to the root cause using data mining applications to review all Probe, ESDA, Parametric, and Fab tracking information and metrics.
Ran Multi Probe on 300mm wafers.
Attach thermocouples to sample heat exchangers and server blades and measure temperature.
Assemble thermal test vehicles and sample heat exchangers to CPU sockets in server blade.
Assemble DIMMs with heat sinks, attach thermocouples, and install in server blade.
Used schematics and device layout to pinpoint electrical failure origins.
Recognized excursions and new yield issues in daily review of D-Ram and NAND memory products.
Programmed NAND and DDR memory to isolate fails.
Provided visual of the failure using XBeam, dual and single Beam FIBs, and scanning electron microscopes.
Used dimple grinders, Wet and Dry Deprocessing techniques, and standard optical microscopes.
Isolated PCB circuit related failures using voltage contrast and circuit editing techniques as well as Thermal/Photon Emission Scopes (IREM).
Support all kinds of hardware for engineers such as soldering, test parts, and modify test board, order part as engineer needed.
Support all software and hardware installation for bench setup (mainly PC) and collect data for Engineers.
Produced written reports and oral presentations relating to specific yield-limiting problems.
Provided SEM images to check specs on CMP, CVD.
Performed material and defect analysis using EDAX EDS and Oxford’s new EDS system.
Texas Instruments, Dallas, TX 10/2000 – 09/2001
Senior Engineering Technician
Responsibilities
Programmed TSYS 4350 laser-repair system for Digital Signal Processor device.
Failure analysis on DSP and DLP products to correct defects.
Experienced using Hitachi S4500 and S4700 SEM, FEI FIB- 200TEM, FEI 820, and 830 dual beam FIBS also field emission microscope.
Performed liquid crystal analysis and also back side analysis to test for Pin-hole defects in the gate oxide.
Used FIBs for voltage contrast and circuit editing techniques.
Purchased new equipment as well as performing preventive maintenance and repair of all equipment.
Performed material and defect analysis using Oxford EDS.
The role of D-Moss 4 was to take the research device and streamline the mass production and then pass it on to D-Moss 5.
Sematech, Austin, TX 09/1997 – 10/2000
TEM Engineering Technician
Responsibilities
Prepared TEM samples on cutting edge materials.
Screened and analyzed samples in a Philips CM30 TEM.
Interfaced with process engineers to determine best sample preparation strategies.
Worked with member company project managers and directors on research projects.
Instruments used: FEI FIB- 200TEM, SELA 100 and 200 semiconductor cleaving tool, and Gatan PIPS.
Purchased new equipment as well as performed preventive maintenance and repair of all equipment.
Ordered supplies for entire MA area.
Enabled offsite viewing of tool workstations.
Installed a CCD and video printer on each of the tools to enable quick snap shot printing.
Member of Hazmat Team and area Health and Safety Officer.
Twinstar Semiconductor, Richardson, TX 04/1995 – 09/1997
Failure Analysis Technician
Responsibilities
Performed failure analysis on 16 and 64Meg DRAM and SDRAM.
Provided SEM images to check specs on CMP, CVD. Instrumentation used: Focused ION Beam FEI FIB800 for XSections and voltage contrast and circuit editing techniques.
Tektronix Multi-Probe Tester, Joel 6600 SEM, Hitachi 4500S SEM.
Performed material and defect analysis using Hitachi S4500 with Oxford EDS.
Purchased new equipment and performed preventive maintenance and repair of all lab equipment.
Member of Hazmat Team.
AMD, Austin, TX 02/1991 – 04/1995
Failure Analysis Technician
Responsibilities
Implemented SEM sample preparation techniques to increase lab throughput.
Analyzed semiconductor materials using SEM and EDX to determine specification compliance, characterize defects, and yield enhancement.
Experienced with SEM sample preparation techniques including wet (acid) and dry (RIE) etching, freehand, and machine assisted cleaving of semiconductor wafers.
Experienced with modern polishing techniques including lapping film, and felt pad/slurry combinations.
Performed material and defect analysis using Oxford EDS.
Repaired and maintained equipment as well as ordered supplies for the lab in MA area.
Member of Hazmat Team.
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