Engineer Process

RESUME

V.RAMESH

Mobile : +91-822*******

E-mail : ************@*****.***

CAREER OBJECTIVE :

Seeking a challenging position in a progressive company in the field of Electronics Manufacturing Services, which encourage & recognizes hard work, where i will have as opportunity to constructively contribute toward organization goal, thus enhancing my personal & career growth.

Period

Organisation

Designation

June 2016 to Till

Spel Semiconductor Limited

Maraimalai Nagar,

CHENNAI

PROCESS ENGINEER

EXPERIENCE @ SPEL Semiconductor Limited

NATURE / AREA OF WORK:

Worked as a Process Engineer in End of Line (Mold, Trim, plating & Forming) assembly.

Exposure on process of semiconductor IC (Integrated Circuit) assembly processes.

JOB RESPONSIBILITIES:

Defining Process Flow Diagram on the basis of Cycle time study & line balancing.

Ensure the process parameter setting in the back end assembly mold, trim and forming machines.

Involved in daily review to improve yield rate, KPI & process improvement.

Perform as key coordinator between manufacturing,Facility and R&D Departments

Ability to develop new lead frame drawings for IC assembly through mechanical developing software.

Responsible for preparing PPAP documents such as control plan and PFMEA.

Study of process capability, process stability and involve in the process validation study.

Effective implement 5S policy in various stations.

New Products qualification (Program development & Assembly).

Responsible for preparing weekly,monthly yield report to customer,acts as a key performer in monthly yield review with customer and responsible for sending CAPA reports to customer.

Up time monitoring & improvement by reducing the tool breakdown by define proper PM frequency.

Yield monitoring & improvement through process control tools (Online SPC).

Micro Analysis on critical defects at End of Line.

Machine set-up and troubleshooting process related issues.

Preventive Maintenance activities to improve OEE.

To analyze returned product or customer feedback to ensure outgoing quality.

Lead & participated in continuous improvement program to improve quality, cost reduction & process improvement through six sigma study.

Knowledge on conducting Floor Audit and supplier Audit shall be carried out as required.

Training to technician level personnel.

Understanding and focusing customer requirements & responding it with top priority.

Good exposure in calibration and maintenance techniques.

ACHIEVEMENTS:

Yield improvement through continuous monitoring on forming of an issue (Die chipout) and increase up to 1.0%.

Minimised the yield loss in forming such as lead frame jam in machine track by providing Modified feed pin.

I have developed one new product through reducing die pad area of 32QFN IC device.

ACADEMIC DETAILS:

Qualifications

Institution

Year of passing

Percentage of marks

B.E.,

(Mechanical Engineering)

The New Royal college of engineering and tech Mamallapuram.

May -2015

70

HSC

Sri Ramakrishna Mission Vidyalaya Boys Hr.Sec School, chengalpet.

May-2011

70

SSLC

P.T.V.S High School,

Thirukazhukundram.

May-2009

73

TECHNNICAL EXPOSURE:

Design tools : Auto CADD, Creo Parametric.

Operational Software : Microsoft Office.

PERSONAL DETAILS:

D.O.B : 27.05.1994

Father’s name : VADIVELU.K

Marital status : UNMARRIED

Nationality : INDIAN

Languages known : ENGLISH & TAMIL

Permanent Address : No: 103 DR.RAMADOSS STREET, EDAIYUR POST

NARAPAKAM VILLAGE,

THIRUKAZHUKUNDRAM VIA,

KANCHIPURAM DIST 603109.

DECLARATION:

I assure that the above furnished details are true to the best of my knowledge. I am confident of being able to exhibit to you that I shall be an indispensable asset to your organization.

Place : RAMESH.V

Date :

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