DAVID M. LIPSCOMB

**** ****** **.

Leander TX. **641

adbvfl@r.postjobfree.com

256-***-****

SUMMARY

Result oriented SMT process engineer with 20+ years of experience in the PCBA electronics manufacturing industry. Motivated team player that works hard, learns quickly, and is committed to continuous process improvement.

EXPERIENCE

Process Engineer

Flex, Austin, TX. 2019-2020

Developed and updated Manufacturing SOP for various processes and products. .

Used company proprietary manufacturing software for heat tracking software to developing and implement improvement action to process.

Performed and implemented various process improvement actions via customer request.

Updated and Developed AOI program files for PCBA manufacturing process.

Programmed and Developed with various specialty PCBA rework equipment processes.

Delegated various project actions to engineering technicians on 2nd shift.

SMT Manufacturing Engineer KMC Controls, New Paris, IN. 2014-2018

Update engineering revision changes on SMT program files and any related process documentation.

Develop and maintain program files for Yamaha placement, DEK paste printing, Heller reflow, and Speedline wave solder equipment.

Consult with PCB design engineering team to implement improved quality, production throughput, and new product launches.

Provided daily engineering support and equipment recovery for production assembly area.

Performed required maintenance to Speedline Vectra wave solder machine.

Generated, review, and approve work process documentation for PCBA process.

Updated and maintained PCBA Bill of Materials into Epicor System for costing and inventory purposes.

Developed and implement prototype assemblies for all NPI assemblies.

Implemented and completed full pb free process transition during tenure at this facility.

Trained engineering technicians to recover equipment, implement process improvements, and facilitate processes on manufacturing floor.

Procured and researched new small equipment and products to implement onto electronics floor to increase production quality and flow.

SMT Process Engineer

Sensit Technologies, Valparaiso, IN. 2011-2014

Established new SMT assembly process and equipment floor layout for electronic OEM.

Acquired, installed, upgraded, restored, and recovered used PCB assembly equipment.

Developed programs for Quad placement, DEK stencil paste printing, and Mirtec AOI equipment.

Consulted PCB design engineering staff to implement improved quality, production, and new product launches.

Implemented process improvements to increase throughput, quality control, and product flexibility in process.

Utilized Unisoft Manufacturing Software to convert and generate Cad data, and documentation for PCBA assembly area.

Senior SMT Engineering Technician Static Control Components, Sanford, NC. 2009-2011

Supported and recovered counter measures on SMT placement.

Provided engineering support and implemented process improvements.

Developed programs for SMT placement and Laser marking process.

Routinely maintained screen print, placement, and reflow equipment.

Supervised and supported off shift operations.

Performed recovery counter measures on laser printing equipment

SMT Engineering Technician Total Electronics, Logansport, IN. 2008-2009

Performed mechanical and programming counter measures on Fuji SMT and Universal axial placement equipment during production runs.

Provided engineering support for various PCB equipment and processes including Fuji, Universal, DEK, MPM stencil printers.

Developed programs for CHAD radial and pin insertion equipment.

Recovered and maintain screen print, placement, reflow, and through hole equipment.

Worked with Engineering staff to implement process improvement

Supported and recovered off shift electronic floor operations.

Associate Process Engineer Calsonic Kansei North America Inc., Lewisburg, TN. 2007-2008

Engineer in Tier 1 automotive electronic manufacturing.

Provided engineering support for various PCB equipment and process.

Developed programs for cut/clinch and conformal coating equipment.

Implemented engineering projects for assembly processes improvements.

Created work process instructions for PCB assembly processes.

Recovered and maintain screen print, placement, reflow, and AOI equipment.

SMT Coordinator

Danaher Controls Corporation, Elizabethtown, NC. 2006-2007

Planned and scheduled SMT production runs.

Developed programs for Quad placement and YES tech AOI equipment.

Released and scheduled delivery of components using Mapics and Supply Works inventory management systems.

Directed and managed SMT associates in daily production activities.

Recovered and maintained screen print, placement, reflow, and AOI equipment.

Generated standard work instruction documents for ISO 9000 manufacturing process.

Implemented Kaizen process improvements to increase quality throughput for SMT area.

Performed time studies, fixture development, set-up optimizing.

Supported off shift SMT operations.

SMT Engineering Staff Keihin Carolina Systems Technology, Tarboro, NC. 2002-2006

Supervised engineering operations on 3rd shift by delegating tasks to technical associates in the implementation of engineering projects, and preventative maintenance.

Performed mechanical and programming counter measures on Panasonic SMT and through-hole placement equipment during production runs.

Performed recovery, maintenance, and program adjustments on AOI equipment.

Optimized reflow oven profile characteristics for different PCB assemblies using Kic profile software.

Communicated important issues and downtime situations between shifts for engineering group.

Consulted shift production staff on best course of action decisions concerning downtime situations.

Senior SMT Process Technician Danaher Controls Corporation, Elizabethtown, NC. 2000-2002

Established new SMT assembly process and floor layout for OEM.

Responsible for procurement and installation of new equipment.

Consulted with PCB design engineers on DFM issues to improve quality and flow of production.

Generated and maintained placement programs for Quad placement and Seho oven equipment.

Program, maintenance and operations on MyData placement equipment at sister facility.

Implemented process improvement strategies for improved quality and throughput.

Created ESD and Inventory Control Systems for parts storage and handling.

Designed, ordered, and maintained solder paste stencils.

Optimized reflow and wave solder profile characteristics for PCB assemblies.

Education Associate of Science, Electronics Engineering Technology 1991 Nielsen Electronic Institute, Charleston, South Carolina GPA 3.95

Specialized Training

Yamaha, Quad, Panasonic, Juki, Mirtech, YES Tech. along with various other PCBA equipment experience.

Previously trained in Kepner-Tregoue troubleshooting techniques.

Previously trained in IPC 610D quality standards.

Experience with DFM applications and Lean Manufacturing.

Experience in capital equipment evaluation and acquisition.

Knowledge of electronic components, balancing line cycle time, cad data conversion.

Previously trained ISO 9000 and ISO 9002 Certification training.

Trained in use of service manuals, schematic diagrams, and CAD drawings.

Proficient in Standard Operating Process development using Microsoft Office applications.

Experience using MP2, Somac, and various maintenance tracking software systems.

Certified previously in Pana Pro software applications.

Received certified training in Juki HLC software.

Experienced in program development for networked Quad offline system.

Generated CAD programs using Circuit Cam Lite for HLC software.

Generated VBA macros to verify placement file development and BOM verification.

Entered BOM part items accurately into Epicor 9 management system.

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