ZACK HSU

+1-510-***-****

adchro@r.postjobfree.com

https://www.linkedin.com/in/xe7961

https://sites.google.com/view/xe7961

OBJECTIVE: Seeking a Full-time Mechanical/Manufacturing Engineering role. Available from May 2020. EDUCATION

University of California, Berkeley, USA (Expected) May 2020 MEng Mechanical Engineering (Product Design), GPA:3.6/4.0 Awards & Certificates

Fung Excellence Scholarship (2019-20)

Relevant Coursework

SKILLS

Language

Python, MATLAB, FORTRAN, Excel VBA

Chinese Mandarin (Native), English (Fluent)

CAD/CAE(FEA)/CAM (3 yrs research exp.)

AutoCAD, NX, SolidWorks (Primary), Thermal analysis ANSYS Structure (Primary), COMSOL, CFD, Moldflow

Manufacturing & Metrology (2+ yrs work exp.)

Defect inspection, Hardware, CRM, GR&R, CP&CPK

Machine learning, Lean Manufacturing, Six sigma

Sheet metal forming, Casting, Positioning

Product Design (1+ yrs work exp.)

FMEA, DFM, DFA, GD&T, DOE, FATP, Injection molding Soft fabrication, Cosmetics, Quality and Reliability ME292 – Human-Centered Design

ME225 – Fracture of Engineering

ME231 – Exp. Advanced Control Design I

ME224 – Mechanical Behavior of Materials

National Taiwan University, Taiwan 2013-2015

M.S. Applied Mechanics (Multiphysics simulation), GPA:3.7/4.0 Exchanged student in Engineering department, Peking university (PKU) IAM Graduate scholarship (2013-15)

National Central University, Taiwan 2009-2013

B.S. Mechanical Engineering, GPA:3.43/4.0

WORK EXPERIENCE

Foxconn

Shenzhen, China

04/2018 – 07/2019

NPI Mechanical Design Engineer – iPad Keyboard

• Leadership: Organized teams of 20+ engineers to develop the next generation of Apple iPad Smart keyboard

• Design: Demonstrated mechanical skillsets including GD&T, DoE, OM/SEM/CT, and Tolerance analysis

• Design: Evaluated ergonomic design, plastic injection molding, fixture, and automation station setup

• DFM/DFA: Reviewed DFM/DFA on fixture and assembly lines to improve production throughput & yield

• Manufacturing: Familiarized with laser cutting/welding, adhesive, glue dispense, heat stake, and AOI

• Reliability: Executed reliability experiments on PCBA/FPC and validations (Drop/Cycle/Environment test)

• Quality: Experienced statistical process control (SPC) and data visualization (JMP, MATLAB)

• Specialty: Specialized in soft goods product with plastic and fabric cosmetic standardization ASML

Hsinchu, Taiwan

02/2017 – 04/2018

Process Engineer – Optical Metrology

• Management: Managed project schedule with cross-functional teams and maintained customer relationship

• Automation: Automated the data acquisition sequence on MATLAB to save 95% of time on data cleaning

• Teamwork: Developed test plans, collected data, performed analysis, and recommendations in the form of applications notes, best-known methods (BKM) for a smooth knowledge transfer Applied Materials

Hsinchu, Taiwan

03/2016 – 02/2017

Hardware Engineer – SEM Metrology

• Manufacturing: Designed metrology test plans, error budget, and documentation in tool-to-tool matching

• Sustaining: Calibrated precise SEM metrology tool to improve the precision and accuracy at nm level

• Hardware: Familiarized with the functionality of common tool parts in semiconductor field, such as electrostatic chuck, wafer handler, positioning stage, and vacuum pump in tsmc PROJECTS

Project 1 – A Pulse Detector for Traditional Chinese Medical Diagnostics Capstone Project 08/19 – Present

• Design: Developed a robust and ergonomic piezoelectric sensor to measure human pulse signal

• Design: Design the manufacturing process of sensor to stabilize the product performance (GR&R)

• Electromechanics: Established a circuit with noise cancellation and implement on microcontroller for data acquisition Project 2 – iPod Battery Door Design Design Challenge 12/19 – 12/19

• Design: Designed a latch mechanism for battery cover and built a mathematical model to optimize the tactile

• Reliability: Improved the robustness to drop event, dustproof product design and calculate fatigue life (S-N)

• Manufacturing: Demonstrated an understanding of injection molding, surface treatment and GD&T practice Project 3 – Numerical Modeling of Electrostatic Chuck in Multi-disciplinary Field NTU Master Thesis 09/13 – 06/15

• FEA: Developed a novel algorithm to simulate the wafer temp. up to 95% accuracy with exp.

• FEA: Coupled Fluid Dynamics, Thermal analysis, and Electromagnetism together in a multi-disciplinary field PUBLICATIONS (3x FEA-related, 1x Metrology-related field)

[1] Enabling optical metrology on small 5x5μm2 in-cell targets to support flexible sampling and higher order overlay and CD control for advanced logic devices nodes, Mar. 2018, SPIE advanced lithography, San Jose, CA, USA

[2] Modeling and Simulation of Heat Transfer Characteristics on Electrostatic Chuck with 12-inch Wafer, Oct. 2015, The 10th International Microsystems, Packaging, Assembly and Circuits Technology IEEE, Taipei, Taiwan.

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