Round Rock, TX *****
A senior level technical or management role encompassing my experience & associated skill sets in the areas of product/mechanical design, electronics packaging, structural @ thermal solutions, & enterprise server/storage /networking system architecture. Education
West Virginia University, Morgantown, WV 26505
Bachelor of Science in Mechanical Engineering (1981-1985) Skills/Areas of Focus
20 years Thermal Management/Solutions/Simulation at the system level, sub-system level, & component level 20 years System (Server & Storage) Architecture definition 30 years developing and driving product & mechanical designs PCBA layout/placement strategy and data file exchange Custom heat sink design & thermal solutions
High speed interconnect & cabling solutions
SSD performance modeling & testing
Consumer, industrial, & medical product design & development Management of ODMs, key partners, and supplier/vendors Engagement with OEM customers to understand desired requirements & features Participation in industry standards/consortiums (PCI-SIG, T10, SFF, SNIA, EDSFF ) 8 US Patents
Sr. Principal Engineer, Keysight Technologies, Austin, TX (Nov. 26, 2018 – Present)
Utilize SolidWorks & SolidWorks Flow Simulation as the key design & simulation tools for network packet broker chassis, switch, line card modules, 1U power supply shelf, & security taps design as well as PCBA integration & interconnect/cabling selection efforts required for those products
Manage CM back end integration at domestic and APAC sites
Generate BOM structures & ECNs/ECOs in Agile
Next Gen Packet Broker platform: https://ixia.keysight.com/products/vision-x Sr. Member of the Technical Staff, BOXX Technologies, Austin, TX (March 20, 2018 – Nov. 21, 2018)
Generate concept architectures/designs/specifications and backplane solution for next gen scalable and modular server & workstation solutions.
Focus on PCIe switch fabric solutions to optimize next gen GPU servers targeting the deep learning/AI market.
Utilize SolidWorks & SolidWorks Flow Simulation as the key design & simulation tools for concept architecture efforts
Principal HW Architecture Strategist, Micron Technology, SBU (Storage Business Unit) & NVE (Non-Volatile Engineering), Austin, TX (July 13, 2015 – Feb 16, 2018)
Define architectural requirements & provide concept design guidance for Enterprise Class flash solutions for PCIe NVMe Gen 3 Add-in card, 2.5" U.2 SSD & M.2 form factors focusing in the areas of NAND & DRAM configurations, power projections, thermal management solutions, PCBA layout strategy, structural integrity validation, cost optimization, high speed interconnect selection, and JDM/partner engagement.
Define low latency NVMe over fabric & scalable HW storage appliance/converged storage cluster architecture solutions.
Oversee cost center Capex & Opex budget planning & spend as well as functioned as procurement coordinator for the cost center
Participate and drive standards definition in PCI-SIG, SNIA/SFF, & EDSFF technical workgroups Sr. HW Architect, Seagate Technology (formerly Avago & LSI - 2 acquisitions), Electronic Solutions - Flash Architecture Group, Austin, TX (July 11, 2011 – July 10, 2015)
Define architectural requirements, deliver validated concepts, design & develop Enterprise Class PCIe NVMe flash solutions in both Gen 3 Add-in card & 2.5” U.2 form factors with an emphasis in the areas of unique thermal solutions, PCBA layout strategy, structural integrity validation, Super-cap sizing, & high speed interconnect selection.
Participation in industry standards (PCI-SIG, T10, SFF) Sr. Principal (Mechanical) Engineer, DELL, Enterprise Storage/Servers., Round Rock, TX (Dec 15, 2008 – April 15, 2011)
Develop custom Nehalem-EP anchored server platforms with an emphasis on thermal management solutions, PCBA layout strategy, HDD IOPS performance, and IO selection for high speed mezzanine card solutions in conjunction with select ODM partners in Asia.
Shock, linear vibration PSD profile, rotational vibration PSD profile, & test criteria characterization definition for Enterprise class SAS/SATA HDDs and SSDs utilizing Labview based DAQ and laser vibrometer tools. Storage Systems Hardware/Mechanical/Thermal Architect, LSI Corp., ESG Div., Austin, TX (Dec 8, 2003 – December 12, 2008)
Function as the organization’s mechanical & thermal architect for high density storage array and FC, SAS, SATA, & iSCSI RAID controller & disk array expansion enclosure based systems.
Concentration focused on SAS controller architecture development/validation including overall board topology, silicon selection, blower/fan sizing/selection, & internal/external scalable high speed interconnect solutions Sr. Mechanical/Hardware Engineer, Sun Microsystems, Inc., Austin, TX (May 19, 2003 – Dec 5, 2003)
Coordinate qualification testing including EMI, shock & vibration, and thermal testing for Volume System Products’ servers & workstations. Conduct RSS tolerance analysis, mechanical emulation/testing, and FEA studies on CPU modules/LGA sockets, power supply, & hard drive FRUs in an effort to support company-wide interconnect roadmaps, characterize root causes, & implement timely/cost effective corrective action solutions. Mechanical/Thermal Design Consultant, Round Rock, TX (October 2002 – May, 2003)
Provide product design/development, project management, and CM liaison related services. Primary areas of focus: sheet metal enclosure design, electronics packaging, and thermal characterization/management/fan sizing/selection (Examples: 10U rackmount router, 1U/2U server appliance, custom application PCIe cards) Director of Electronics Packaging/Thermal Architect, Surgient Networks, Inc., Austin, TX (May 3, 2000 – October, 2002)
Manage and technically lead Mechanical/Electronics Packaging Group in the design, development, and delivery of revolutionary rack mount streaming application switch fabric based server platforms.
Function as company’s Thermal Architect performing thermal & system impedance characterization studies utilizing both ICEPAK & QFIN analysis tools and thermal simulation testing techniques. Lead Mechanical Engineer, DELL, ESG Storage Div., Round Rock, TX (April 12, 1999 – April 28, 2000)
Design and development of SCSI & Fibre Channel disk storage enclosure products (JBODs). Included thermal analysis/management/characterization (Flotherm & Cosmos/M), fan/blower sizing, thermal testing implementation, customized thermal programs, mechanism design responsibilities, and overall chassis design. Product Design & Analysis Consultant/Sales, owner of Automated & Innovative Methods, Inc. (formerly Diversitech Design Group, Inc.), Round Rock, TX, Cary, NC & Richmond, VA (July 1990 - 1998) R&D Project Engineer, Delta International Machinery Corp., (Product Development Group), Pittsburgh, PA (July, 1988 to June, 1990).
R&D Engineer, BMY Division of Harsco Corp., (Advanced Product Development), York, PA
(June, 1987 - March, 1988)
Project Engineer, Hercules Aerospace, Inc., (Radford Army Ammunition Plant), Radford, VA
(July, 1985 - June, 1987)
Patents * Software Specializations
For 8 U.S. Patents refer to Linked In Accomplishments section: www.linkedin.com/in/greg-shogan-5370572
Pro/ENGINEER (up to Creo 3.0) Design Application Experience – 20 years +
SolidWorks (currently 2018) Design, Assembly, & Cable Experience – 4 years
Cosmos/M, Creo Simulation, and ANSYS Application Experience (FEA) - 20 years +
Coolit, ANSYS Icepak, & SolidWorks Flow, Application Experience (CFD) - 15 years +
MS Project for schedule/resource leveling
Custom Visual Basic utilities for thermal, flow impedance, and vibration applications
- Publications -