Salt Lake Manufacturing Technician
Resume:
Marilyn Gipson
Herriman UT *4096
********@*****.***
Experience
L3Harris Technologies, Inc. 11/2015-03/2024
Salt Lake City, Utah
Manufacturing Technician C
Performed functions associated with manufacturing operations to build parts, sub-assemblies, and final assemblies.
Performed rework and quality testing to conduct on-line adjustments to products, instruments, or equipment.
Assisted engineers with set-up and de-bug tasks. Assisted in developing methods and procedures related to manufacturing processes.
Worked autonomously on assignments to resolve issues and make recommendations for solutions.
Mentored and trained peers and provided guidance on tasks.
Communicated with cross functional contacts on matters to obtain or provide information requiring explanation or interpretation to understand and reach agreement.
Worked to achieve operational targets that impact the overall achievement of results for the team.
L-3 Communications Narda West 7/2012-11/2015
Folsom, CA
Assembly Automation Specialist
Programed and operated F/K Auto Wedge Bonder for sub-assemblies.
L-3 Communications 4/2007 to 7/2012
Salt Lake City, Utah
Micro Lab Technician
Assembled IMM, MMW Hybrids, ARRAYS, SSPA GANS from start to finish
Epoxy die attach
1mil ball bond, .07mil wedge bond, ball and ribbon bond and gap welding
100% non-destruct pull test and performed environmental testing.
Integrated units, soldered connectors, laser welding and piece marking.
L-3 Communications Narda 2/2006-4/2007 West Folsom, CA
Circuit Assembler-Top level
Assembled circuits using die attach, wedge bond, gap welding and pull testing.
Pre cap and final inspection, paint prep and rework.
Endwave Corp. 2/2004-2/2006
Diamond springs, CA
Micro Assembler
Assembled circuits.
Eutectic soldering and epoxy die attach.
Wedge bonding, pull testing and in process inspection.
Cougar Component 3/2002 - 2/2004
Lakewood, Colorado
Lead Assembler/Trainer
Responsible for training assemblers on Eutectic Brazing Die attach, AuSn, AuGe, Epoxy die attach.
Westbond Thermosonic 0.8mil ball bonding, Thermo-compression 0.8mil wedge bonding.
Unitek Gap Welding 1x5mil, 1x20mil Au ribbons, Chocke attach etc.
Visual Workmanship inspection per MIL-STD 883.
Final Inspection and In-process inspection from internal & external customers.
Defect Data entry and Daily WIP status report.
AQL inspection, Pre-seal and mechanical assembly inspection.
Pre-test inspection per customer’s requirements.
Customer deliverables status and shipping finished goods.
Responsible for production flow and maintaining production priorities on the assy floors.
Responsible to adjust resistors to meet spec.
Auditor for Internal audits maintaining compliance with ISO 90002 requirements.
Endwave Corp. 10/1998-11/2001
Diamond Springs, CA
Manufacturing Engineering Process Technician
Responsible for technology transfer from TRW Space Park to Endwave implementing GaAs component process.
Became companywide instructor for visual workmanship criteria for GaAs IC inspection operation.
Developed and validated new manufacturing processes for assembly and MMIC inspection
Documented new procedures for duroid carrier material evaluations, bondability verification and bondability test using Royce 552 bond puller.
Qualified new suppliers’ material.
Microelectronic assembly operator using automated Palomar 2460 ball bonder, Palomar 2470-ribbon bonder, and Palomar 3500 component attach machine.
Material presentation for assembly.
TRW Automotive 8/1996-10/1998
Process Technician/Back End
Microwave Dynamics 2/1995-8/1996
Microwave Assembler
Hughes Aircraft 4/1990-1/1992
Microwave Assembler
TRW Space & Defense 10/87-4/1990
Lab Technician
Hughes Aircraft 3/1975-8/1984
Micro Assembler
Responsible for setting up the equipment processed silicon and glass wafers through the test and saw operations using the K&S 1100 wafer saw equipment, strip coating, and plasma ash.
Package and ship product in a cleanroom environment.
Assembled Microwave Hybrids and Isolators, kitted material, die attached using conductive and non-conductive epoxies, thermionic wire bonding and assembly integration.
Performed a complete hybrid assembly process this included ID die attach using Westbond pick & place, K&S ball & wedge bonder, operated Palomar 2460 automated bonder.
Performed a complete hybrid & LSI assembly saw & expanding wafers, eutectic die attach, die shear, x-ray, manual wire bonding using west bonder, bond pull preseal clean seal & gross leak test stabilization bake lead trim package for ship.
Complete R&D assembly of prototype hybrids for microwave amplifiers included die attach, thermosonic wire bond, thermo-compression bonding, gap weld ribbon bonding, final housing assembly.
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