Engineer Process
Resume:
DucAnh Trinh
Glendale, AZ *****
Contact Phone: 602-***-**** Email Address: *************@*****.***
SUMMARY
Director Operations Manufacturing Engineering Level & Sr. Process Engineer with more 25 years of experience in the areas of Printed Circuits Board (PCB), Surface Mount Technology Assembly (SMT), RF High Power Amplifier, Telecommunication Equipment.
SMT Equipment Knowledge: DEK and MPM paste printer. Pick & Place: Siemen, Fuji, Mycronic (MyData), Juki, Phillips. Reflow Oven/Wave Solder: BTU, Heller, Conceptronic, Electrovert. AOI: Yestech. Caltech Optical Measurement. BGA Rework: AirVac DRS24/25. Dage/YesTech X-Ray. SlimKIC2000: Thermo profiling.
PROFESSIONAL EXPERIENCE
Comtech Corporation. (Comtech EF Data. Tempe, Arizona) 01/2006 to 05/2020
Director, Operations Manufacturing Engineering/Sr. Process Engineer
Managing a discipline team that includes 45 Engineers, Technicians, Production Managers and Assembler combined to support manufacturing needs
Applying aggressive SMT process techniques using PFMEA/6S/8D, 8M and CPI (Continuous Process Improvement) methods including DFM (Design for Manufacturability) Review to improve product’s quality and reliability.
Managing 4 SMT lines included: PM (Preventative Maintenance) support team, ICT test support, and technical process support
Lead and mentored ME team throughout internal and off-site training to improve problem solving skills.
Developing RoHS compliance process (Lead-Free) across product line to meet European & Asian, Latin America market requirements.
Successfully developed and implemented PoP process techniques (Package on Package) to support production critical new technology.
Calix Networks. Petaluma, California 01/2005/01/2006
Sr. Process Engineer
Worked offshore as the Sr. International Process Engineer. Provided technical support, training and process monitoring in Asia facilities (China/Thailand/Mexico) to ensure the products achieving the highest quality and meeting delivery schedule
Reviewed/established components library used in the manufacturing to meet liability/quality against field failure. Perform DFA (Defect Failure Analysis) technique to reduce the risk of failed products deliver to end user.
Suntron Corporation, Phoenix, Arizona 07/2003 to 01/2005
Sr. Process Engineer
Managed 4 SMT lines (Siemen/Phillips) and provided process support to production team.
Performed PFMEA (Process Failure Mode and Effect Analysis) to achieve the highest quality performance in the manufacturing environment, as a result millions of dollars saving within a year.
PCS Inc, Fremont, California 03/2001 to 07/2003
Sr. Process/Mfg Engineer
Developed reflow profiles and wrote technical process instructions for BGA repair (Removal & Installing) using AirVac DRS24 Rework equipment. Mainly Apple/Dell/Cisco products.
Provided technical support to worldwide facilities (Singapore, Japan, and China.) Designed tooling to assist mechanical assembly processes, implementing new processes as well as supporting equipment into high volume worldwide production.
REMEC/CREE (FORMELY SPECTRIAN CORPORATION) Sunnyvale, California 12/1997 to 03/2001
Sr. SMT/Mfg Engineer - (RF Power Amplifier)
Established/Supported plans for outsourcing products to Far East and South America countries. Accomplished multi-million projects to high volume manufacturing (PCBA) in Thailand, China and Mexico.
Worked as a member of the NPI team (New Product Introduction) from prototype designing stage transition to production. Responsibilities include: Reviewing PCB Design, Evaluated SMT Components for manufacturability of high-power RF amplifier for wireless communications industry: GSM, 2G, 3G CDMA, and TDMA.
Performed DFM report (Design for Manufacturability) and DFT (Design for Testability) to improve the PCB design errors and minimized costly SMT Processes.
SOLECTRON CORPORATION, Milpitas, California 09/1996 to 12/1997
Sr. SMT/Process Engineer -
Major responsibilities included: Developed SMT manufacturing methods, procedures, and tooling cost reduction techniques to meet customer quality and cost requirements. Interfaced with major companies: Cisco, Nortel, Intel, Sun Micro, and Apple
Performed DFM and DFT reports to eliminate the design errors from the early design stages prior to high volume production. Evaluated/purchased SMT equipment for max volume production use.
DYNACO CORPORATION 08/1986 to 07/1996
Process Engineer - PWB, August 1993 to June 1996
Chemical Milling Product Engineer, January 1986 to August 1993
Developed technical process instructions of high-performance Rigid-Flex and Flex circuits, PCB for military/aerospace, telecommunications, medical, and computer applications.
Worked with major military electronic defense programs: Hughes, Raytheon, Lockheed Martin
Knowledge of MIL-S-55110, MIL-S-50884C, IPC-A-610, MIL-S-2000, IPC-SM-782
EDUCATION
Wichita State University, Wichita, Kansas (1982) - Business Administration (Incomplete)
Danang Technical Institute, Danang, Vietnam (1977) - Mechanical Engineering
Vanhanh University of Saigon, Vietnam (1973-1976) – BSBA
COMPUTER SKILLS & TRAINING
CircuitCAM, CIMbridge, CADMicrosoft Office Professional Applications.
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