RESUME

Daming Li, Ph.D in Material Science

**** ********* **., *** ***** CA 94066

addxfl@r.postjobfree.com, 650-***-****

QUALIFICATIONS

Skills of opto-electronics (GaAs, InP devices) assembly/packaging

diode laser product design and process development

tooling in new product development

product test, failure analysis and reliability evaluation

mechanical design: Solidworks (including Simulation), AutoCAD

surface vision device prototyping and production

Knowledge of optics

laser assisted surface machine vision of fast moving object

beam shaping, fast and slow axis collimation, beam expanding and fiber coupling etc

beam diffraction

laser safety

Skills of semiconductor wafer processing

Photolithography

Photomask design

Plasma etch and chemical wet etch

Dielectric coating

Wafer thinning

Wafer scribe and cleave

SUMMARY OF QUALIFUCATIONS

More than 20 years experience in photonics product design, fixture tool design, and product development

NPI of diode laser related project

Production support

Mechanical tooling and product level design have been applied throughout employment

INDUSTRIAL EXPERIENCE

Aug 2010-present

R&D leader of Lumisource Technologies. Lumisource develops diode laser based products for DPSSL and illumination sources.

Responsibilities

Project management

Organize R&D team to evaluate customer needs and do NPI

Customer communications

Co-ordinate with quality and production team to transfer new product to mass production

Main contributions

QCW diode laser stack development

Single emitter diode laser development for DPSSL

Multi-emitter fiber coupled diode laser

Line beam generators for line scan imaging

Line beam generators for target profiling

Optical lens development for homogenous light distribution.

Diffracted laser pattern system

Surface vision device prototyping

July 2004-Aug 2010

LD assembly, Sr. product/process development engineer/manager of laser diode assembly department.. nLight Photonics Inc., nLight manufactures high power semiconductor laser products

Responsibilities

Project management

Technical support to production and sales

Product design (industrial, medical and defense)

Bonding, test/BI

Wafer processing

Device failure analysis

Process development for new product introduction

Product and process documentation

Technical training of production team

Main contributions

100W high temperature pump module prototype development, owner of prototype design, process development, test & BI

Feasibility study of laser consumer product for professionals: concept design, performance study with existing platforms

Chip on Submount (CoS) test methodology design and development, design and process owner

CoS BI fixture design

LD bar bonding process development achieved >85% production yield@>10k units

Design, process development of LP1x3 product for DPSSL, Design and process owner. >30k hour life time

Design, process development of QCW1x4 product for DPSSL. Design and process owner.

Design, process development of QCW1x5 product for DPSSL. Design and process owner.

Design, process development of 10 W single emitter CN mount, Design and process owner

Submount design for 3 mm CL die attach, design owner

3 mm CL die attach fixture design. Design owner

3 mm CL die attach with <1 um bowing. Process development. Process owner

Pearl chiplet carrier bonding process development. Process owner

Single emitter Cmount die bonding process development for mass production, Process owner

Twin single emitter die bonding process development. Process owner

60W CS bar bonding process owner

Chip on submount (CoS) test, tool designer and process owner

Cleanroom facility setup of nLight Shanghai

SEC 410 die bonder setup for nLight Shanghai, Equipment and bonding process owner

Wire bonder setup for nLight Shanghai

Test equipment setup with support from test engineer

BI equipment setup with support from corresponding engineer

Feasibility study of high power semiconductor laser in material processing

Co-work with process engineers for wafer metallization

Dec. 2002-June. 2004

Process Engineer. Modulight, Inc., Finland. Modulight manufactures semiconductor laser products (FP and DFB)

Responsibilities

Project management of backend process

Production management

Wafer processing

Device test

Equipment maintenance and trouble shooting (IBS, e-beam, mask-aligner, surface profilometer, etc.)

Main contributions

metallization process development to solve metal peeling problem. Fixture design owner

developed quality thinning process for InP and GaAs materials. Process owner

improved photomask alignment accuracy through reliable mask design. Photomask design owner

designed stable fixtures for metallization of thinned InP wafer

design various fixtures for processing, packaging and test

Aug-Dec 2002

Consultant on CVD and PVD processes, semiconductor laser packaging and processing

May 2001 -August 2002

Laser diode assembly manager and Processing Engineer, Siros Technologies, Inc. San Jose, CA, U.S.A. Siros develops an innovative telecom module based on Vertical Cavity Surface Emitting Laser (VCSEL) technology.

Responsibilities

Prototype package development of 10 Gbps optical transmitter

oFlip-chip VICSEL die bond process development, process owner

oChip on Submount test

oWafer metallization

oTeam work of designing 10 G package

oThermal and thermal mechanical modeling of VCSEL subassmbly (FEA)

oVerification of attached VCSELs

Main contributions

developed a process for flip chip die attachment. Die attachment yield >90%. Process owner

developed InP substrate etching process for backside emitting VCSEL. Substrate etching yield >90%. Process owner

July. 1999 - May 2001

Manager of Packaging Group, Manufacture Engineer, Semiconductor Laser International Inc., Binghamton, NY, U.S.A. Semiconductor Laser International, Inc. manufactures semiconductor laser product of various wavelengths.

Responsibilities

Packaging management for two shifts production

Process development

oChip on Submount (CoS) of 980, 850 1480 etc. high power laser bar attachment Device thermal modeling (FEA)

oWafer processing

oCustomer engineering support

Main contributions

Developed high power laser array attach process for better thermal management

Improved metallization process for better metal adhesion

Fixture design to control solder thickness of attached die/bar

Improved laser array attachment for better fiber coupling efficiency

EDUCATION

-Ph.D. in Material Science, Tampere University of Technology, Tampere, Finland, 1998

-Licentiate in Material Science, Tampere University of Technology, Tampere, Finland, 1995

-M.S. in Physical Chemistry, Institute of Metal Research Academia Sinica, Shenyang, China, 1985

-B.S. in Metallurgy, North-east University, Shenyang, China, 1982

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