Sales & Business Development, Program Management, Supplier Management
Global Leadership and team-building skills coupled with demonstrated success in achieving sales and P&L goals. Experienced at strategic planning to meet objectives and communicate with individuals at all organizational levels. Accomplished at driving against recognized markets and revenue opportunities to address emerging technologies and the required sales/resource implementation to gain market share and drive new business opportunities to fruition. Awarded by customers for partnership /service and bringing business acumen with experience as an IDM customer, OSAT supplier, Foundry/turnkey supplier and Capital equipment provider. Negotiate successfully from all views and use consultative approach to deliver win-win experiences.
P & L / Start-Ups / Growth Strategies / Cost Savings / International / Engineering / SPC/Quality/Negotiations / Customer Management / Product Development & Management / Team Leadership / Program Management/ Supplier Management/ Sales Management / Marketing/Partnerships/Contracts
Northstar Technologies 2019-
Sr Marketing and R&D Program Director (Semiconductor Equipment and Instruments)
Drive all Company collateral and Strategy to integrate with Sales and Customers
Develop Strategic Company Roadmap with Engineering and Customers
Managing all key Research and Design engineering projects to keep on committed timelines
Astronics Test Systems 2016 – 2018
Global Sales Director/Program Manager Semiconductor Test (Equipment and Instruments)
Managed Intel, QCOM, TI and most non-bay area global accounts including OSATs.
Performed break-ins at 20+ accounts for system level test and adjacent strategies.
Managed inside sales and external sales as well as marketing including all collateral for presentations.
Managed and Drove strategic supplier costs down
Program managed equipment manufacturing, pricing and delivering to top tier customers.
Created creative costing, pricing and configuration strategies to ease start-up on high parallel equipment.
TSMC North America (World’s Largest Semiconductor Wafer Foundry) 2014 – 2016
Global Account Manager, Business management
Managed multi-billion-dollar Qualcomm account.
Directed RF, SOI, 45nm and all bump/Probe/WLP/Backend business management.
Developed new customers in Southern California.
Performed all CRM and Forecast analysis and strategic recommendations.
Negotiated all quarterly revenue reconciliation ($1-3M/qtr) for wafer buy and probe businesses.
Program managed key complex front and back end technical projects internally and externally.
Advantest America Inc (Technology Company with SOC and Memory Testers, Handlers, Interface, Sem, Lasers)
Global Sales/Pgm Dir IDM, Fabless, and OSAT accounts. 2007 – 2014
Grew new revenue $300M+(and kept internal margin goals) within a 4-year period winning key customer accounts by working partnerships and strategic objectives with C level executives, plus day to day management/relationships with managers, engineers, procurement.
Negotiated contracts, purchase orders and escalated at the proper time any roadblocks to joint success.
Developed cost and pricing models for own accounts and to aid other sales teams (25+) in fabless space, worked with R&D to optimize equipment sets for each individual win.
Drove Joint Development Agreements and contracts to strategically set up the future 2015-2017.
Managed/developed new memory business at Qualcomm and managed the downstream sales at their 3 largest SAT partners. Resulting sales $100M+ and 100% market share-Locked out competitor.
Responsible to generate all quotes, perform negotiations, meet internal margins for Intel and QCOM and articulate internally to SVPs and BOD the requirements. (80% time on internal sale).
Weekly demand planning input in CRM for 3 to 18 months and monthly strategy input to BOD.
Matrix managed sales peers around the world as well as the engineering resources to support the projects for customer and internal success.
STATS ChipPAC Inc (Outsourced Assembly and Test services for IDM and Fabless) 2003 – 2007
Global Sales Manager, IDM and Fabless accounts,
Collaborated with Qualcomm to drive to 65% market share (nearest comp at 20%) on assembly and test products, worked on New Products and JDA to give QCOM leading edge packaging in market, managed 5 different factories/ teams in 5 different Asian countries to support QCOM consistently and effectively.
Drove QCOM satisfaction/report cards from lowest score to highest score by managing all global issues and escalations real time, utilizing a very proactive internal team approach.
Set Global Account strategies and managed very large and complex accounts including Intel. Responsible for revenue growth, margins, and worked with customers at technical and business level to negotiate multi-year contracts, JDA’s, NDA’s, and Master Service Agreements.
Managed/created all quotes and did all price negotiations as well as maintaining CRM system.
Helped Qualcomm institute direct business model (18mo effort) with their OSATS by piloting the first success involving Procurement, Engineering, Finance, IT and QCOM consultants.
Motorola, Inc. Promoted to positions of greater responsibility in Semiconductors(20 years) 1984 - 2003
Division Program Controller and Strategy Director/Manager, Radio Products Division (2001 – 2003)
Managed and introduced NPI process for Wireless Divisions.
Integrated communication initiative between sales, marketing, engineering and customer to consolidate specs and projects and to maximize internal profit.
Led team to outsource wafer technology to companies in Taiwan, Israel and Singapore.
Negotiated supplier contracts and consistently obtained lowest possible pricing at lowest risk and commitment. Implemented non-disclosure agreements with new potential suppliers.
Business and Strategy Manager, Radio Products Division (1998 – 2001)
Drove 50% supplier discount for Motorola division.
Directed seamless wafer technology transfer from U.S. to China facility, doubled capacity. Reduced scrap 75%, vaulted division profits 20%.
Rapidly orchestrated complex supplier infrastructure to support $35M new business.
Acted as main liaison to internal organizations (manufacturing, planning and strategy).
Managed the QCOM Wafer/Assy/Test business for RF and PMIC products.
Product and Test Manager, Imaging and Storage Division (1995-1998)
Doubled product market share with customer HP and grew supplier rating from 1.6 to 3.6.
Won prestigious HP “Partnership Award”.
Managed P&L for $70M business in France, Hong Kong and Singapore.
Device Manager, OptoSensors Commodity Products Division (1992 – 1995)
Statistical process control champion for wafer fabrication facility that supplied Ford and GM, led a team of engineers, technicians and operators to increase yields and reduce cycle times. Collaborated with assembly factories, product teams& customer to resolve issues & meet federally mandated practices.
Managed wafer discrete semiconductors move from U.S. to France wafer plant.
Lived in Malaysia for a year to implement wafer device engineering in new sister wafer fab.
Device/Product Engineer, Small Signal Division (1989 – 1992)
Piloted a new engineering position combining device and product engineering.
Designed and engineered diverse types of transistors- small signal RF, HV, TMOS and JFET.
Early Career: Design, Device and Product Engineer for the Motorola’s Small Signals Division.
Education, Certification and Awards
Bachelor of Science, Electrical Engineering, Semiconductor Device Physics main focus, Arizona State University
Certified as Motorola Program Management Master and trained others.
Completed Motorola’s Advanced Leadership Academy(MBA).
Completed and trained others in Motorola Six Sigma Black Belt
Received #1 Supplier Award from Qualcomm, prestigious Partnership Award from Hewlett Packard, Pinnacle Award for outstanding contributions to Motorola Division, Advantest Customer Champion Awards, and Advantest Team Achievement Awards.
Highly recognized by the United Way as a leadership giver and volunteer.