Rommel Garcia

Phase *, Block **, Lot * Citta Italia Subdivision, Bacoor, Cavite, 4102 * 091******** * adcv4t@r.postjobfree.com WORK EXPERIENCE

VISHAY INTERTECHNOLOGY INC., Binan, Laguna

Director for Operations, Jul 2014 - Dec 2018

Lead the facility transfer to support expansion of Operations for Die Sort, Final Test, Wafer Plating, Backgrind and Backmetal processes from Building F to I Expand and manage wafer sort and test operations for Linear and Power IC, Integrated Power Device

(DrMOS), WLCSP (Wafer Level ChipScale Package), High Voltage and Low Voltage MOSFETs Generate annual cost saving of about $1.1M from the operations of Wafer Plating process (Ni/Au and Ni/Pd/Au) for bond wireless (Clip)package devices that was transferred from US to Philippines site Improve Subcontractor Operations and turn around time for Qualifications, Manufacturing and Engineering lot assembly

Enhance Product Engineering capability, capacity and cycle time to achieve annual target on new product characterization, qualification, safe launch, ESD testing Establish improved production factory planning procedure in meeting CLIP, CVP, OSD, CRD and Inventory targets.

Achieve Corporate KPIs on Operations Cost, Revenue, Delivery, Quality, Lean Manufacturing, NPI characterization, Transfer Projects for different Wafer Processes including Wafer Plating, Standard and Taiko Backgrinding and Backmetal

Propose and manage Annual Operations Budget including CAPEX Senior Operations Manager, Jan 2007 - Jul 2014

Lead and manage the factory transfer from Taguig to Laguna that includes Final Test, Wafer Sort and Product, QA and Test Engineering

Improve wafer sort capacity and test operations for Linear and Power IC and Discrete Devices Achieve Subcontractor Operations performance in terms of quality and cycle time for Qualifications, Manufacturing and Engineering lot assembly

Establish additional Product Engineering resources on new product characterization, qualification and safe launch

Improve production factory planning structure and procedure in meeting CLIP, CVP, OSD, CRD and Inventory targets.

Achieve Corporate KPIs on Operations Cost, Revenue, Delivery, Quality, NPI characterization and Transfer Project

Propose and manage Annual Operations Budget including CAPEX Product and Test Engineering Manager, Jan 2001 - Jan 2007 Timely execution of test program development and migration for Analog and Power IC Implement 100% wafer sorting for IC wafers to improve final test yield and achieve cost reduction in assembly

Achieve faster cycle time in completing new product characterization for IC and Power MOSFET Develop test fixtures and hardware for effective characterization of new IC devices Strategize manpower skills development and spare parts management to improve machine availability and utilization for wafer sort and final test

Manage the development of new test hardware and test programs for multi site probing and testing of IC devices

Establish new package test capability

Establish wafer sort operations for Linear and Power IC, Discrete MOSFETs Manage Equipment transfer from other Siliconix site for additional capacity and lower cost Failure Analysis and Reliability Section Head, Mar 1999 - Jan 2001 Perform package and die level failure analysis on IC and Discrete devices Conduct training on failure analysis for Product and QA Engineers Generate qualification test plans, reliability test capability and monitoring report Manage FA and Reliability Technicians

Work with QA and Product Engineering team on inline and customer rejects Establish new capabilities and procedure for failure analysis and reliability Manage reliability test monitoring programs for Siliconix SHINKO ELECTRIC INDUSTRIES CO., LTD, MAKATI, Makati, Manila Technical Sales Engineer, Oct 1997 - Mar 1999

Coordinate new package development design to head office Provide engineering data nd samples to customer

Work with head office in understanding and resolving issues Coordinate demand forecast and delivery plan between head office and customer TEAM PACIFIC CORPORATION, Taguig, Manila

Senior Quality Engineer, Aug 1995 - Oct 1997

Supervise Quality Inspectors for Final Test

Generate procedure and specifications for Visual and Mechanical Inspection Work with Final Test and Product Engineering in resolving customer complaints and dispositioning low yield hold lots

Work with Failure Analysis team in improving turn around time in identifying failure mechanism TEMIC MICROELECTRONICS INC., Taguig, Manila

Failure Analysis and Reliability Engineer, May 1994 - Aug 1995 Perform package and die level failure Discrete MOSFET devices Establish new capabilities and generate procedures for failure analysis Work with Product Engineering in understanding and resolving low yield rejects Work with QA and Product Engineering team on inline and customer rejects Improve failure analysis procedure to reduce cycle time and provide timely feedback TEAM PACIFIC CORPORATION, Taguig, Manila

Failure Analysis and Reliability Engineer, Jun 1992 - May 1994 Perform Failure Analysis on all rejects from customer and from low yielding hold lots Generate and update reliability test monitoring program for different customers and packages Supervise and trained failure analysis and reliability technician Work with Process and Product engineers in resolving customer issues and assembly and test rejects EDUCATION

DE LA SALLE UNIVERSITY, Malate, Manila

Master of Science in Electronics and Communications Engineering, Dec 2008 DE LA SALLE UNIVERSITY, Malate, Manila

Bachelor of Science in Electronics and Communications Engineering, Jun 1992 ADDITIONAL SKILLS

Excellent Verbal and Communication Skills

Coaching and Mentoring

Budget Management

People Management

Project Management

Product and Failure Analysis

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